公开(公告)号：US12215424B2

公开(公告)日：2025-02-04

申请号：US17280318

申请日：2019-09-10

Applicant: BYD COMPANY LIMITED

Inventor： Junlan Lian ,  Hongye Lin ,  Fan Chen ,  Weitu Li

IPC: C23C18/16 ,  B29C45/14 ,  B29K705/00 ,  B29L31/34 ,  C23C18/31

Abstract: A metal resin composite includes a metal substrate, a metal layer formed on a surface of the metal substrate, and a resin layer formed on the metal layer. A plurality of microcracks are formed at a surface of the metal layer.

公开(公告)号：US09502151B2

公开(公告)日：2016-11-22

申请号：US14606777

申请日：2015-01-27

Applicant: BYD COMPANY LIMITED

Inventor： Haibin Li ,  Wen Hu ,  Hongye Lin

IPC: H01B1/22 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K3/18 ,  C09D11/037 ,  C09D11/104 ,  C09D11/54 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  C09D11/52

CPC classification number: H01B1/22 ,  C09D11/037 ,  C09D11/104 ,  C09D11/52 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  H05K1/0298 ,  H05K1/092 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/032 ,  H05K2203/0709 ,  H05K2203/107

Abstract: An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.

Abstract translation: 提供油墨组合物和电路板及其制造方法。 油墨组合物包括：丙烯酸树脂; 环氧树脂; 聚酯树脂; 固化剂; 以及包含改性金属化合物的活性粉末，其中所述改性金属化合物的金属元素为选自Zn，Cr，Co，Cu，Mn，Mo和Ni中的至少一种。