公开(公告)号：US20230042359A1

公开(公告)日：2023-02-09

申请号：US17786282

申请日：2020-12-04

Applicant: NAMICS CORPORATION

Inventor： Takashi YONEDA ,  Yoshitaka KAMATA ,  Noriyuki SAKAI ,  Hironobu TSUBURA ,  Satomi KAWAMOTO ,  Yoshito YAMADA

IPC: H01B1/22 ,  H05K9/00

Abstract: An electromagnetic shielding composition includes silver particles (A), and a first solvent (B). The first solvent (B) has at least one structure selected from the group consisting of a structure represented by the formula (1) and a structure represented by the formula (2) and has a boiling point of less than 200° C.

公开(公告)号：US20180016479A1

公开(公告)日：2018-01-18

申请号：US15545929

申请日：2016-01-12

Applicant: NAMICS Corporation

Inventor： Satomi KAWAMOTO ,  Yoshihide FUKUHARA ,  Hiromi SONE ,  Atsushi SAITO ,  Toyokazu HOTCHI

IPC: C09J163/04 ,  C09J11/06 ,  C08K3/36 ,  C08K5/3445 ,  C08K5/3437 ,  C09J11/04 ,  C09J7/00

CPC classification number: C09J163/04 ,  C08K3/36 ,  C08K5/3437 ,  C08K5/3445 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  C09J109/02 ,  C09J161/04 ,  C09J163/00 ,  C09J171/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2423/00 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L2224/83101

Abstract: Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.