公开(公告)号：US20130225770A1

公开(公告)日：2013-08-29

申请号：US13862665

申请日：2013-04-15

Applicant: Cheil Industries Inc.

Inventor： Seung Hyun JANG ,  Young Sub JIN ,  So Young KWON ,  Sang Kyun IM ,  Myung Ryul LEE ,  Bok Nam JANG ,  Yong Tae KIM

IPC: C08G69/26

CPC classification number: C08G69/26 ,  C08G69/265 ,  C08G69/42 ,  C08L77/06

Abstract: A polyamide resin is a polymer comprising (A) aliphatic diamine; and (B) dicarboxylic acid, wherein the (A) aliphatic diamine includes (a1) a first aliphatic diamine monomer including a C4, C6, C8 or C10 aliphatic diamine or a combination thereof, and (a2) a second aliphatic diamine monomer including a C12, C14, C16 or C18 aliphatic diamine or a combination thereof. The polymer can have good melt processability, low absorbency, and/or excellent brightness.

Abstract translation: 聚酰胺树脂是包含（A）脂肪族二胺的聚合物; 和（B）二羧酸，其中（A）脂肪族二胺包括（a1）包含C4，C6，C8或C10脂族二胺或其组合的第一脂族二胺单体，和（a2）第二脂族二胺单体， C12，C14，C16或C18脂族二胺或其组合。 聚合物可以具有良好的熔融加工性，低吸收性和/或优异的亮度。