METALLIC MICRONEEDLES
    1.
    发明专利

    公开(公告)号:CA2914539A1

    公开(公告)日:2014-12-18

    申请号:CA2914539

    申请日:2014-06-12

    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

    METHODS AND APPARATUS FOR MICRONEEDLE INSERTION INTO TISSUE

    公开(公告)号:CA3078815A1

    公开(公告)日:2019-04-25

    申请号:CA3078815

    申请日:2018-10-17

    Abstract: An apparatus for inserting a microneedle into tissue. The apparatus comprises microneedle supported by a backing to move therewith and a forcer that is selectably operable between a retracted state and an extended state. Upon operation of the forcer from the retracted state to the extended state, the forcer applies force to the backing which causes the backing to travel in an insertion direction toward the tissue. A releasable locking mechanism which, in a locking state, permits one-way motion of the backing in the insertion direction toward the tissue and lockingly engages the backing to prevent motion of the backing in a reverse direction opposed to the insertion direction, the releasable locking mechanism releasable, to a released state, which permits motion of the backing in the reverse direction. The forcer is disengaged from the backing when the locking mechanism lockingly engages the backing.

    METALLIC MICRONEEDLES
    5.
    发明专利

    公开(公告)号:CA2914539C

    公开(公告)日:2016-11-01

    申请号:CA2914539

    申请日:2014-06-12

    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

    METALLIC MICRONEEDLES
    6.
    发明公开
    METALLIC MICRONEEDLES 审中-公开
    METALLISCHE MIKRONADELN

    公开(公告)号:EP3007841A4

    公开(公告)日:2017-02-22

    申请号:EP14811447

    申请日:2014-06-12

    Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

    Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模柱; 在模柱上形成有孔导电层; 以及在导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模柱; 在模柱上沉积第一金属层以提供第一微针; 从模柱移除第一微针; 以及在模柱上沉积第二金属层以提供第二微针。

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