公开(公告)号：US20240372047A1

公开(公告)日：2024-11-07

申请号：US18285792

申请日：2021-04-06

Applicant: LG ELECTRONICS INC.

Inventor： Naree KIM ,  Kiseok KIM ,  Dongkyu LEE ,  Jeongsik CHOI ,  Sangtae PARK

IPC: H01L33/58 ,  G09F9/302 ,  H01L25/075 ,  H01L27/15 ,  H01L33/62

Abstract: Disclosed is a display device. The display device may include: a display panel; and a module cover to which the display panel is coupled, wherein the display panel may include: a flat substrate; a plurality of electrode pads formed on the substrate; a plurality of light emitting elements mounted on each of the plurality of electrode pads; an optical layer covering the plurality of light emitting elements, and formed on the substrate; and a plurality of fillers formed of a spherical particle, and distributed inside the optical layer, wherein 75 to 80 percent of the plurality of fillers may have a diameter of 2 to 16 micrometers, and a weight ratio of the plurality of fillers compared to the optical layer may be 15 to 23 percent.

公开(公告)号：US20220069002A1

公开(公告)日：2022-03-03

申请号：US17412719

申请日：2021-08-26

Applicant: LG ELECTRONICS INC.

Inventor： Dongjin YOON ,  Jeongsik CHOI ,  Sangtae PARK ,  Inbeom HA ,  Kiseok KIM

IPC: H01L27/15 ,  H01L51/52 ,  H01L33/44

Abstract: Disclosed is a display device including a base substrate including a circuit wiring, a semiconductor light emitting element connected to the circuit wiring and emitting light in response to an applied voltage, an envelope layer sealing the semiconductor light emitting element, a transparent protective film stacked on the envelope layer and having flexibility, and a black dye layer coated on the transparent protective film and having a preset transmissivity.

公开(公告)号：US20230207750A1

公开(公告)日：2023-06-29

申请号：US17996105

申请日：2020-04-13

Applicant: LG ELECTRONICS INC.

Inventor： Dongjin YOON ,  Jeongsik CHOI ,  Sangtae PARK ,  Younhwan SHIN ,  Kiseok KIM

IPC: H01L33/54 ,  H01L25/075

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L2933/005

Abstract: Display device according to an embodiment of the present invention includes a substrate, a plurality of semiconductor light emitting devices formed on the upper surface of the substrate, and a coating layer formed on the substrate. The coating layer includes an encapsulation layer formed at a predetermined height from the upper surface of the substrate and covering the plurality of semiconductor light emitting devices, and a film layer formed on the upper surface of the encapsulation layer. A polishing pattern is formed on the upper surface of the encapsulation layer.