公开(公告)号：US20150069607A1

公开(公告)日：2015-03-12

申请号：US14548090

申请日：2014-11-19

Applicant: STMicroelectronics Pte Ltd

Inventor： How Yuan Hwang ,  Kah Wee Gan

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L24/14 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/023 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

Abstract translation: 集成电路封装包括在复原衬底中的集成电路管芯。 然后将活性侧加工成模塑料，同时处理非活性侧。 然后部分地去除活性侧上的模塑料，并且在活性侧上放置焊球。

公开(公告)号：US09318459B2

公开(公告)日：2016-04-19

申请号：US14548090

申请日：2014-11-19

Applicant: STMicroelectronics Pte Ltd

Inventor： How Yuan Hwang ,  Kah Wee Gan

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/48 ,  H01L23/31

CPC classification number: H01L24/14 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/023 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

Abstract translation: 集成电路封装包括在复原衬底中的集成电路管芯。 然后将活性侧加工成模塑料，同时处理非活性侧。 然后部分地去除活性侧上的模塑料，并且在活性侧上放置焊球。