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公开(公告)号:CA2914539A1
公开(公告)日:2014-12-18
申请号:CA2914539
申请日:2014-06-12
Applicant: MICRODERMICS INC
Inventor: STOEBER BORIS , MANSOOR IMAN , HAFELI URS OTTO
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
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公开(公告)号:CA3078815A1
公开(公告)日:2019-04-25
申请号:CA3078815
申请日:2018-10-17
Applicant: MICRODERMICS INC
Inventor: MANSOOR IMAN , RANAMUKHAARACHCHI SAHAN ANUPAMA , STOEBER BORIS , RAEISZADEH MEHRSA
Abstract: An apparatus for inserting a microneedle into tissue. The apparatus comprises microneedle supported by a backing to move therewith and a forcer that is selectably operable between a retracted state and an extended state. Upon operation of the forcer from the retracted state to the extended state, the forcer applies force to the backing which causes the backing to travel in an insertion direction toward the tissue. A releasable locking mechanism which, in a locking state, permits one-way motion of the backing in the insertion direction toward the tissue and lockingly engages the backing to prevent motion of the backing in a reverse direction opposed to the insertion direction, the releasable locking mechanism releasable, to a released state, which permits motion of the backing in the reverse direction. The forcer is disengaged from the backing when the locking mechanism lockingly engages the backing.
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公开(公告)号:HK1218098A1
公开(公告)日:2017-02-03
申请号:HK16106118
申请日:2016-05-30
Applicant: MICRODERMICS INC
Inventor: STOEBER BORIS , MANSOOR IMAN , HFELI URS OTTO
IPC: B22D20060101 , A61M20060101 , B21G20060101
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公开(公告)号:CA3057370A1
公开(公告)日:2018-09-27
申请号:CA3057370
申请日:2018-03-13
Applicant: MICRODERMICS INC
Inventor: MANSOOR IMAN , RANAMUKHAARACHCHI SAHAN ANUPAMA , RAEISZADEH MEHRSA , STOEBER BORIS
Abstract: Methods and apparatus for supporting microneedles are provided. The apparatus includes a plurality of pedestals extending away from a base and transversely spaced- apart from each other by inter-pedestal volumes. Each of the pedestals has a transversely extending contact surface. For each of the pedestals, one or more microneedles extend from the contact surface of the pedestal.
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公开(公告)号:CA2914539C
公开(公告)日:2016-11-01
申请号:CA2914539
申请日:2014-06-12
Applicant: MICRODERMICS INC
Inventor: STOEBER BORIS , MANSOOR IMAN , HAFELI URS OTTO
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
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公开(公告)号:EP3007841A4
公开(公告)日:2017-02-22
申请号:EP14811447
申请日:2014-06-12
Applicant: MICRODERMICS INC
Inventor: STOEBER BORIS , MANSOOR IMAN , HÄFELI URS OTTO
CPC classification number: A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B05D1/36 , B05D2201/06 , B21G1/00 , B81C1/00111
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模柱; 在模柱上形成有孔导电层; 以及在导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模柱; 在模柱上沉积第一金属层以提供第一微针; 从模柱移除第一微针; 以及在模柱上沉积第二金属层以提供第二微针。
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