公开(公告)号：WO1993020562A1

公开(公告)日：1993-10-14

申请号：PCT/US1993003314

申请日：1993-04-01

Applicant: THERMOSET PLASTICS, INC.

Inventor： THERMOSET PLASTICS, INC. ,  JAMISON, William, L. ,  MOSCICKI, Andrzej, J.

IPC: H01B01/02

CPC classification number: H01B1/22 ,  C08K3/08 ,  H01L23/4828 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/181 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0245 ,  H05K2203/1105 ,  H01L2924/00

Abstract: Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.

Abstract translation: 制备具有基于自由基的固化化学物质的导体填充的热固性树脂，用作用于表面安装电子部件到印刷电路板的导电附着物的焊膏替代物和作为芯片附着粘合剂。 热固性树脂具有流变性能，可以替代最先进的焊膏和管芯粘合剂。 导体填充的树脂可以在线处理操作中热固化，以提供低应力，基底粘附的导电树脂基质。

公开(公告)号：WO1994006862A1

公开(公告)日：1994-03-31

申请号：PCT/US1993008855

申请日：1993-09-20

Applicant: THERMOSET PLASTICS, INC.

Inventor： THERMOSET PLASTICS, INC. ,  JAMISON, William, J. ,  JENSON, William, H. ,  SEARS, George, E., Jr.

IPC: C08L67/00

CPC classification number: H01B3/421 ,  C08K3/013 ,  C08L67/06 ,  C08L2666/02

Abstract: Filled, thermoplastic-modified thermosetting polyester resin formulations are provided as encapsulants for microelectronics devices. The polyester encapsulant formulations include either a low profile thermoplastic resin additive or a combination of polyethylene and a low shrink thermoplastic additive. In preferred embodiments the polyester encapsulant formulations are of low viscosity and can be utilized in various pressure molding protocols. The encapsulant matrix is characterized by a low coefficient of thermal expansion, very low shrinkage, low modulus, and good thermal conductivity. Microelectronics devices encapsulated with the polyester resin formulation exhibit good resistance to moisture related and stress-induced failure.

Abstract translation: 提供填充的热塑性改性的热固性聚酯树脂配方作为微电子器件的密封剂。 聚酯密封剂配方包括低分子量热塑性树脂添加剂或聚乙烯和低收缩热塑性添加剂的组合。 在优选的实施方案中，聚酯包封剂制剂具有低粘度并可用于各种压力成型方案中。 密封剂基质的特征在于低的热膨胀系数，非常低的收缩率，低的模量和良好的导热性。 用聚酯树脂配方包封的微电子器件表现出良好的耐潮湿性和应力诱发失效的能力。

公开(公告)号：WO1992018579A1

公开(公告)日：1992-10-29

申请号：PCT/US1992003366

申请日：1992-04-22

Applicant: THERMOSET PLASTICS, INC.

Inventor： THERMOSET PLASTICS, INC. ,  JAMISON, William, L. ,  LARSEN, Gary, J. ,  SEARS, George, E., Jr.

IPC: C09K05/00

CPC classification number: C10M169/00 ,  C10M107/34 ,  C10M107/50 ,  C10M113/00 ,  C10M113/12 ,  C10M113/16 ,  C10M125/00 ,  C10M125/10 ,  C10M125/26 ,  C10M2201/00 ,  C10M2201/06 ,  C10M2201/061 ,  C10M2201/062 ,  C10M2201/063 ,  C10M2201/087 ,  C10M2201/10 ,  C10M2201/102 ,  C10M2201/105 ,  C10M2201/145 ,  C10M2201/16 ,  C10M2201/18 ,  C10M2209/1033 ,  C10M2209/104 ,  C10M2209/1045 ,  C10M2209/105 ,  C10M2209/1055 ,  C10M2209/1065 ,  C10M2209/107 ,  C10M2209/1075 ,  C10M2209/1085 ,  C10M2209/1095 ,  C10M2229/025 ,  C10M2229/0405 ,  C10M2229/0415 ,  C10M2229/0425 ,  C10M2229/0435 ,  C10M2229/0445 ,  C10M2229/045 ,  C10M2229/0455 ,  C10M2229/046 ,  C10M2229/0465 ,  C10M2229/047 ,  C10M2229/0475 ,  C10M2229/048 ,  C10M2229/0485 ,  C10M2229/0505 ,  C10M2229/0515 ,  C10M2229/0525 ,  C10M2229/0535 ,  C10M2229/0545 ,  C10N2210/02 ,  C10N2220/02

Abstract: A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic liquid polymer carrier, an antioxidant, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.