公开(公告)号：US10768369B2

公开(公告)日：2020-09-08

申请号：US16428193

申请日：2019-05-31

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Damien Lambert ,  Nikhil Kumar

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/132 ,  G02B6/136 ,  G02B6/14 ,  G02B6/122

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

公开(公告)号：US20190384002A1

公开(公告)日：2019-12-19

申请号：US16245615

申请日：2019-01-11

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: G02B6/12 ,  H01S5/022 ,  G02B6/122 ,  G02B6/136 ,  H01S5/02 ,  H01S5/026 ,  H01S5/028 ,  H01S5/22 ,  H01S5/30 ,  H01S5/343 ,  H01S5/40 ,  H04B10/50 ,  H04J14/02

Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.

公开(公告)号：US10234626B2

公开(公告)日：2019-03-19

申请号：US15426366

申请日：2017-02-07

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  H01S5/02 ,  H01S5/026 ,  H01S5/028 ,  H01S5/22 ,  H01S5/30 ,  H01S5/343 ,  H01S5/40 ,  H04B10/50 ,  H04J14/02 ,  H01S5/022

Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.

公开(公告)号：US09829631B2

公开(公告)日：2017-11-28

申请号：US15133898

申请日：2016-04-20

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: G02B6/125 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/125 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12104 ,  G02B2006/12147 ,  G02B2006/12169

Abstract: A method forms a vertical output coupler for a waveguide that propagates light along a horizontal propagation direction, through a waveguide material that overlies a buried oxide layer. The method includes etching the waveguide to remove a portion of the waveguide. The etching forms at least a first plane that is at an edge of the waveguide, is adjacent to the removed portion of the waveguide, and is tilted at a vertical angle between 20 degrees and 70 degrees with respect to the propagation direction. The method further includes coating the first tilted plane with a reflective metal to form a mirror, such that the mirror reflects the light into a direction having a vertical component.

公开(公告)号：US20160133496A1

公开(公告)日：2016-05-12

申请号：US14933694

申请日：2015-11-05

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： Damien Lambert ,  John Spann ,  Stephen Krasulick

IPC: H01L21/683 ,  H01L21/027 ,  H01L23/00

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract translation: 使用具有顺应性树脂的转印衬底将一个或多个芯片结合到目标晶片。 植入区域形成在转印衬底中。 转印衬底的一部分被蚀刻以形成提升器。 将合适的材料施加到转印基板上。 芯片被固定到柔性材料上，其中芯片被固定到提升管上方的柔性材料。 当芯片固定到顺应性材料时，芯片被结合到目标晶片。 从芯片上去除转印衬底和柔顺材料。 转印衬底对UV光是不透明的。

公开(公告)号：US20150364441A1

公开(公告)日：2015-12-17

申请号：US14741181

申请日：2015-06-16

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/30 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/04026 ,  H01L2224/05557 ,  H01L2224/05638 ,  H01L2224/1161 ,  H01L2224/13013 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13138 ,  H01L2224/136 ,  H01L2224/14131 ,  H01L2224/29017 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/3003 ,  H01L2224/3012 ,  H01L2224/32145 ,  H01L2224/32147 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/8301 ,  H01L2224/83012 ,  H01L2224/83048 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/83902 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: Micro pillars are formed in silicon. The micro pillars are used in boding the silicon to hetero-material such as III-V material, ceramics, or metals. In bonding the silicon to the hetero-material, indium is used as a bonding material and attached to the hetero-material. The bonding material is heated and the silicon and the hetero-material are pressed together. As the silicon and the hetero-material are pressed together, the micro pillars puncture the bonding material. In some embodiments, pedestals are used in the silicon as hard stops to align the hetero-material with the silicon.

Abstract translation: 微柱形成在硅中。 微柱用于将硅掺入诸如III-V材料，陶瓷或金属的异质材料中。 在将硅键合到异质材料时，使用铟作为结合材料并附着到异质材料上。 加热接合材料，并将硅和异质材料压在一起。 当硅和异质材料被压在一起时，微柱刺穿接合材料。 在一些实施例中，在硅中使用基座作为硬止动器以使异质材料与硅对准。

公开(公告)号：US11624872B2

公开(公告)日：2023-04-11

申请号：US17539474

申请日：2021-12-01

Applicant: Skorpios Technologies, Inc.

Inventor： Paveen Apiratikul ,  Damien Lambert

IPC: G02B6/12 ,  G02B6/136 ,  G02B6/122

Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.

公开(公告)号：US11409039B2

公开(公告)日：2022-08-09

申请号：US16985860

申请日：2020-08-05

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Damien Lambert ,  Nikhil Kumar

IPC: G02B6/12 ,  G02B6/14 ,  G02B6/122 ,  G02B6/132 ,  G02B6/136 ,  G02B6/30

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

公开(公告)号：US11194092B2

公开(公告)日：2021-12-07

申请号：US16690483

申请日：2019-11-21

Applicant: Skorpios Technologies, Inc.

Inventor： Paveen Apiratikul ,  Damien Lambert

IPC: G02B6/12 ,  G02B6/136

Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.

公开(公告)号：US11002907B2

公开(公告)日：2021-05-11

申请号：US16245615

申请日：2019-01-11

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: G02B6/12 ,  H01S5/02326 ,  G02B6/122 ,  G02B6/136 ,  H01S5/02 ,  H01S5/026 ,  H01S5/028 ,  H01S5/22 ,  H01S5/30 ,  H01S5/343 ,  H01S5/40 ,  H04B10/50 ,  H04J14/02

Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.