中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.037 seconds)

    COPPER PLATING SOLUTION AND METHOD FOR PREPARING THE SAME
    1.
    发明申请
    COPPER PLATING SOLUTION AND METHOD FOR PREPARING THE SAME 审中-公开
    铜镀层解决方案及其制备方法

    公开(公告)号：WO2013174257A1

    公开(公告)日：2013-11-28

    申请号：PCT/CN2013/076043

    申请日：2013-05-22

    Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

    Inventor： WEI, Jialiang

    IPC: C23C18/40

    CPC classification number: C23C18/405 ,  C23C18/40 ,  C23C18/54

    Abstract: A copper plating solution and a method for preparing a copper plating solution are provided. The copper plating solution comprises: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate.

    Abstract translation: 提供了一种镀铜溶液和一种制备镀铜溶液的方法。 镀铜溶液包括：铜盐，络合剂，稳定剂，还原剂，表面活性剂，羟基封端的聚氧丙烯醚和三硫化硫 - 异硫脲 - 丙烷磺酸钠。

    METHOD FOR EXTRACTING LITHIUM FROM SALT LAKE
    3.
    发明公开
    METHOD FOR EXTRACTING LITHIUM FROM SALT LAKE 审中-实审

    公开(公告)号：EP4394063A1

    公开(公告)日：2024-07-03

    申请号：EP22914047.0

    申请日：2022-12-05

    Applicant: BYD Company Limited

    Inventor： WEI, Jialiang ,  LIN, Hongye ,  LIAN, Junlan

    IPC: C22B26/12 ,  C22B7/00 ,  C02F1/28 ,  C02F101/10

    CPC classification number: Y02P10/20 ,  C22B26/12 ,  C22B3/24

    Abstract: A method for extracting lithium from salt lake includes the following steps. The salt lake brine is flowed through a lithium adsorbent at a varying rate, to allow the lithium ions in the salt lake brine to be adsorbed on the lithium adsorbent, to obtain a lithium-rich adsorbent. During the adsorption process, the flow rate of the salt lake brine gradually decreases, and the difference between the initial flow rate and the final flow rate of the salt lake brine is 0.5-3BV/h. The lithium-rich adsorbent is washed. The lithium ions are desorbed from the washed lithium-rich adsorbent with a lithium ion eluent, to obtain a desorption solution.

    Colloidal palladium activator composition and preparation method
    4.
    发明公开
    Colloidal palladium activator composition and preparation method 有权
    Kolloidale PalladiumAktivatorlösungund Herstellungsverfahren

    公开(公告)号：EP2272997A1

    公开(公告)日：2011-01-12

    申请号：EP10166735.0

    申请日：2010-06-22

    Applicant: BYD Company Limited

    Inventor： GONG, Qing ,  WEI, Jialiang ,  LIAN, Junlan

    IPC: C23C18/28 ,  C23C18/30

    CPC classification number: C23C18/30 ,  C23C18/28

    Abstract: The present disclosure discloses a colloidal palladium activator composition comprising colloidal palladium particles, sodium chloride, glyoxylic acid, hydrochloride solution, stannous chloride; and a stabilizer. The glyoxylic acid has strong reductive ability, which prevents the oxidation of palladium 2+ in the activator to prolong the life of the activator. At the same time, the glyoxylic acid distributes around the colloidal palladium particles which may separate the colloidal palladium particles more evenly and prevent the colloidal palladium particles from coagulation, further strengthening the activity of the activator. The present disclosure also discloses a method for preparing the colloidal palladium activator composition. During the activation process according to an embodiment of the present disclosure, glyoxylic acid may absorb on the surface of the nonmetal substrate at first to strengthen the bonding force between the glyoxylic acid and the nonmetal substrate, which may favor the evenness and flatness of the coating layer, and further enhanced the adhesive strength between the plating layer and the substrate. Also, an activating method using a colloidal palladium activator composition for nonmetal surfaces is disclosed.

    Abstract translation: 本公开公开了一种胶体钯活化剂组合物，其包含胶体钯颗粒，氯化钠，乙醛酸，盐酸溶液，氯化亚锡; 和稳定剂。 乙醛酸具有很强的还原能力，可以防止活化剂中钯2+的氧化，延长活化剂的使用寿命。 同时，乙醛酸分布在胶体钯颗粒周围，可以更均匀地分离胶体钯颗粒，防止胶体钯颗粒凝结，进一步增强活化剂的活性。 本公开还公开了一种制备胶态钯活化剂组合物的方法。 在根据本公开的实施方案的活化过程中，乙醛酸可以首先在非金属基材的表面上吸收以增强乙醛酸和非金属基质之间的结合力，这有利于涂层的均匀度和平整度 并且进一步提高了镀层和基板之间的粘合强度。 另外，公开了一种使用非金属表面的胶态钯活化剂组合物的活化方法。

    LITHIUM EXTRACTION APPARATUS AND LITHIUM EXTRACTION METHOD
    5.
    发明公开
    LITHIUM EXTRACTION APPARATUS AND LITHIUM EXTRACTION METHOD 审中-公开

    公开(公告)号：EP4458443A1

    公开(公告)日：2024-11-06

    申请号：EP22914127.0

    申请日：2022-12-08

    Applicant: BYD Company Limited

    Inventor： LIN, Hongye ,  WEI, Jialiang ,  LIAN, Junlan

    IPC: B01D15/00 ,  B01D33/00 ,  C22B26/12

    Abstract: A lithium extraction apparatus and a lithium extraction method are provided. The lithium extraction apparatus includes a frame (2) and a transmission mesh belt (1). The transmission mesh belt (1) is installed on the frame (2), the transmission mesh belt (1) has water permeable holes, and the transmission mesh belt (1) is configured to carry an adsorbent. The frame (2) is sequentially provided with an adsorption zone (21) and a desorption zone (22) along a traveling direction of the transmission mesh belt (1). A brine spraying device (211) is arranged above the transmission mesh belt (1) in the adsorption zone (21). A desorbing liquid spraying device (221) is arranged above the transmission mesh belt (1) in the desorption zone (22). A lithium extract collecting device (222) is arranged below the transmission mesh belt (1) in the desorption zone (22). The transmission mesh belt (1) in the adsorption zone (21) is folded into a multi-layer structure in the vertical direction; and/or the transmission mesh belt (1) in the desorption zone (22) is folded into a multi-layer structure in the vertical direction.

    COPPER PLATING SOLUTION AND METHOD FOR PREPARING THE SAME
    6.
    发明公开
    COPPER PLATING SOLUTION AND METHOD FOR PREPARING THE SAME 有权
    镀铜和方法及其生产

    公开(公告)号：EP2852696A1

    公开(公告)日：2015-04-01

    申请号：EP13793231.5

    申请日：2013-05-22

    Applicant: BYD Company Limited

    Inventor： WEI, Jialiang

    IPC: C23C18/40

    CPC classification number: C23C18/405 ,  C23C18/40 ,  C23C18/54

    Abstract: A copper plating solution and a method for preparing a copper plating solution are provided. The copper plating solution comprises: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate.

Patent Agency Ranking