公开(公告)号：JPH07326657A

公开(公告)日：1995-12-12

申请号：JP30509794

申请日：1994-12-08

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： RI KIYOUNSHIYUU

IPC: B65D85/86 ,  H01L21/205 ,  H01L21/22 ,  H01L21/673 ,  H01L21/68

Abstract: PURPOSE: To provide a cassette for mounting a wafer in a semiconductor device manufacturing apparatus capable of inserting various sizes of wafers within a predetermined range without limitation of the size of the wafer. CONSTITUTION: A conventional cassette for mounting a wafer suffers from a trouble where when wafers of different sizes are treated, all tools in a manufacturing apparatus must be replaced. The wafer is constructed with at least two or more of suspension boards having an end flange 11 being a plurality of wafer reception stepped end surfaces and fixing means of the suspension board for supporting the suspension board 10.

公开(公告)号：JPH07321037A

公开(公告)日：1995-12-08

申请号：JP30509694

申请日：1994-12-08

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： RI KIYOUNSHIYUU

IPC: C30B33/00 ,  H01L21/203 ,  H01L21/324

Abstract: PURPOSE: To speed up cooling after heat treatment, and reduce crystal defect of formed semiconductor, by constituting a gas pipe which is connected with a reaction pipe and supplies gas, in such a manner that gas can be supplied by passing a gas cooling equipment cooled by other refrigerant. CONSTITUTION: A gas cooling equipment 20 is additionally installed outside a gas pipe 30 which supplies gas to a reaction pipe 10 heated by a lamp 11. The gas pipe 30 passing the gas cooling equipment 20 is constitutes as a spring form, in order to improve heat exchange efficiency by increasing contact chance with refrigerant. When the temperature of the reaction pipe 10 begins to decrease, valves 22, 24 of a refrigerant inlet 21 and a refrigerant outlet 23 of the gas cooling equipment 20 are opened at the same time, and the refrigerant is injected and supplied. Thereby the gas which passes the gas cooling equipment 20 and is made to flow in the reaction pipe 10 is cooled, so that semiconductor is more rapidly cooled in the reaction pipe 10.