公开(公告)号：KR20100138742A

公开(公告)日：2010-12-31

申请号：KR20100046967

申请日：2010-05-19

Applicant: IBM

Inventor： JADHAV VIRENDRA R ,  SIKKA KAMAL KUMAR ,  ZHENG JIANTAO

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3735 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83951

Abstract: PURPOSE: A semiconductor device assembly having a stress-relieving buffer layer is provided to prevent the slitting phenomenon of the heat transfer material by removing the increasing factors of concentration force between a buffer layer and a heat discharge apparatus. CONSTITUTION: A semiconductor device(114) is mounted on a chip carrier substrate(112). The semiconductor device is electrically connected with a solder ball(116) to the substrate. An underfill material(118) is formed on the lower part of the semiconductor device. A heat radiator(120) comprises a leg(122) fixed with the adhesive to the substrate.

Abstract translation: 目的：提供一种具有应力消除缓冲层的半导体器件组件，通过消除缓冲层和放热装置之间的浓度增加因素来防止传热材料的切割现象。 构成：半导体器件（114）安装在芯片载体衬底（112）上。 半导体器件与焊料球（116）电连接到衬底。 在半导体器件的下部形成有底部填充材料（118）。 散热器（120）包括用粘合剂固定到基底上的腿部（122）。