Abstract:
A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.
Abstract:
An enhanced smartcard reader having a row of first reading contacts, a row of second reading contacts, and a row of third reading contacts. The first reading contacts have arm portions that are cantilevered off a first mounting member of the reader, the second reading contacts have arm portions that are cantilevered off a second mounting member of the reader, and the third reading contacts have arm portions that are cantilevered off a third mounting member of the reader. The third mounting member is located vertically distanced from the second mounting member, and the arm portions of the third reading contacts directly overlay the arm portions of the second reading contacts.
Abstract:
An enhanced smartcard reader having a row of first reading contacts, a row of second reading contacts, and a row of third reading contacts. The first reading contacts have arm portions that are cantilevered off a first mounting member of the reader, the second reading contacts have arm portions that are cantilevered off a second mounting member of the reader, and the third reading contacts have arm portions that are cantilevered off a third mounting member of the reader. The third mounting member is located vertically distanced from the second mounting member, and the arm portions of the third reading contacts directly overlay the arm portions of the second reading contacts.