Abstract:
A method of conveying the designer's intended electrical characteristics for a semiconductor design is provided by forming tolerance bands for a design layer of interest that take into consideration constraints from design layers that interact with and influence the features on the design layer of interest. The method determines regions, i.e. tolerance bands, within which the printed edges of features of the layer of interest will print within a predetermined criterion, and satisfy a variety of constraints, including, but not limited to, electrical, overlay and manufacturability constraints arising from the influence of features on other layers. The method may be implemented in a computer program product for execution on a computer system. The resulting tolerance bands can be used to efficiently convey the designer's intent to a lithographer, an OPC engineer or a mask manufacturer or tool.
Abstract:
PROBLEM TO BE SOLVED: To provide an effective OPC technique, using a hierarchical data structure for designing a high-density mask that requires coloring. SOLUTION: A mask layout that requires coloring, such as, alternating phase shift mask, double-exposure mask and double-exposure etching mask is organized into uncolored hierarchical design units. Each hierarchical design unit is colored locally. Then, OPC is performed on the locally colored hierarchical design unit; the local coloring information for the OPC-modified design unit is discarded; after OPC modification, the uncolored OPC-modified design unit is placed within the mask layout, and the flattened data are colored; turnaround time for mask design is improved significantly, since the need to perform OPC on flattened data is avoided, while less intensive global coloring is performed on flattened data. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for generating a mask pattern for alternating phase-shift mask lithography. SOLUTION: The method for generating patterns of a pair of photomasks from a data set defining a circuit layout to be realized on a substrate includes identifying critical segments of the circuit layout to be realized on the substrate. Block mask patterns are generated and then legalized based on the identified critical segments. Thereafter, phase mask patterns are generated, legalized and colored. The legalized block mask patterns and the legalized phase mask patterns that have been colored define features of a block mask and an alternating phase shift mask, respectively, for use in a dual exposure method for patterning features in a resist layer of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an improved method for designing an Levenson type phase shifting mask with which the phase shape collision within a design layout can be solved. SOLUTION: The method of designing the Lvenson type phase shifting mask for projecting an image of an integrated circuit design is provided. Phase units are binary colorable within each unit of the hierarchical circuit design, e.g., cell, an array, a net, or array of nets and/or cells. The assignment of phases or colors within a hierarchical unit will be correctly binary colored to satisfy the lithographic, manufacturability and other design rules, referred to collectively as coloring rules. During assembly with other units, the coloring of phases in a hierarchical unit may change (e.g., be reversed or flipped), but the correct binary colorability of a hierarchical unit is preserved, which simplifies assembly of the integrated circuit layout. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A method of designing an integrated circuit is provided in which the design layout is optimized using a process model (54) until the design constraints (11) are satisfied by the image contours (51) simulated by the process model (54). The process model (54) used in the design phase need not be as accurate as the lithographic model (61) used in preparing the lithographic mask layout during data prep. The resulting image contours (51) are then included with the modified, optimized design layout to the data prep process (60), in which the mask layout is optimized using the lithographic process model (61), for example, including RET and OPC. The mask layout optimization (60) matches the images simulated by the lithographic process model (61) with the image contours (51) generated during the design phase, which ensures that the design and manufacturability constraints specified by the designer are satisfied by the optimized mask layout (60).