公开(公告)号：WO2014074232A1

公开(公告)日：2014-05-15

申请号：PCT/US2013/061374

申请日：2013-09-24

Applicant: SILICON GRAPHICS INTERNATIONAL CORP.

Inventor： DEAN, Steven J. ,  SALMONSON, Richard B. ,  STACY, Russell E. ,  RAMSEIER, Roger ,  MALONEY, Mark

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

Abstract translation: 高性能计算系统包括一个或多个具有冷却歧管并且被配置为保持多个计算刀片的刀片式外壳，以及具有包括两个计算板的至少一个计算刀片的每个刀片机箱中的多个计算刀片。 该系统还包括两个或更多个冷却板，其中每个冷却板位于计算刀片内的两个对应的计算板之间，以及流体连接，其连接到冷却板并与流体冷却歧管流体连通。

公开(公告)号：WO2014074233A1

公开(公告)日：2014-05-15

申请号：PCT/US2013/061392

申请日：2013-09-24

Applicant: SILICON GRAPHICS INTERNATIONAL CORP.

Inventor： DEAN, Steven J. ,  RAMSEIER, Roger ,  MALONEY, Mark ,  COLLINS, David R.

IPC: H05K5/04

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.

Abstract translation: 具有多个计算刀片的高性能计算系统具有至少一个计算刀片，该计算刀片包括设置在计算板的任一侧的一个或多个计算板和两个侧轨。 每个侧轨具有板对准元件，其被配置为将计算板保持在计算刀片内，使得计算板的顶部联接到板对准元件的一部分并且邻近于棋盘对准元件的一部分。

公开(公告)号：EP2918151A1

公开(公告)日：2015-09-16

申请号：EP13853840.0

申请日：2013-09-24

Applicant: Silicon Graphics International Corp.

Inventor： DEAN, Steven J. ,  RAMSEIER, Roger ,  MALONEY, Mark ,  COLLINS, David R.

IPC: H05K5/04

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.