公开(公告)号：DE3580314D1

公开(公告)日：1990-12-06

申请号：DE3580314

申请日：1985-06-24

Applicant: IBM

Inventor： PRASAD CHANDRIKA ,  SZEWCZYK ANDREW FRANCIS

IPC: H01L23/50 ,  B23K35/30 ,  H01L21/60 ,  H01L23/12 ,  H01R43/02 ,  H05K3/34

Abstract: A process for bonding a current carrying element (10) to a dielectric substrate (12) having a solder wettable pad (14) of a predetermined diameter, wherein an element (16) is provided having a bonding surface with a dimension that is smaller than the pad and a brazing material (20) that includes Ag and Cu and either In and/or Sn. The brazing material exhibits a mushy zone over a predetermined temperature; it is placed between the element and pad and heated to a temperature to cause the material to be mushy while a pressure is applied to the element to compress the material.