MULTIDIMENSIONAL ELECTRIC PACKAGING ARRANGEMENT

    公开(公告)号:DE3368817D1

    公开(公告)日:1987-02-05

    申请号:DE3368817

    申请日:1983-04-20

    Applicant: IBM

    Abstract: The invention is a right angle connection utilizing an interposer rod (1) between horizontal (4) and vertical (3) substrates. The interposer rod is of insulating material and has a metal ground plane (7) on its surface, which ground plane is in turn covered by an insulating film (8). Over the insulating film, the interposer has a number of arcuate conductors to which respective conductors (2) of both the horizontal and vertical substrates are connected at controlled collapse pads (5, 6). This provides good electrical and mechanical connection. All circuits are effectively transmission lines because the underlying ground plane is continuous.

    3.
    发明专利
    未知

    公开(公告)号:DE3481141D1

    公开(公告)日:1990-03-01

    申请号:DE3481141

    申请日:1984-11-30

    Applicant: IBM

    Abstract: A miniature, fully integrated susceptometer capable of measuring the magnetic properties of very small samples (

Patent Agency Ranking