-
1.
公开(公告)号:JP2001094285A
公开(公告)日:2001-04-06
申请号:JP2000275867
申请日:2000-09-12
Applicant: LUCENT TECHNOLOGIES INC
Inventor: MANDELCORN YEHOSHUA , BUSKMILLER MICHAEL R , BYRNE VINCENT M , FONTANA EDWARD CLARK , DANIEL MARK COLIDES
Abstract: PROBLEM TO BE SOLVED: To provide an EMI(electromagnetic interference) module cover by which EMI is reduced. SOLUTION: In the EMI cover, conductive side panels have elastic canti-levers formed from them and each of the canti-levers has a fixed end formed as part of the side panel and a free end without modular coupler. By this constitution, when the module is to be mounted on the chassis, the elastic canti-levers can be bent. The elastic canti-lever part has bosses near the movable free end. The bosses protrude from the side panel toward the outside by an enough length for providing a conductive pass between the conductive surfaces which are adjacent to the side panels when the module is mounted on the chassis.
-
公开(公告)号:JP2001077573A
公开(公告)日:2001-03-23
申请号:JP2000239397
申请日:2000-08-08
Applicant: LUCENT TECHNOLOGIES INC
IPC: H05K9/00
Abstract: PROBLEM TO BE SOLVED: To provide a device provided with a conduit adopted to the chassis of such an electronic device that reduces the EMI radiation of an electronic module. SOLUTION: An electromagnetic buffer cover has a module support member 10 which houses an electronic module 25, and a conduit 20 containing an electric conductor near the support member 10, and is used together with the chassis of an electronic device. The cover is composed of a conductive body which has a base panel and first and second side panels extended from the base panel and faced oppositely to each other and is adaptive to the conduit, and a boss which is in contact with the conductive case of the electronic module 25. The boss establishes a common potential between the conduit 20 and module 25 by forming a conductive path between the conduit 20 and module 25 and reduces the electromagnetic radiation from the module 25.
-