IN-PLANE ELECTROMAGNETIC MEMS PUMP
    93.
    发明申请
    IN-PLANE ELECTROMAGNETIC MEMS PUMP 审中-公开
    平面电磁MEMS泵

    公开(公告)号:WO2011149503A1

    公开(公告)日:2011-12-01

    申请号:PCT/US2011/000678

    申请日:2011-04-14

    CPC classification number: F04B43/043

    Abstract: A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.

    Abstract translation: 在基板表面上形成微机械泵送系统。 泵送系统使用泵送元件,该元件通过在基本上平行于衬底表面的平面中移动的阀来泵送流体。 也可以在基板的表面上制造电磁致动机构。 线圈围绕可渗透芯体产生的磁通可以耦合到固定到泵送元件的可渗透构件。 可渗透构件和泵送元件可以构造成在平行于衬底的平面中移动。 电磁致动机构使泵送系统产生大的冲击力和相当大的力,使得由泵送系统泵送的流体可以泵送通过透皮套管,以将治疗物质递送到患者皮肤下方的组织。

    INDENTED STRUCTURE FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE
    96.
    发明申请
    INDENTED STRUCTURE FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE 审中-公开
    封装装置的标准结构及其制造方法

    公开(公告)号:WO2007136582A3

    公开(公告)日:2009-04-02

    申请号:PCT/US2007011416

    申请日:2007-05-11

    Abstract: A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation features. The indentation features increase the surface area of the getter material, thereby increasing the volume of gas that the getter material can absorb. This may improve the vacuum maintained within the vacuum cavity over the lifetime of the vacuum encapsulated device.

    Abstract translation: 描述了一种在真空封装装置中提供改进吸气的方法。 该方法包括在形成在盖晶片中的器件空腔中形成多个小凹陷特征。 然后将吸气材料沉积在压痕特征上。 凹陷特征增加吸气材料的表面积,从而增加吸气剂材料可吸收的气体体积。 这可以在真空密封装置的寿命期内改善在真空腔内保持的真空。

    MEMS THERMAL DEVICE WITH SLIDEABLY ENGAGED TETHER AND METHOD OF MANUFACTURE
    97.
    发明申请
    MEMS THERMAL DEVICE WITH SLIDEABLY ENGAGED TETHER AND METHOD OF MANUFACTURE 审中-公开
    具有可滑动接合的四面体的MEMS热装置及其制造方法

    公开(公告)号:WO2007109203A3

    公开(公告)日:2008-11-06

    申请号:PCT/US2007006752

    申请日:2007-03-19

    Abstract: A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.

    Abstract translation: 公开了一种MEMS热开关,其使用可滑动接合的系绳将热膨胀梁耦合到冷弯头梁,并且通过热梁的膨胀来弯曲冷弯曲梁。 刚性接合的系绳将热的,扩张的梁和冷的弯曲梁的远端连接在一起,而可滑动地接合的系绳允许热的,膨胀的梁相对于冷的屈肌梁而伸长,而不加载可滑动地接合的系绳 具有很大的剪切力。 结果,系链的材料可以变得更硬,并且因此将热膨胀梁的弯曲力更有效地传递到凉爽的弯曲梁。

    INDENTED STRUCTURE FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE
    98.
    发明申请
    INDENTED STRUCTURE FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE 审中-公开
    封装装置的标准结构及其制造方法

    公开(公告)号:WO2007136582A2

    公开(公告)日:2007-11-29

    申请号:PCT/US2007/011416

    申请日:2007-05-11

    Abstract: A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation features. The indentation features increase the surface area of the getter material, thereby increasing the volume of gas that the getter material can absorb. This may improve the vacuum maintained within the vacuum cavity over the lifetime of the vacuum encapsulated device.

    Abstract translation: 描述了一种在真空封装装置中提供改进吸气的方法。 该方法包括在形成在盖晶片中的器件空腔中形成多个小凹陷特征。 然后将吸气材料沉积在压痕特征上。 凹陷特征增加吸气材料的表面积,从而增加吸气剂材料可吸收的气体体积。 这可以在真空密封装置的寿命期内改善在真空腔内保持的真空。

    WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE
    99.
    发明申请
    WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE 审中-公开
    使用金属合金与增强特征的水平水平粘结

    公开(公告)号:WO2007078472A1

    公开(公告)日:2007-07-12

    申请号:PCT/US2006/045542

    申请日:2006-11-29

    Abstract: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate, along with a raised feature formed on the first or the second substrate. At least one of the metal layers may be deposited conformally over the raised feature. The raised feature penetrates the molten material of the first or the second metal layers during formation of the alloy, and produces a spectrum of stoichiometrics for the formation of the desired alloy, as a function of the distance from the raised feature. At some distance from the raised feature, the proper ratio of the first metal to the second metal exists to form an alloy of the preferred stoichiometry.

    Abstract translation: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件,其中之一支撑该装置。 气密密封由两个金属层的合金形成,一个沉积在第一基板上,另一个沉积在第二基板上,以及形成在第一或第二基板上的凸起特征。 金属层中的至少一个可以在凸起特征上保形地沉积。 凸起的特征​​在形成合金期间渗透第一或第二金属层的熔融材料,并且作为与凸起特征的距离的函数产生用于形成所需合金的化学计量谱。 在与凸起特征相距一定距离处,存在第一金属与第二金属的适当比例以形成优选化学计量的合金。

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