Abstract:
An imaging device includes: a photoelectric conversion unit; and a correction unit that corrects the angle of light incident on the photoelectric conversion unit, the correction unit being located on the side of the light incident on the photoelectric conversion unit. The correction unit has a curved surface, and the surface shape of the curved surface is a spherical surface. The surface shape is a shape according to a predetermined equation involving the radius of the spherical surface, the distance from the center of the optical axis of the imaging plane to the edge of the imaging plane, and the refractive index of the material forming the correction unit.
Abstract:
A projection screen constituted by forming a fine particle layer for reflecting red color, a fine particle layer for reflecting green color, and a fine particle layer for reflecting blue color sequentially, in layer, on a substrate. In each fine particle layer, fine particles are laid regularly by 11 periods in tightest structure, for example. The fine particle for reflecting red color has diameter of about 280 nm, the fine particle for reflecting green color has diameter of about 235 nm, and the fine particle for reflecting blue color has diameter of about 212 nm. Each fine particle layer is deposited by a self-organizing technology. Such a substrate as can absorb light other than three primary colors of red, green and blue is employed.
Abstract:
A metal-organic chemical vapor-phase deposition process for fabricating a layer of a Group II-VI compound semiconductor using an organometallic compound based on bis(cyclopentadienyl)magnesium having a vapor pressure in the range of from 1.3 x 10 Pa to 1.3 x 10 Pa at a temperature of 330 DEG K. The present invention also provides a light-emitting device which is fabricated by means of the metal-organic vapor-phase deposition process above. The process according to the present invention provides a magnesium-containing compound semiconductor layer having an accurately controlled composition, and it readily enables the fabrication of a compound semiconductor layer having a grated structure.
Abstract:
A metal-organic chemical vapor-phase deposition process for fabricating a layer of a Group II-VI compound semiconductor using an organometallic compound based on bis(cyclopentadienyl)magnesium having a vapor pressure in the range of from 1.3 x 10 Pa to 1.3 x 10 Pa at a temperature of 330 DEG K. The present invention also provides a light-emitting device which is fabricated by means of the metal-organic vapor-phase deposition process above. The process according to the present invention provides a magnesium-containing compound semiconductor layer having an accurately controlled composition, and it readily enables the fabrication of a compound semiconductor layer having a grated structure.
Abstract:
A projection screen comprises a red-reflecting particle layer, green-reflecting particle layer and blue-reflecting particle layer sequentially stacked on a substrate. In each particle layer, particles are accumulated by eleven cycles in a regularly alignment such as close-packed structure. Diameter of red-reflecting particles is approximately 280 nm, diameter of green-reflecting particles is approximately 235 nm, and diameter of blue-reflecting particles is approximately 212 nm. Each particles layer is accumulated by self-organized technique. The substrate used here can absorb light of wavelengths other than those of red, green and blue three primary colors.
Abstract:
A metal-organic chemical vapor-phase deposition process for fabricating a layer of a Group II-VI compound semiconductor using an organometallic compound based on bis(cyclopentadienyl)magnesium having a vapor pressure in the range of from 1.3 x 10 Pa to 1.3 x 10 Pa at a temperature of 330 DEG K. The present invention also provides a light-emitting device which is fabricated by means of the metal-organic vapor-phase deposition process above. The process according to the present invention provides a magnesium-containing compound semiconductor layer having an accurately controlled composition, and it readily enables the fabrication of a compound semiconductor layer having a grated structure.
Abstract:
PROBLEM TO BE SOLVED: To provide a solid state image pick-up device having a reflector which can enhance sensitivity or utilization efficiency of light by reflecting incident light, while suppressing color mixture.SOLUTION: A solid state image pick-up device includes a photoelectric conversion unit, and a reflector including a first portion provided on the side opposite from the light incident side and formed in the center of a condensing region, and a second portion formed on the boundary to the adjoining region and formed convexly for the first portion on the incident side, and condensing the reflection light in the region by generating a phase difference between the reflection light by the first portion and the reflection light by the second portion.
Abstract:
PROBLEM TO BE SOLVED: To provide a display device etc. which can facilitate improving light utilization efficiency.SOLUTION: A display device includes: a light source section that emits excitation light for each pixel; and a light emitting layer that includes a quantum dot and emits emission light for each of the pixels. The quantum dot generates, based on the excitation light, the emission light having a wavelength longer than a wavelength of the excitation light. The wavelength conversion from the excitation light to the emission light is performed with a simple configuration.
Abstract:
PROBLEM TO BE SOLVED: To enable signals to be linearly acquired with high S/N without narrowing a normal saturation level under low illumination, and widen a dynamic range while achieving fine S/N in a linear region even for incident light at the normal saturation level or higher.SOLUTION: In a CMOS image sensor 10 where unit pixels 20 each including a photodiode 21 and a transfer transistor 22 for transferring signal electric charges photoelectrically converted by the photodiode 21, are two-dimensionally arranged in a matrix form, a supply voltage control circuit 13 sequentially supplies a control electrode of the transfer transistor 22 with plural control voltages, and at this time, a vertical scanning circuit 12 partially transfers the signal electric charges twice or more and drives the unit pixel to independently read out voltage according to the electric charges after the second or later partial transfers.