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公开(公告)号：HK1029660A1
公开(公告)日：2001-04-06
申请号：HK01100424
申请日：2001-01-16
Applicant: IBM
Inventor： DIBBLE ERIC P , JOHNSON ERIC A , PHILLIPS RAYMOND A JR
IPC: H01L21/58 , H01L21/60 , H01L23/36 , H01L23/373 , H01L
Abstract: An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.
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