Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for enhancing the overlay accuracy without impairing the processing capacity of a lithography apparatus significantly.SOLUTION: Alignment marks on a substrate are inspected during exposure thereof in order to optimize the exposure conditions. When the substrate 10 is scanned directly under an exposure and alignment unit 15, each part of the substrate passes under a detector unit 16 at first, and then passes under an exposure unit 17. Consequently, the information about the linear position, orientation, and expansion measured by the detector unit 16 for each part of the substrate 10 can be transmitted to the exposure unit 17, and the exposure conditions for each part of the substrate can be optimized when the substrate is exposed while passing under the exposure unit 17.
Abstract:
PROBLEM TO BE SOLVED: To provide, for example, an arrangement which addresses some problems associated with movement of a support.SOLUTION: An apparatus, in an embodiment, has a patterning device support including a first planar element having a first flow-restricting surface; a second planar element including a second flow-restricting surface facing the first flow-restricting surface; a support driver to linearly move the support along a certain direction relative to the second planar element. The first and/or second flow-restricting surface has one or more projections and/or recesses between the first and second flow-restricting surfaces. The projection and/or recess on the first and/or second flow-restricting surface is arranged to provide a flow resistance, per unit width of the first and/or second flow-restricting surface perpendicular to a flow, that is lower against a flow that is parallel to the certain direction than against a flow that is perpendicular to the certain direction. The flow-restricting surfaces may direct a gas flow onto a driver part that generates heat.
Abstract:
PROBLEM TO BE SOLVED: To provide a CSI algorithm for reconstructing grating profiles.SOLUTION: Solving a volume integral equation for current density J employs the implicit construction of a vector field Frelated to an electric field, Eand current density J by selection of continuous components of E and J, F being continuous at one or more material boundaries, so as to determine an approximate solution of J. F is represented by at least one finite Fourier series with respect to at least one direction, x, y, and the step of numerically solving the volume integral equation comprises determining a component of J by convolution of F, with a convolution operator M comprising material and geometric structure properties in both directions. J may be represented by at least one finite Fourier series with respect to both directions. The continuous components can be extracted using convolution operators, Pand PN, acting on E and J.
Abstract translation:要解决的问题:提供用于重建光栅轮廓的CSI算法。 解决方案:求解电流密度J的体积积分方程采用与电场相关的矢量场F S SP>的隐式构造,E S SP>和电流密度J,通过选择E和J的连续分量,F在一个或多个材料边界处是连续的,以便确定J.F的近似解由至少一个有限傅里叶级数 相对于至少一个方向x,y,并且数字求解体积积分方程的步骤包括通过卷积F来确定J的分量,其中卷积算子M包括两个方向上的材料和几何结构特性。 J可以由相对于两个方向的至少一个有限傅里叶级数表示。 可以使用卷积算子P T SB>和PN作为E和J来提取连续分量。(C)2013,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus capable of controlling a substrate temperature.SOLUTION: The lithographic apparatus comprises: a substrate table configured to hold a substrate; a projection system configured to project a patterned radiation beam through an opening and onto a target portion of the substrate; and a conduit having an outlet in the opening. The conduit is configured to supply gas to the opening. The lithographic apparatus further includes a cooling apparatus controlled by a control system. The cooling apparatus is configured to cool the gas such that gas which travels from the opening to the substrate has a predetermined temperature when the gas is incident upon the substrate.
Abstract:
PROBLEM TO BE SOLVED: To enable accurate measurement without degrading throughput of an alignment sensor.SOLUTION: A measurement optical system comprises an illumination subsystem for illuminating a mark 202 with a radiation spot and a detecting subsystem 580 for detecting radiation diffracted by the mark. A substrate and the measurement optical system move relatively to each other at a first velocity (v) so as to scan the mark while synchronously moving the radiation spot relatively to the reference frame of the measurement optical system at a second velocity (v). The spot scans the mark at a third velocity (v) which is lower than the first velocity to allow more time for accurate position measurements to be acquired. An objective lens 524 remains fixed in relation to the reference frame while a moving optical element 562 imparts the movement of the radiation spot relative to the reference frame.
Abstract:
PROBLEM TO BE SOLVED: To reduce or eliminate risks of a defocusing error.SOLUTION: An immersion lithographic apparatus is disclosed having a projection system configured to direct a patterned beam of radiation onto a substrate and a liquid handling system configured to supply and confine immersion liquid to a space defined between the projection system and a substrate, or a substrate table, or both. A controller is provided to adjust an angle of a lower surface of the liquid handling system relative to the top surface of the substrate during moving of the substrate and/or substrate table relative to the liquid handling system dependent upon a position of the substrate and/or substrate table relative to the liquid handling system and/or a direction of relative movement between the substrate and/or substrate table and the liquid handling system.
Abstract:
PROBLEM TO BE SOLVED: To provide accurate short stroke positioning.SOLUTION: A stage system comprises an object table which holds an object, a short stroke actuator element which moves the object table over a first moving range, a long stroke actuator element which moves the short stroke actuator element over a second moving range wider than the first moving range. The stage system further comprises a pneumatic compensation device including a sensor which measures an amount representing an air disturbance force on the short stroke actuator element, an actuator which provides a compensation force at least partially compensating for air disturbance, and a controller. The sensor is connected to a controller input of the controller, and the actuator is connected to a controller output of the controller. The controller drives the actuator in response to a signal received from the sensor.
Abstract:
PROBLEM TO BE SOLVED: To provide an optical scanning mechanism which avoids or reduces additional cost and bulk to a sensor and/or inaccuracies in measurement.SOLUTION: The optical apparatus measures a position of a mark 202 on a lithographic substrate W. A measurement optical system comprises an illumination subsystem for illuminating the mark with a spot of radiation and a detecting subsystem 580 for detecting radiation diffracted by the mark. A tilting mirror 562 moves the spot of radiation relative to the reference frame of the measurement optical system synchronously with a scanning motion of the mark itself, to allow more time for accurate position measurements to be acquired. The mirror tilt axis 568 is arranged along the intersection of the mirror plane with a pupil plane P of an objective lens 524 to minimize artifacts of the scanning. The same geometrical arrangement can be used for scanning in other types of apparatus, for example a confocal microscope.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation detector, a method of manufacturing a radiation detector, and a lithographic apparatus comprising a radiation detector.SOLUTION: The radiation detector has a radiation sensitive surface. The radiation sensitive surface is sensitive to radiation wavelengths of 10 to 200 nm and/or charged particles. The radiation detector has a silicon substrate, a dopant layer, a first electrode, and a second electrode. The silicon substrate is provided in a surface area on a first surface side with a doping profile of a certain conduction type. The dopant layer is provided on the first surface side of the silicon substrate. The dopant layer has a first layer of a dopant material and a second layer. The second layer is a diffusion layer in contact with the surface area on the first surface side of the silicon substrate. The first electrode is connected to the dopant layer. The second electrode is connected to the silicon substrate.
Abstract:
PROBLEM TO BE SOLVED: To provide various types of pressure regulation means for reducing a pressure gradient in a liquid supply system of a lithographic apparatus.SOLUTION: The liquid supply system has a liquid confinement structure configured to at least partially confine a liquid between a projection system and a substrate table of the lithographic apparatus. A high pressure gradient may cause particulate contamination in the liquid supply system and/or liquid confinement structure. A pressure gradient can be reduced by, for example, the use of slow switching in one or more valves, a bleed flow around or through one or more valves, diversion of liquid to a drain rather than or in addition to switching a valve off, a pressure regulator or flow restrictor to prevent shock waves, and a buffer liquid/damper to compensate for pressure fluctuation.