公开(公告)号：JP2009184100A

公开(公告)日：2009-08-20

申请号：JP2008083396

申请日：2008-03-27

Applicant: Denshi Buhin Kenkyuin ,  電子部品研究院Korea Electronics Technology Institute

Inventor： PARK KWANG BUM ,  PARK JOON SHIK ,  PARK HYO DERK

IPC: B25J7/00 ,  B25J15/08

CPC classification number: B25J7/00 ,  B25J13/085 ,  B25J15/12

Abstract: PROBLEM TO BE SOLVED: To provide a gripper capable of gripping various fine bodies without the risk of applying a high volt and heat to an object, and to provide a drive method used for the same.
SOLUTION: When a piezoelectric driving part 250 is extended/contracted, contact parts 230, 240 are correspondingly moved. When the contact parts are moved, links 131, 132 push and pull arms 111, 112 and nippers 151, 152 through bending structures 210, 220, and accordingly the leading ends of the nippers 151, 152 are opened and closed to grip the fine body.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够夹持各种精细体的夹具，而不会对物体施加高电压和高温，并提供用于其的驱动方法。 解决方案：当压电驱动部件250伸缩时，接触部件230,240被相应地移动。 当接触部分移动时，连杆131,132通过弯曲结构210,220推动和拉动臂111,112和钳子151,152，因此，钳子151,152的前端被打开和关闭以夹紧细体 。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：GB2391384A

公开(公告)日：2004-02-04

申请号：GB0217172

申请日：2002-07-24

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： PARK JOON SHIK ,  PARK HYO DERK ,  PARK KWANG BUM

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  H01L21/306

Abstract: A method of removing a sacrificial portion of a functional micro device involves forming a functional film (23) on a silicon wafer (20), forming a protective layer (25) on the functional film (23), etching the functional film (23) to open a portion of the silicon wafer (20), and etching the silicon wafer (20) by introducing XeF2 gas sublimed from a solid state into the opened portion of the silicon wafer (20). The protective film (25) may be silicon dioxide, photoresist or metal. The functional film (23) may be a micro acceleration sensor, a micro infrared sensor, a micro optical sensor or a micro-piezoelectric cantilever. When used as a piezoelectric film, the PZT film (23) may be sandwiched between a lower electrode (22) of Ti and Pt and an upper electrode (24) of Pt.

公开(公告)号：KR20180024139A

公开(公告)日：2018-03-08

申请号：KR20160109766

申请日：2016-08-29

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： PARK JOON SHIK ,  PARK KWANG BUM

IPC: G01N27/12 ,  G01N25/32 ,  G01N27/18

CPC classification number: G01N25/32 ,  G01N27/12 ,  G01N27/18

Abstract: 마이크로가스센서및 마이크로가스센서모듈이개시된다. 마이크로가스센서는기판, 제1 멤브레인과제2 멤브레인, 히터전극패턴과온도센서패턴, 절연막, 감지전극패턴및 감지막을포함한다. 따라서, 본발명에의하면, 마이크로가스센서가최적의감도를유지하도록할 수있다.

Abstract translation: 微型气体传感器和微型气体传感器模块被公开。 所公开的微型气体传感器包括基板，第一膜，第二膜，加热器电极图案，温度传感器图案，绝缘膜，感测电极图案和感测膜。 因此，根据本发明，微型气体传感器可以被配置为保持最佳灵敏度。