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公开(公告)号：DE3269232D1
公开(公告)日：1986-03-27
申请号：DE3269232
申请日：1982-11-11
Applicant: IBM
Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.
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公开(公告)号：GB2109817B
公开(公告)日：1985-07-03
申请号：GB8134779
申请日：1981-11-18
Applicant: IBM
Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.
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3.发明专利
公开(公告)号：IN153802B
公开(公告)日：1984-08-18
申请号：IN699DE1979
申请日：1979-10-03
Applicant: IBM
Inventor： BARCLAY DONALD JOHN , VIGAR JAMES MICHAEL LINFORD
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公开(公告)号：DK151975C
公开(公告)日：1988-06-06
申请号：DK475879
申请日：1979-11-09
Applicant: IBM
Inventor： BARCLAY DONALD JOHN , VIGAR JAMES MICHAEL LINFORD
Abstract: A very low concentration (below 0.03 M) trivalent chromium plating bath in which the source of chromium is an equilibrated aqueous solution of a chromium (III) - thiocyanate complex gives a deposit of unexpectedly light color. Such a bath is employed to produce thin overcoatings of light colored chromium for decorative applications. The bath and process is also used to plate the initial layer of a thick (greater than 5 micron) deposit for engineering applications, the major part of which is plated from a higher chromium concentration bath. Such thick deposits from a higher concentration bath are more cohesive and smoother when plated over an initial layer from the low concentration bath.
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Patent Agency Ranking
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公开(公告)号：MX153062A
公开(公告)日：1986-07-24
申请号：MX18241680
申请日：1980-05-21
Applicant: IBM
Inventor： VIGAR JAMES MICHAEL LINFORD
IPC: C25D3/06
Abstract: A process for plating thick chromium coatings for engineering applications comprises depositing a thin initial layer from a low concentration chromium III/thiocyanate bath and depositing the bulk of the remaining thickness from a relatively higher concentration chromium III/thiocyanate bath. Deposits produced by this two-stage process are more cohesive and smoother than those obtainable by plating the entire thickness from the high concentration bath alone.
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公开(公告)号：AT15239T
公开(公告)日：1985-09-15
申请号：AT82306020
申请日：1982-11-11
Applicant: IBM
Abstract: A chromium electroplating electrolyte containing trivalent chromium ions, a complexant, a buffer agent and thiocyanate ions for promoting chromium deposition, the thiocyanate having a molar concentration lower than that of the chromium ions. The chromium preferably has a concentration lower than 0.01M. Preferably the complexant is selected so that the stability constant K1 of chromium complex is in the range 10 M . Complexants in this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid and 5-sulphosalicylic acid.
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公开(公告)号：DE3163806D1
公开(公告)日：1984-07-05
申请号：DE3163806
申请日：1981-02-16
Applicant: IBM
Inventor： BARCLAY DONALD JOHN , VIGAR JAMES MICHAEL LINFORD
IPC: C25D3/06
Abstract: A chromium electroplating solution in which the source of chromium comprises an equilibrated aqueous solution of chromium (III) - thiocyanate complexes having supporting electrolyte consisting essentially of potassium sulphate or, preferably, a mixture of potassium and sodium sulphates. The solution is employed as the catholyte in a plating bath in which the catholyte and anolyte are separated by a cation exchange membrane. This all-sulphate bath permits the use of lead anodes, has high efficiency and a good plating range.
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