公开(公告)号：WO2010009017A1

公开(公告)日：2010-01-21

申请号：PCT/US2009/050266

申请日：2009-07-10

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  WEAVER, John, D. ,  WU, Shaofu ,  HU, Yanli

Inventor： WEAVER, John, D. ,  WU, Shaofu ,  HU, Yanli

IPC: H01L31/048 ,  B32B17/06 ,  B32B27/32

CPC classification number: B32B17/06 ,  B32B17/10 ,  B32B17/10036 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/32 ,  B32B2255/10 ,  B32B2307/402 ,  B32B2307/412 ,  B32B2307/54 ,  B32B2307/702 ,  B32B2307/704 ,  B32B2307/744 ,  B32B2457/00 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T428/31612 ,  B32B2323/04

Abstract: Laminated structures comprising a (i) glass layer, (ii) first alkoxysilane-containing polyolefin (PO) layer, (iii) catalyst layer, and (iv) second alkoxysilane-containing polyolefin layer, each layer having opposing facial surfaces, are prepared by a method comprising the steps of applying in adhering contact: A. One facial surface of the first PO layer to one facial surface of the glass layer; B. The catalyst layer to the facial surface of the first PO layer opposite the facial surface of the first PO layer in adhering contact with the glass layer; and C. The second PO layer to the facial surface of the catalyst layer opposite the facial surface of the catalyst layer in adhering contact with the first PO layer.

Abstract translation: 包含（i）玻璃层，（ii）第一含烷氧基硅烷的聚烯烃（PO）层，（iii）催化剂层和（iv）具有相对的面部表面的每个层的第二烷氧基硅烷聚烯烃层的层压结构通过 一种包括以下步骤的方法：在粘合接触中应用：A.第一PO层的一个面部表面到玻璃层的一个面部表面; B.与第一PO层的与该玻璃层粘合接触的面向第一PO层的面表面的催化剂层; 和C.与第一PO层粘合接触的催化剂层的面向催化剂层的表面的第二PO层。

公开(公告)号：WO2008036707A3

公开(公告)日：2008-03-27

申请号：PCT/US2007/078845

申请日：2007-09-19

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  PATEL, Rajen, M. ,  WU, Shaofu ,  BERNIUS, Mark, T. ,  ESSEGHIR, Mohamed ,  MCGEE, Robert, L. ,  MAZOR, Michael, H. ,  NAUMOVITZ, John

Inventor： PATEL, Rajen, M. ,  WU, Shaofu ,  BERNIUS, Mark, T. ,  ESSEGHIR, Mohamed ,  MCGEE, Robert, L. ,  MAZOR, Michael, H. ,  NAUMOVITZ, John

IPC: H01L31/048 ,  H01L23/31

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0,90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

公开(公告)号：WO2006102155A3

公开(公告)日：2006-09-28

申请号：PCT/US2006/009857

申请日：2006-03-15

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  KAPUR, Miridula ,  DEMIRORS, Mehmet ,  WU, Shaofu ,  CHEUNG, Yunwa, Wilson ,  JAIN, Pradeep ,  FUCHS, David, Winn

Inventor： KAPUR, Miridula ,  DEMIRORS, Mehmet ,  WU, Shaofu ,  CHEUNG, Yunwa, Wilson ,  JAIN, Pradeep ,  FUCHS, David, Winn

IPC: C08F297/08 ,  C08F295/00 ,  C08F4/646

Abstract: Compositions having good impact performance can be made from a thermoplastic (e.g., a polyolefin such as polypropylene or HDPE) and an ethylene multi-block copolymer. The compositions are easily molded and often have particular utility in making, for example, automotive facia, parts and other household articles.

公开(公告)号：WO2008036708A2

公开(公告)日：2008-03-27

申请号：PCT/US2007/078846

申请日：2007-09-19

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  PATEL, Rajen, M. ,  WU, Shaofu ,  BERNIUS, Mark, T. ,  ESSEGHIR, Mohamed ,  MCGEE, Robert, L. ,  MAZOR, Michael, H. ,  NAUMOVITZ, John

Inventor： PATEL, Rajen, M. ,  WU, Shaofu ,  BERNIUS, Mark, T. ,  ESSEGHIR, Mohamed ,  MCGEE, Robert, L. ,  MAZOR, Michael, H. ,  NAUMOVITZ, John

IPC: H01L31/048 ,  C08L23/02 ,  H01B3/44 ,  C08L51/06

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95C, (d) an α-olefin content of at least about 15 and less than about 50 wt% based on the weight of the polymer, (e) a Tg of less than about -35C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract translation: 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料 其包含（1）具有以下中的至少一种的聚烯烃共聚物：（a）密度小于约0.90g / cc，（b）通过ASTM D-882测量的小于约150兆帕（mPa）的2％正割模量 （c）熔点低于约95℃，（d）基于聚合物重量，α-烯烃含量至少约15重量％且低于约50重量％，（e）Tg （f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的 联合代理。 通常，该聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地，聚合物材料可以进一步包含乙烯基硅烷和/或焦化抑制剂，并且该共聚物可以保持未交联或交联。

公开(公告)号：WO2008008496A2

公开(公告)日：2008-01-17

申请号：PCT/US2007/016009

申请日：2007-07-13

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  PYZIK, Aleksander, Jozef ,  NEWMAN, Robert, Alan ,  WILLIAMS, Alveda, J. ,  WU, Shaofu

Inventor： PYZIK, Aleksander, Jozef ,  NEWMAN, Robert, Alan ,  WILLIAMS, Alveda, J. ,  WU, Shaofu

CPC classification number: C04B35/65 ,  C04B35/185 ,  C04B38/0051 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00931 ,  C04B2235/3804 ,  C04B2235/3813 ,  C04B2235/3817 ,  C04B2235/3821 ,  C04B2235/402 ,  C04B2235/5436 ,  C04B2235/80 ,  C04B2235/96 ,  C22C1/1015 ,  C22C1/1036 ,  Y10T428/24149 ,  C04B41/4539 ,  C04B41/457 ,  C04B41/4574 ,  C04B41/5058 ,  C04B41/0072 ,  C04B41/507 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5155 ,  C04B38/0006

Abstract: A composite is formed by inserting a ceramic powder into a channel of a preform to form a ceramic powder filled preform. The ceramic powder has at least one reactive ceramic powder. The preform is a ceramic, ceramic-metal composite, metal or combination thereof that has walls that define a plurality of channels each channel having an opening at a surface of the preform. The ceramic powder filled preform is infiltrated with a molten metal to form the ceramic-metal body, which has at least one ceramic phase that is a reaction product of the reactive ceramic and molten infiltrated metal.

Abstract translation: 通过将陶瓷粉末插入预成型体的通道中以形成陶瓷粉末填充的预制件来形成复合材料。 陶瓷粉末具有至少一种反应性陶瓷粉末。 预制件是陶瓷，陶瓷 - 金属复合材料，金属或其组合，其具有限定多个通道的壁，每个通道在预成型体的表面具有开口。 陶瓷粉末填充的预制件被熔融金属渗透以形成陶瓷 - 金属体，其具有至少一个作为反应性陶瓷和熔融渗透金属的反应产物的陶瓷相。

公开(公告)号：WO2011163024A3

公开(公告)日：2011-12-29

申请号：PCT/US2011/040489

申请日：2011-06-15

Applicant: DOW GLOBAL TECHNOLOGIES, INC. ,  NAUMOVITZ, John, A. ,  PATEL, Rajen, M. ,  WU, Shaofu ,  NIEMANN, Debra, H.

Inventor： NAUMOVITZ, John, A. ,  PATEL, Rajen, M. ,  WU, Shaofu ,  NIEMANN, Debra, H.

IPC: B32B17/10 ,  H01L31/048

Abstract: An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, T m > in °C, and a heat of fusion, H f in J/g, as determined by DSC Crystallinity, where the numerical values of T m and H f correspond to the relationship: T m > (0.2143* H f ) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.

公开(公告)号：WO2009042602A1

公开(公告)日：2009-04-02

申请号：PCT/US2008/077387

申请日：2008-09-23

Applicant: DOW GLOBAL TECHNOLOGIES INC ,  WU, Shaofu ,  CHEUNG, Yunwa Wislon ,  GARCIA-MEITIN, Eddy Ignacio ,  BROWN, Walter Jeffrey

Inventor： WU, Shaofu ,  CHEUNG, Yunwa Wislon ,  GARCIA-MEITIN, Eddy Ignacio ,  BROWN, Walter Jeffrey

IPC: C08L23/08 ,  C08K3/00

CPC classification number: C08L23/0807 ,  C08K3/013 ,  C08L23/06 ,  C08L23/0815 ,  C08L23/10 ,  C08L2205/02 ,  C08L2666/06 ,  C08L2666/04

Abstract: Compositions having good impact performance can be made from a thermoplastic (e.g., a polyolefin such as polypropylene or HDPE) and an ethylene multi-block copolymer. The compositions are easily molded and often have particular utility in making, for example, automotive facia, parts and other household articles.

Abstract translation: 具有良好冲击性能的组合物可由热塑性塑料（例如，聚烯烃如聚丙烯或HDPE）和乙烯多嵌段共聚物制成。 组合物易于模塑，并且通常在制备例如汽车面漆，部件和其它家用制品中具有特别的用途。

公开(公告)号：WO2005066279A2

公开(公告)日：2005-07-21

申请号：PCT/US2004/043335

申请日：2004-12-24

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  CHEUNG, Yunwa, W. ,  HAHN, Stephen, F. ,  LIANG, Wenbin ,  PRIETO GOUBERT, Miguel, A. ,  WU, Shaofu

Inventor： CHEUNG, Yunwa, W. ,  HAHN, Stephen, F. ,  LIANG, Wenbin ,  PRIETO GOUBERT, Miguel, A. ,  WU, Shaofu

IPC: C08L101/00

CPC classification number: C08L23/0861 ,  C08J9/0061 ,  C08L101/00 ,  C08L2666/04

Abstract: The present invention is a crosslinkable, expandable polymeric composition comprising a free-radical crosslinkable polymer, a free-radical inducing species, a crosslinking-profile modifier, and a blowing agent. Preferably, the free-radical inducing species is a low temperature free-radical inducing species.

Abstract translation: 本发明是包含自由基可交联聚合物，自由基诱导物质，交联型调节剂和发泡剂的可交联的可发泡聚合物组合物。 优选地，自由基诱导物质是低温自由基诱导物种。

公开(公告)号：WO2005021622A2

公开(公告)日：2005-03-10

申请号：PCT/US2004/027593

申请日：2004-08-25

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  STRANDBURG, Gary, M. ,  VANSUMEREN, Mark, W. ,  WU, Shaofu ,  STOCKTON, Luther, E. ,  SPETH, David, R. ,  MONCLA, Brad, M. ,  KALINOWSKI, Matthew, J.

Inventor： STRANDBURG, Gary, M. ,  VANSUMEREN, Mark, W. ,  WU, Shaofu ,  STOCKTON, Luther, E. ,  SPETH, David, R. ,  MONCLA, Brad, M. ,  KALINOWSKI, Matthew, J.

IPC: C08J9/00

CPC classification number: C08J9/30 ,  A61L15/425 ,  C08J2205/05 ,  C08J2207/12 ,  C08J2300/14 ,  C08J2323/02 ,  C08J2323/16

Abstract: Aqueous-based, dispersed olefin polymers, froths, durable, open-cell foam compositions, structures and articles derived from same; methods for preparation of such froths and foams; and use of the dry durable foams in various applications are disclosed. Further described is use of the foams and structures and articles made of same in absorption, filtration, insulation, cushioning and backing applications , and in particular for odor removal, hygiene and medical applications due to, among other properties, good absorption capabilities, softness and/or flexibility of the foams and their recyclable nature.

Abstract translation: 基于水的，分散的烯烃聚合物，泡沫，耐用的开孔泡沫组合物，由其衍生的结构和制品; 制备这种泡沫和泡沫的方法; 并且公开了在各种应用中使用干燥耐久泡沫。 进一步描述的是在吸收，过滤，绝缘，缓冲和背衬应用中使用由它们制成的泡沫和结构物以及特别是除臭，卫生和医疗应用的泡沫和结构物以及由此产生的良好的吸收能力，柔软度和 /或泡沫的灵活性及其可回收性质。

公开(公告)号：WO2005017006A1

公开(公告)日：2005-02-24

申请号：PCT/US2004/026514

申请日：2004-08-13

Applicant: DOW GLOBAL TECHNOLOGIES INC. ,  LUTZ, William, G. ,  DONALD, Robert, J. ,  COURTER, David, M. ,  SPAULDING, Wesley, J. ,  SEHANOBISH, Kalyan ,  WU, Shaofu ,  SONNENSCHEIN, Mark, F. ,  DAMEN, Julien

Inventor： LUTZ, William, G. ,  DONALD, Robert, J. ,  COURTER, David, M. ,  SPAULDING, Wesley, J. ,  SEHANOBISH, Kalyan ,  WU, Shaofu ,  SONNENSCHEIN, Mark, F. ,  DAMEN, Julien

IPC: C08J5/12

CPC classification number: B29C66/1122 ,  B29C65/483 ,  B29C65/485 ,  B29C65/7829 ,  B29C66/1222 ,  B29C66/1224 ,  B29C66/5221 ,  B29C66/55 ,  B29C66/71 ,  B29C66/72321 ,  B29C66/73774 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/7394 ,  B29C66/73941 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2705/00 ,  B29L2023/22 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J2400/166 ,  C09J2400/226 ,  C09J2423/006 ,  F16L13/103 ,  B29K2023/04 ,  B29K2023/10 ,  B29K2025/04 ,  B29K2027/06 ,  B29K2055/02 ,  B29K2023/12 ,  B29K2023/06 ,  B29K2023/00

Abstract: A method to join pipe is disclosed using a curable one or two part adhesive composition comprising an effective amount of a boron containing initiator compound such as an organoborate, a stabilized organoborane complex, or combinations thereof; one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization; and optionally a decomplexing agent.

Abstract translation: 公开了使用可固化的一种或两种粘合剂组合物的方法，该组合物包含有效量的含硼引发剂化合物如有机硼酸盐，稳定的有机硼烷络合物或其组合; 具有能够通过自由基聚合聚合的烯属不饱和基团的一种或多种单体，低聚物，聚合物或其混合物; 和任选的解复配剂。