公开(公告)号：EP3660894A1

公开(公告)日：2020-06-03

申请号：EP18839408.4

申请日：2018-06-29

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  LIU, Chengchen

IPC: H01L23/367 ,  H01L23/373

Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.

公开(公告)号：EP3660895A1

公开(公告)日：2020-06-03

申请号：EP18838105.7

申请日：2018-07-24

Applicant: BYD Company Limited

Inventor： LIU, Chengchen ,  XU, Qiang ,  LIN, Xinping

IPC: H01L23/373

Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body; the heat conductor is a ceramic-coated aluminum copper heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the ceramic-coated aluminum copper heat conductor includes a ceramic insulating plate, a copper layer, and a first aluminum layer and a second aluminum layer that are located on two opposite surfaces of the ceramic insulating plate, where the first aluminum layer and the second aluminum layer are isolated by the ceramic insulating plate, and the copper layer is bonded to the ceramic insulating plate by using the second aluminum layer that is integrally formed through aluminizing; the ceramic insulating plate is bonded to the aluminum silicon carbon heat dissipation body by using the first aluminum layer that is integrally formed through aluminizing; and the IGBT module includes the foregoing heat dissipation element.