公开(公告)号：US08963303B2

公开(公告)日：2015-02-24

申请号：US14182156

申请日：2014-02-17

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Criscione ,  Gaetano Pignataro

IPC: H01L23/495 ,  H01L23/10 ,  H01L27/02 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L27/0251 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink.

Abstract translation: 一种器件包括集成在第一和第二芯片中的第一和第二晶体管。 每个芯片具有相对的后表面和前表面，并且还具有前表面上的第一导电端子和控制端子以及后表面上的第二导电端子。 第一和第二晶体管通过使第一和第二晶体管的第一导电端子电连接而串联电连接。 该装置包括封装第一和第二芯片的公共封装，公共封装具有带有安装表面的绝缘体。 散热器也封装在绝缘体内，散热片与相应前表面上的第一和第二芯片的第一导电端子电接触，使得第一导电端子通过散热器电连接在一起。

公开(公告)号：US20140239413A1

公开(公告)日：2014-08-28

申请号：US14182156

申请日：2014-02-17

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Criscione ,  Gaetano Pignataro

IPC: H01L27/02

CPC classification number: H01L27/0251 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink.

Abstract translation: 一种器件包括集成在第一和第二芯片中的第一和第二晶体管。 每个芯片具有相对的后表面和前表面，并且还具有前表面上的第一导电端子和控制端子以及后表面上的第二导电端子。 第一和第二晶体管通过使第一和第二晶体管的第一导电端子电连接而串联电连接。 该装置包括封装第一和第二芯片的公共封装，公共封装具有带有安装表面的绝缘体。 散热器也封装在绝缘体内，散热片与相应前表面上的第一和第二芯片的第一导电端子电接触，使得第一导电端子通过散热器电连接在一起。