公开(公告)号：US10888031B2

公开(公告)日：2021-01-05

申请号：US15714811

申请日：2017-09-25

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Vincent W Michna

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/473 ,  H05K7/14 ,  H05K1/18 ,  G06F1/18 ,  G11C29/56 ,  G06F13/00 ,  G11C5/04

Abstract: An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.