Abstract:
An optical semiconductor based illuminating apparatus includes a first unit which is disposed on an upper side of a housing and includes protrusions formed on a lower outer side of an optical member surrounding a semiconductor optical device and having an inclined surface inclined upwards from a lower edge of an optical member; and a second unit which accommodates and holds the first unit, so that it can reduce defect rate, improve assembly efficiency, and has excellent durability.
Abstract:
Embodiments of the invention provide an optical semiconductor illuminating apparatus. The optical semiconductor illuminating apparatus includes: a housing (100) receiving power from one side thereof and having a first area; a heat dissipation base (200) extending from the housing (100) and having a second area smaller the first area; and a light emitting module (300) including at least one optical semiconductor device (400) formed on a portion of the housing (100) and the heat dissipation base (200), and having a third area smaller than the first area and larger than the second area, wherein the housing (100) forms an overlap region having a fourth area and overlapping the light emitting module (300), and the light emitting module (300) is electrically connected to a power source (701, 702) through the overlap region.
Abstract:
Embodiments of the invention provide an optical semiconductor lighting apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.
Abstract:
A first heat sinking path is formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.
Abstract:
A light emitting diode (LED) illuminating apparatus includes a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path.
Abstract:
An adjusting unit is disposed between a housing including at least one or more semiconductor optical devices and a case accommodating an SMPS, so as to adjust the height of the casing. At least one or more light emitting modules are mounted on the bottom surface of the housing, and a position determining unit is disposed in the housing in correspondence to an edge of the light emitting module. A heat sink unit is provided in correspondence to the top surface of the housing. Therefore, transport costs can be significantly reduced by securing the loading space. The semiconductor optical devices serving as a light source can be appropriately arranged, and the semiconductor optical devices can be mounted at accurate positions. Furthermore, products can be rapidly mass-produced due to a simplified manufacturing process thereof.
Abstract:
An optical semiconductor lighting apparatus is provided. At least one or more clamping units are formed along a longitudinal direction of a race way. A first sealing unit finishes both ends of a housing attached to or detached from the clamping unit. A second sealing unit surrounds upper and lower portions of both edges of an optical member disposed on the bottom surface of the housing. A wireless communication unit receives a dimming signal through a wireless communication network, and outputs the received dimming signal to a power supply unit. The power supply unit receives an AC voltage, converts the received AC voltage into a DC voltage, and supplies the DC voltage to a light emitting module. The power supply unit controls the illuminance of the light emitting module according to the dimming signal input from the wireless communication unit. The light emitting module is connected to the power supply unit and is driven according to the control of the power supply unit.
Abstract:
Disclosed herein is an OPTICAL SEMICONDUCTOR ILLUMINATING APPARATUS capable of being simply installed and built, easily detecting a fault generation point, being simply repaired and replaced, and being compactly implemented through a structure in which a bracket assembly having a power supply embedded therein is mounted at an upper side of a heat sink including a fixed unit, the power supply is seated on the heat sink including the fixed unit, a plurality of heat radiation fins protrude from an inner surface of the heat sink, and an upper surface of the power supply is disposed at a position higher than or equal to that of an edge of an upper end portion of the heat sink.