公开(公告)号：WO2023089337A1

公开(公告)日：2023-05-25

申请号：PCT/GB2022/052945

申请日：2022-11-21

Applicant: SOFANT TECHNOLOGIES LTD

Inventor： CHRISTIE, Andrew ,  HARIDAS, Nakul ,  FULLER, Matt ,  STEEL, Victor ,  WITHER, David

IPC: H05K1/02 ,  H05K1/14 ,  B81B7/00 ,  H01Q21/00 ,  H01Q1/22 ,  H01Q3/32 ,  H05K3/28 ,  H05K3/46

Abstract: 51 Abstract1 2 The present invention provides a circuit board assembly, for a microelectromechanical 3 system, MEMS, based antenna assembly, comprising: first and second PCBs, each 4 having an RF signal conductor and one or more ground conductors thereon; an RF 5 signal connector extending between the first and second PCBs and electrically 6 connected to the RF signal conductors of the first and second PCB; and one or more 7 ground connectors extending between the first and second PCBs and electrically 8 connected to the ground conductors of the first and second PCBs, wherein the one or 9 more ground connectors are arranged to at least partially surround the RF signal 10 connector, wherein the RF signal connector and the one or more ground connectors 11 are provided in a connector assembly extending between the first and second PCBs 12 and defining one or more openings therein, each opening adjacent to at least one of 13 the first PCB and the second PCB, wherein the circuit board assembly further 14 comprises a plurality of signal connectors extending between the first and second 15 PCBs and arranged around a periphery of the one or more openings, wherein the first 16 PCB comprises a circuit component extending from a surface of the first PCB, towards 17 the second PCB, and wherein the connector assembly is arranged such that at least 18 one of the one or more openings accommodates the circuit component therein.19

公开(公告)号：WO2022106846A1

公开(公告)日：2022-05-27

申请号：PCT/GB2021/053013

申请日：2021-11-19

Applicant: SOFANT TECHNOLOGIES LTD

Inventor： CHRISTIE, Andrew ,  HARIDAS, Nakul ,  FULLER, Matt ,  STEEL, Victor ,  WITHER, David

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/46 ,  G01R1/067

Abstract: The present invention provides a method of forming a circuit board assembly, the circuit board assembly comprising a first PCB (110), a second PCB (190), an RF signal connector (120) for carrying RF signals therebetween, and one or more ground connectors (130, 140) for at least partially shielding the RF signal connector. The method comprises: providing first and second PCBs, each having an RF signal conductor and one or more ground conductors thereon, forming or attaching an RF signal connector (120) extending between the first and second PCBs and electrically connecting the RF signal connector to the RF signal conductors of the first and second PCBs, forming or attaching one or more ground connectors (130, 140) extending between the first and second PCBs and electrically connecting the one or more ground connectors to the ground conductors of the first and second PCBs. The one or more ground connectors are arranged to at least partially surround the RF signal connector. The RF signal connector is formed from one or more conductive signal pillars. The or each of the one or more ground connectors are formed from one or more conductive ground pillars.

公开(公告)号：WO2022018443A1

公开(公告)日：2022-01-27

申请号：PCT/GB2021/051889

申请日：2021-07-21

Applicant: SOFANT TECHNOLOGIES LTD

Inventor： STEEL, Victor ,  CHRISTIE, Andrew

IPC: H01Q21/00 ,  H01Q3/26 ,  H01Q3/28 ,  H01Q3/38 ,  H01Q21/06 ,  H01Q21/24

Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz. The apparatus (200) comprises: a plurality of sub- arrays (208) together configured to form a phased array antenna, each sub-array (208) comprising at least four antenna elements (220), each antenna element (220) for receiving an input signal from the sub-array (220) and comprising: an antenna (230) for transmission of the input signal; and a signal modification component (222) to adjust a phase of the input signal during propagation to the antenna (230); and a plurality of power amplifiers (212), wherein each sub-array (208) is provided with a one of the plurality of power amplifiers (212), wherein each sub-array (208) is arranged to be provided with an amplified input signal, and each antenna element (220) of the sub-array (208) is configured to be provided with the amplified input signal of the respective sub-array (208) as the input signal to the antenna element (220), and wherein the power amplifier (212) for each sub-array (208) is configured to receive a phased array input signal for amplification and to output the respective amplified input signal to the respective sub-array (208). The power amplifier (212) for each sub-array (208) may be physically separate and distinct from each sub-array (208).