公开(公告)号：EP3686923A1

公开(公告)日：2020-07-29

申请号：EP20154200.8

申请日：2020-01-28

Applicant: STMicroelectronics S.r.l.

Inventor： PATTI, Davide Giuseppe ,  ALEO, Mario Antonio

IPC: H01L21/762 ,  H01L27/02 ,  H01L21/8258 ,  H01L21/8234

Abstract: A semiconductor die (1) comprising: a structural body (3) including a power region (1b) and a peripheral region (1a), surrounding the power region (1b); at least one power device (10) in the power region (1b); and trench-insulation means (12), extending in the structural body (3) starting from the front side towards the back side along a first direction (Z), adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction (X) orthogonal to the first direction (Z). The trench-insulation means (12) have an extension (d), in the second direction (X), greater than the thickness (h) of the structural body along the first direction (Z).

公开(公告)号：EP4293653A1

公开(公告)日：2023-12-20

申请号：EP22305890.0

申请日：2022-06-17

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMicroelectronics S.r.l.

Inventor： STECKEL, Jonathan ,  CONTI, Giovanni ,  L'EPISCOPO, Gaetano ,  ALEO, Mario Antonio

IPC: G09G3/34 ,  H05B45/22 ,  H05B45/46 ,  G02F1/13357

Abstract: The present disclosure relates to an optoelectronic device (200, 400, 1100) comprising a backlight panel (116) illuminating a display panel (240), the backlight panel comprising an array of light emitting pixels (202, 302), each light emitting pixel comprising at least one subpixel (106, 108, 110, 1102) comprising one or more light emitting diodes positioned on a substrate; and at least one photodetector (210, 1110) positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.