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公开(公告)号：JP2007096322A
公开(公告)日：2007-04-12
申请号：JP2006263189
申请日：2006-09-27
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： MATHAI MATHEW , CHOULIS STELIOS A , SO FRANKY , CHOONG VI-EN
CPC classification number: H01L51/5048 , H01L51/0037 , H01L51/0042 , H01L51/0059 , H01L51/0067 , H01L51/0071 , H01L51/0085 , H01L51/5016
Abstract: PROBLEM TO BE SOLVED: To provide an organic phosphorescent-light emitting device having a surface of an organic layer conditioned with an adjusting material for improving an efficiency in transport or injection of positive holes and electrons into a light emitting layer. SOLUTION: A adjusting layer is added onto one or both sides of the light emitting layer. The adjusting layer has an energy level substantially equal to that of the light emitting material. The light emitting diode has a first electrode, a light emitting layer connected to the first electrode and a second electrode connected to the light emitting layer. The light emitting layer contains a phosphorescent organic material. A first interfacial layer is arranged between the light emitting layer and the first electrode and has the thickness of about 3 nm or less, while containing an organic material that assists injection of a first charge into the light emitting layer. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：提供一种有机磷光发光器件，其具有用调节材料调理的有机层的表面，用于提高将空穴和电子输送或注入发光层的效率。 解决方案：将调整层添加到发光层的一侧或两侧。 调整层的能级基本上等于发光材料的能级。 发光二极管具有第一电极，连接到第一电极的发光层和连接到发光层的第二电极。 发光层含有磷光有机材料。 第一界面层布置在发光层和第一电极之间，并且具有约3nm或更小的厚度，同时含有有助于将第一电荷注入到发光层中的有机材料。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007036295A
公开(公告)日：2007-02-08
申请号：JP2006294398
申请日：2006-10-30
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： ARNDT KARLHEINZ
CPC classification number: H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01068 , H01L2924/12041 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To guarantee improvement of heat radiation from a chip, and in that case, to prevent remarkable change in the dimension of casing and increase in risk of delamination.
SOLUTION: External terminals of a chip supporting member provided on a conductor frame and external terminals of a terminal section protrude from a cover, and all the terminals are molded so as to be simultaneously placed on a terminal board or a wiring board in a state where the terminals are mounted on the terminal board for mounting an element or the circuit board. At least three terminals are configured as thermal conductive terminals thermoconductively connected to the chip supporting member. The terminals protrude from the cover on various positions with intervals on at least two sides of the cover. Loss heat to be generated during operation of the element is radiated to the terminal board or the wiring board at three different points, and distributed with a large area.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：为了保证芯片的热辐射的改善，并且在这种情况下，防止套管的尺寸显着变化并增加分层的风险。
解决方案：设置在导体框架上的芯片支撑构件的外部端子和端子部分的外部端子从盖子突出，并且所有端子被模制以同时放置在端子板或布线板上 端子安装在用于安装元件或电路板的端子板上的状态。 至少三个端子被配置为导热连接到芯片支撑构件的导热端子。 端子在盖的至少两侧上以间隔在各种位置从盖突出。 在元件运行期间产生的热损失在三个不同点被辐射到端子板或布线板，并且分布在大面积上。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007036293A
公开(公告)日：2007-02-08
申请号：JP2006294396
申请日：2006-10-30
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： ARNDT KARLHEINZ
CPC classification number: H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01068 , H01L2924/12041 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To guarantee improvement of heat radiation from a chip, and in that case, to prevent remarkable change in the dimension of a casing and increase in risk of delamination.
SOLUTION: An external terminal of a chip supporting member and external terminals of a first terminal portion and a second terminal portion protrude from a cover. The external terminals are initially bent toward the rear surface of a base on the outside of the base, and are bent toward the center of the base on the lower part of the base in a further extending portion, or are bent so as to separate from the base as the curved terminals. A thermal conduction terminal protrudes from the chip supporting member in two directions opposite to each other in two opposite sides of the cover in view of from the top of a conductive frame.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：为了保证芯片的热辐射的改善，并且在这种情况下，为了防止壳体尺寸的显着变化并增加分层的风险。 解决方案：芯片支撑构件的外部端子和第一端子部分和第二端子部分的外部端子从盖突出。 外部端子最初朝向基座的外侧的基部的后表面弯曲，并且在另一个延伸部分中朝向基部的下部弯曲到基部的中心，或者被弯曲以与 基座为弯曲端子。 从导电框架的顶部看，导热端子从盖片支撑构件的两个相反的两个方向在盖的两个相对侧突出。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2006157024A
公开(公告)日：2006-06-15
申请号：JP2005346116
申请日：2005-11-30
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： WOLFGANG SCHMIDT , WIRTH RALPH , STREUBEL KLAUS
CPC classification number: H01L33/105 , B82Y20/00 , H01L33/405 , H01L33/465 , H01L2924/0002 , H01S5/0217 , H01S5/0425 , H01S5/18308 , H01S5/18375 , H01S5/34326 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an improved light emission semiconductor element which is remarkably small-sized, and can be constituted so as to have a high efficiency. SOLUTION: A first mirror 7 includes a metal layer 4 and an intermediate layer 3 disposed on the opposite side to an active region 2 side of the metal layer and composed of a beam-transmissive and electrically conductive material. The light emission semiconductor element is provided to operate using an optical resonator as an RCLED (Resonant Cavity Light Emitting Diode) and to form a non-coherent beam, or is provided to operate using an external optical resonator as a VECSEL (Vertical External Cavity Surface Emitting Laser) and to form a coherent beam. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种非常小尺寸的改进的发光半导体元件，并且可以被构造成具有高效率。 解决方案：第一反射镜7包括金属层4和中间层3，该金属层4和中间层3设置在与金属层的有源区2侧相反的一侧，并由透射和导电材料构成。 发光半导体元件设置为使用光学谐振器作为RCLED（谐振腔发光二极管）进行操作并形成非相干光束，或者被提供以使用外部光学谐振器作为VECSEL（垂直外部空腔表面 发射激光）并形成相干光束。 版权所有（C）2006，JPO＆NCIPI
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95.发明专利Semiconductor substrate that emits emissive light for surface-emitting laser, and its manufacturing method 审中-公开用于表面发射激光的EMIIS发光二极管及其制造方法
公开(公告)号：JP2006074051A
公开(公告)日：2006-03-16
申请号：JP2005251976
申请日：2005-08-31
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： WOLFGANG SCHMIDT , STREUBEL KLAUS , LINDER NORBERT
IPC: H01S5/183
CPC classification number: H01S5/14 , H01S5/18308 , H01S5/2072
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor substrate for a surface-emitting laser with improved high output and current supply, a surface-emitting laser, and a method for manufacturing the semiconductor substrate, at a low technical cost.
SOLUTION: A semiconductor substrate (1), comprising an active layer (4) for causing emission light to emerge and a current supply layer (6) having a current block region (12) and a current pass region (13) and emitting emission light, having the vertical emission direction, is provided for a surface-emitting laser equipped equipped with an external resonator, and the external resonator has a predetermined resonator volume (14) that overlaps with the current passing region (13).
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：以技术上的低成本提供具有改进的高输出和电流供应的表面发射激光器的半导体衬底，表面发射激光器和半导体衬底的制造方法。 解决方案：一种半导体衬底（1），包括用于引发发射光的有源层（4）和具有电流阻挡区域（12）和电流通过区域（13）的电流供应层（6），以及 具有垂直发射方向的发射发射光被提供给配备有外部谐振器的表面发射激光器，并且外部谐振器具有与电流通过区域（13）重叠的预定谐振器体积（14）。 版权所有（C）2006，JPO＆NCIPI
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Patent Agency Ranking96.发明专利Apparatus with microoptical component arranged on substrate ,method of adjusting position of same and optical system with the apparatus 有权装配于基板上的微晶元件的装置，与装置调整其位置的方法和光学系统
公开(公告)号：JP2005338862A
公开(公告)日：2005-12-08
申请号：JP2005158061
申请日：2005-05-30
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： STEEGMUELLER ULRICH , KUEHNELT MICHAEL , SCHWARZ THOMAS
IPC: G02B26/08 , B81B3/00 , B81B7/00 , G02B6/26 , G02B6/42 , G02B7/00 , G02B7/02 , G02B27/62 , G12B5/00
CPC classification number: G02B7/003 , G02B6/4226
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus with microoptical component arranged on a substrate in which labor and time are saved for position adjustment, a method of adjusting the position of the apparatus and an optical system furnished with the apparatus.
SOLUTION: A position adjusting and connecting part is provided between a microoptical component 5 and the substrate 10, the position adjusting and connecting part has a first connection element 15 and a second connection element 20, both connection elements 15 and 20 have a first surface 15A and a second surface 20A which are fitted and in contact with each other, and the first surface 15A and the second surface 20A enables position adjustments at various relative positions.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种设置在基板上的微光学部件的设备，其中节省了人力和时间用于位置调整，一种调节设备的位置的方法和配备有该设备的光学系统。 解决方案：位置调节和连接部分设置在微光学部件5和基板10之间，位置调节和连接部分具有第一连接元件15和第二连接元件20，连接元件15和20都具有 第一表面15A和第二表面20A彼此配合和接触，并且第一表面15A和第二表面20A使得能够在各种相对位置进行位置调整。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005322922A
公开(公告)日：2005-11-17
申请号：JP2005134674
申请日：2005-05-02
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： WINDISCH REINER , WIRTH RALPH , WEGLEITER WALTER
CPC classification number: H01L33/20 , H01L33/387
Abstract: PROBLEM TO BE SOLVED: To attain improved beam emission efficiency, i.e. beam strength per unit electric power employed, of a semiconductor chip. SOLUTION: A trench defines, on the reverse side of a thin-film layer, only a single partial region which substantially does not have overlap with a front-surface contact structure, wherein on the reverse side, an electrical reverse-side contact is formed exclusively in the partial region and the trench has inner walls, slanted with respect to the principal surface of the thin-film layer serving to deflect an electromagnetic beam. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：为了获得提高半导体芯片的光束发射效率，即使用的每单位电功率的光束强度。 解决方案：沟槽在薄膜层的相反侧限定仅基本上不与前表面接触结构重叠的单个部分区域，其中在反面上具有电反向侧 接触仅形成在部分区域中，并且沟槽具有相对于用于偏转电磁束的薄膜层的主表面倾斜的内壁。 版权所有（C）2006，JPO＆NCIPI
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98.发明专利Radiation light-emitting semiconductor component element and method for fixing semiconductor chip on lead frame 审中-公开放射性发光半导体元件元件及其在引线框架上固定半导体芯片的方法
公开(公告)号：JP2005183996A
公开(公告)日：2005-07-07
申请号：JP2004368380
申请日：2004-12-20
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： PAMMER WOLFGANG , STEEGMUELLER ULRICH , HOEFER THOMAS , FRANK MELLMER
CPC classification number: H01L33/62 , H01L24/32 , H01L2924/12042 , H01L2924/181 , H01L2924/351 , H01S5/02216 , H01S5/02244 , H01S5/02248 , H01S5/02272 , H01S5/02469 , H01S5/02492 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a radiation light-emitting semiconductor component element which has improved reliability and is easily manufactured. SOLUTION: The device includes a previously produced composite-part; the composite part has a lead frame, and molded casing parts and at least one semiconductor chip on the lead frame; and the semiconductor chip is fixed on the lead frame of the composite part by high-melting-temperature brazing connection. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 解决的问题：提供一种具有提高的可靠性并容易制造的辐射发光半导体元件元件。
解决方案：该装置包括先前生产的复合部件; 所述复合部件具有引线框架，并且所述引线框架上具有模制的壳体部件和至少一个半导体芯片; 并且通过高熔点钎焊连接将半导体芯片固定在复合部件的引线框架上。 版权所有（C）2005，JPO＆NCIPI
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99.发明专利Supporting layer for semiconductor continuous layer and manufacturing method for semiconductor chip 审中-公开半导体连续层的支撑层和半导体芯片的制造方法
公开(公告)号：JP2005167239A
公开(公告)日：2005-06-23
申请号：JP2004340701
申请日：2004-11-25
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： GROETSCH STEFAN , ILLEK STEFAN , PLOESSL ANDREAS , HAHN BERTHOLD
IPC: H01L23/13 , H01L23/15 , H01L23/367 , H01L23/373 , H01L33/00 , H01L33/62 , H01L33/64 , H01S5/02 , H01S5/183
CPC classification number: H01L33/641 , H01L21/6835 , H01L23/15 , H01L23/3677 , H01L24/97 , H01L33/007 , H01L33/0079 , H01L33/62 , H01L33/647 , H01L2221/6835 , H01L2221/68363 , H01L2224/83048 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a carrier layer for a semiconductor continuous layer, which improves conformity to the semiconductor continuous layer concerning thermal expansion coefficient property. SOLUTION: An electric insulation layer 2 contains AIN or ceramics in the case of the carrier layer 1 for the semiconductor continuous layer 7 including the electric insulation layer 2 by the carrier layer 1. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种半导体连续层的载体层，其提高了与半导体连续层的热膨胀系数性质的一致性。 解决方案：在载体层1的包含电绝缘层2的半导体连续层7的载体层1的情况下，电绝缘层2含有AIN或陶瓷。版权所有（C）2005， JPO＆NCIPI
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100.发明专利
公开(公告)号：JP2004250710A
公开(公告)日：2004-09-09
申请号：JP2004043480
申请日：2004-02-19
Applicant: Osram Opto Semiconductors Gmbh , Patent Treuhand Ges Elektr Gluehlamp Mbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH , パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング
Inventor： BRAUNE BERT , ZACHAU MARTIN , ZWASCHKA FRANZ
CPC classification number: C09K11/7734 , C09K11/025 , H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a covered luminescent material stabilized in disintegration when the luminescent material is processed or when a system comprising the luminescent material is operated, and to provide a luminescent device containing the luminescent material. SOLUTION: The covered luminescent material comprises a luminescent material powder comprising luminescent material particles, wherein the thickness of the cover is 5 nm at most and especially ≤3 nm. The improvement in maintenance of the luminescent material is at least 5% after 1,000 h burning time at 80°C in 80% atmospheric moisture. COPYRIGHT: (C)2004,JPO&NCIPI
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