公开(公告)号：US09947604B2

公开(公告)日：2018-04-17

申请号：US15038939

申请日：2014-11-28

Applicant: NAMICS CORPORATION

Inventor： Kazuyuki Kohara ,  Tomoya Yamazawa ,  Kodai Okoshi ,  Nobuyuki Abe

IPC: H01L23/29 ,  C09J163/00 ,  B32B27/38 ,  C08K3/36 ,  C08L63/00 ,  C08G59/24 ,  C08G59/50 ,  H01L23/00

CPC classification number: H01L23/295 ,  C08G59/245 ,  C08G59/50 ,  C08K3/36 ,  C08K9/06 ,  C08K2201/014 ,  C08L63/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.

公开(公告)号：US10196513B2

公开(公告)日：2019-02-05

申请号：US15039231

申请日：2014-11-28

Applicant: NAMICS CORPORATION

Inventor： Tomoya Yamazawa ,  Kazuyuki Kohara ,  Kodai Okoshi ,  Nobuyuki Abe

IPC: C08L63/00 ,  C08G59/40 ,  H01L23/29 ,  H01L23/00 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08G59/62 ,  H01L23/31 ,  H01L21/56

Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.