Apparatus for positioning and bonding
    1.
    发明授权
    Apparatus for positioning and bonding 失效
    用于定位和绑定的装置

    公开(公告)号:US3628717A

    公开(公告)日:1971-12-21

    申请号:US3628717D

    申请日:1969-11-12

    Applicant: IBM

    CPC classification number: H01L21/67144 H01L2924/01322

    Abstract: This patent discloses a method and apparatus for aligning and joining a semiconductor chip to a substrate or carrier. The apparatus for first aligning and then bonding the chip to a substrate comprises a first system which includes first alignment means, immediately below the alignment means there being a substrate receiving means which is movable so as to permit alignment of the substrate in a predetermined position relative to the first alignment means. A second system cooperates with the first system and includes a vacuum-operated chip receiver. The first system is then moved until the chip is superimposed of the substrate and means are provided to press the chip into contact with the substrate. A heater located in the substrate receiving means heats the substrate and while the chip is being held against the substrate the substrate receiving means is rotated arcuately, the substrate bearing against the chip and causing a scrubbing action to inhibit the presence of voids in the bond interface.

    Vacuum chuck
    2.
    发明授权

    公开(公告)号:US3572736A

    公开(公告)日:1971-03-30

    申请号:US3572736D

    申请日:1969-06-19

    Applicant: IBM

    Abstract: This patent discloses a vacuum operated chuck for clamping small workpieces such as integrated circuit chips. The chuck includes a housing having hingeably connected jaws, the jaws being biased apart or in the open position as by a biasing hinge. A chamber is located in the jaws and at the lower portion thereof is a workpiece receiver dimensioned for registration with a workpiece. At the upper portion of the housing is window means which is positioned to permit viewing of the receiver and thus the inwardly facing portion of any workpiece held thereby. The chamber is connected through a conduit to a vacuum supply which causes pivotal action of the jaws permitting the receiver to grasp the workpiece when it overlies the workpiece and is in registry therewith.

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