公开(公告)号：WO9119023A3

公开(公告)日：1992-06-25

申请号：PCT/US9103611

申请日：1991-05-23

Applicant: SAVIN CORP

Inventor： SHER ARDEN ,  SABO KAREN ,  BRODIE IVOR ,  SPINDT CHARLES A

IPC: G01K1/02 ,  H01J9/02 ,  H01L21/225 ,  H01L21/314 ,  H01L21/324 ,  H01L21/768 ,  C25D

CPC classification number: H01L21/3245 ,  G01K1/026 ,  H01J9/025 ,  H01J2201/30403 ,  H01J2201/319 ,  H01L21/2255 ,  H01L21/314 ,  H01L21/768

Abstract: This invention relates to a method or forming and using a very dense layer of particles that have been encapsulated in a thermoplastic polymer binder and electrically deposited on a substrate. Space-charge-limited deposition is made possible by the addition of novel charge directors that are essentially nonconductive in aliphatic hydrocarbon liquid in the absence of binder. The particle layer can be designed to possess numerous characteristics by varying the particles to be encapsulated. Many structures can be fabricated from the different particle layers including thermal detectors, electrical interconnects, p-n junctions, micro-metallic structures, field-emitting devices, and optical coatings. A technique for the removal of semiconductor dislocations is also discussed.