公开(公告)号：WO2013036660A2

公开(公告)日：2013-03-14

申请号：PCT/US2012053990

申请日：2012-09-06

Applicant: KLA TENCOR CORP ,  DOYLE PAUL ,  BELYAEV ALEXANDER

Inventor： DOYLE PAUL ,  BELYAEV ALEXANDER

IPC: H01L21/66

CPC classification number: G02B7/008 ,  G01N21/9501 ,  G01N2201/021 ,  H01L21/67103 ,  H01L21/68792 ,  Y10T403/21

Abstract: Disclosed herein is an apparatus for providing passive correction for thermal effects on a mounted mechanical component. Further disclosed is a wafer inspection system employing the passive thermal effect correction apparatus.

Abstract translation: 本文公开了一种用于对安装的机械部件上的热效应提供被动校正的装置。 还公开了采用被动热效应校正装置的晶片检查系统。

公开(公告)号：EP2754171A4

公开(公告)日：2015-05-06

申请号：EP12830504

申请日：2012-09-06

Applicant: KLA TENCOR CORP

Inventor： DOYLE PAUL ,  BELYAEV ALEXANDER

IPC: H01L21/687 ,  G01N21/95 ,  G02B7/00 ,  H01L21/67

CPC classification number: G02B7/008 ,  G01N21/9501 ,  G01N2201/021 ,  H01L21/67103 ,  H01L21/68792 ,  Y10T403/21

公开(公告)号：WO2013022713A2

公开(公告)日：2013-02-14

申请号：PCT/US2012049369

申请日：2012-08-02

Applicant: KLA TENCOR CORP ,  KREN GEORGE ,  DOYLE PAUL ,  BELYAEV ALEXANDER

Inventor： KREN GEORGE ,  DOYLE PAUL ,  BELYAEV ALEXANDER

IPC: H01L21/687 ,  H01L21/66

CPC classification number: H01L21/68735 ,  Y10T279/11 ,  Y10T279/21 ,  Y10T279/34

Abstract: The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.

Abstract translation: 本发明涉及一种用于半导体晶片检查系统的高速纺丝卡盘。 本公开的卡盘配置有减少湍流的唇部。 卡盘的旋转产生靠近晶片表面并靠近卡盘底部的径向气流。 本公开的卡盘的减少湍流的唇部以使得在这些径向气流之间形成的低压区域的尺寸最小化的方式引导径向气流离开晶片的顶表面和卡盘的底表面。 低压区域的最小化减小了卡盘和基板周边的空气湍流，从而降低了系统中的污染物通过这种空气湍流被引导到基板的表面上的可能性。

公开(公告)号：WO2009151984A3

公开(公告)日：2010-03-18

申请号：PCT/US2009045704

申请日：2009-05-29

Applicant: KLA TENCOR CORP ,  DOYLE PAUL ,  ZHAO GUOHENG ,  BELYAEV ALEXANDER ,  RUNYON J REX

Inventor： DOYLE PAUL ,  ZHAO GUOHENG ,  BELYAEV ALEXANDER ,  RUNYON J REX

IPC: H01L21/66

CPC classification number: H01L21/6838

Abstract: A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

Abstract translation: 一种用于调查基板的工具，其中该工具具有用于检查基板的工具头，用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源，其中真空源将基板拉向空气轴承，并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作，将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分，基板相对于基板的上表面而不是基板的背面完成对准工具头。