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公开(公告)号：WO2010080492A3
公开(公告)日：2010-10-21
申请号：PCT/US2009068459
申请日：2009-12-17
Applicant: SAMTEC INC , VICICH BRIAN , MONGOLD JOHN , FAITH CHAD , NADOLNY JAMES
Inventor： VICICH BRIAN , MONGOLD JOHN , FAITH CHAD , NADOLNY JAMES
IPC: H01R13/646 , H01R13/652 , H01R13/655
CPC classification number: H01R13/658 , H01R12/57 , H01R12/7052 , H01R13/64
Abstract: An electrical connector includes a first row of contacts, a second row of contacts, a first ground plane, a second ground plane, each extending in a first direction. The first row of contacts is located closer to the first ground plane than any other ground plane in the electrical connector. The second row of contacts is located closer to the second ground plane than any other ground plane in the electrical connector. The first row of contacts, the second row of contacts, the first ground plane, and the second ground plane oppose each other such that the first row of contacts, the second row of contacts, the first ground plane, and the second ground plane are arranged with respect to each other in a second direction perpendicular or substantially perpendicular to the first direction.
Abstract translation: 一种电连接器包括第一行触头，第二行触头，第一接地面，第二接地面，每个沿第一方向延伸。 第一行触点位于比电连接器中的任何其他接地面更靠近第一接地面的位置。 第二行触点位于比电连接器中的任何其他接地面更靠近第二接地面的位置。 第一列接点，第二列接点，第一接地面以及第二接地面彼此相对，使得第一列接点，第二列接点，第一接地面及第二接地面为 在垂直于或基本垂直于第一方向的第二方向上相对于彼此布置。
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公开(公告)号：WO2010088499A3
公开(公告)日：2010-08-05
申请号：PCT/US2010/022553
申请日：2010-01-29
Applicant: SAMTEC, INC. , VICICH, Brian
Inventor： VICICH, Brian
Abstract: A method for attaching a fusible member (6) to a flexible circuit board (1) includes providing the flexible circuit board (1) including an electrode (3) and a hole (4) near each other, placing the fusible member (6) in the hole (4), and deforming the fusible member (6) to fix the fusible member (6) to the flexible circuit board (1). A flexible circuit board (1) includes an electrode (3), a hole (4), and a fusible member (6) fixed to the hole (4) and arranged to establish an electrical connection with the electrode (3) when the fusible member (6) is fused to the electrode (3).
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公开(公告)号：WO2010080492A2
公开(公告)日：2010-07-15
申请号：PCT/US2009/068459
申请日：2009-12-17
Applicant: SAMTEC, INC. , VICICH, Brian , MONGOLD, John , FAITH, Chad , NADOLNY, James
Inventor： VICICH, Brian , MONGOLD, John , FAITH, Chad , NADOLNY, James
IPC: H01R13/646 , H01R13/652 , H01R13/655
CPC classification number: H01R13/658 , H01R12/57 , H01R12/7052 , H01R13/64
Abstract: An electrical connector includes a first row of contacts, a second row of contacts, a first ground plane, a second ground plane, each extending in a first direction. The first row of contacts is located closer to the first ground plane than any other ground plane in the electrical connector. The second row of contacts is located closer to the second ground plane than any other ground plane in the electrical connector. The first row of contacts, the second row of contacts, the first ground plane, and the second ground plane oppose each other such that the first row of contacts, the second row of contacts, the first ground plane, and the second ground plane are arranged with respect to each other in a second direction perpendicular or substantially perpendicular to the first direction.
Abstract translation: 电连接器包括第一排触点，第二行触点，第一接地平面，第二接地平面，每个第一行触点沿第一方向延伸。 接触的第一行位于所述电连接器比任何其他接地平面更靠近所述第一接地平面。 接触的第二行位于所述电连接器比任何其他接地平面更靠近所述第二接地平面。 第一行触点，第二行触点，第一接地平面和第二接地平面彼此相对，使得第一行触点，第二行触点，第一接地平面和第二接地平面是 设置成相对于彼此在垂直于或基本垂直于第一方向的第二方向。
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公开(公告)号：WO2022155342A1
公开(公告)日：2022-07-21
申请号：PCT/US2022/012319
申请日：2022-01-13
Applicant: SAMTEC, INC.
Inventor： EPITAUX, Marc , BETTMAN, R., Brad
Abstract: A two-piece pluggable fiber ferrule assembly is described. The two-piece pluggable fiber ferrule assembly includes an optical fiber cable having a plurality of optical fibers, a ferrule that permanently secures the plurality of optical fibers in position relative to an alignment feature, and a rigid adaptor having a first alignment feature configured to mate with the alignment feature of the ferrule and a second alignment feature configured to mate with an optical element. The two-piece pluggable fiber ferrule assembly may be configured to mate with an optical interconnect module.
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公开(公告)号：WO2022094467A1
公开(公告)日：2022-05-05
申请号：PCT/US2021/057729
申请日：2021-11-02
Applicant: SAMTEC, INC.
Inventor： BUCK, Jonathan, E. , EPITAUX, Marc
IPC: H05K1/14 , H05K1/11 , H05K1/02 , H01L23/498
Abstract: Flex circuit embodiments are provided having high signal conductor density and high signal integrity. Electrical communication systems are described that are configured to be placed in electrical communication with the flex circuits. Electrical communication systems are described that include an electrical connector that is selectively intermatable with an electrical connector that is mounted to a flex circuit, and an electrical connector that is mounted to a substrate such as a printed circuit board (PCB).
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Patent Agency Ranking
公开(公告)号：WO2021158734A1
公开(公告)日：2021-08-12
申请号：PCT/US2021/016531
申请日：2021-02-04
Applicant: SAMTEC, INC.
Inventor： GORE, Brandon, Thomas , MELLITZ, Richard , YANG, Gauss , GARRISON, Kelly
IPC: H01R12/59 , H01R13/646 , H01R24/54 , H01R12/88
Abstract: A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.
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97.发明申请
公开(公告)号：WO2021154415A1
公开(公告)日：2021-08-05
申请号：PCT/US2020/065526
申请日：2020-12-17
Applicant: SAMTEC, INC.
Inventor： BIDDLE, Gary E.
Abstract: A receptacle includes a cage including a bezel opening and through holes and a bezel clip that is attached to the cage at the bezel opening and that includes first bezel fingers and second bezel fingers. The first bezel fingers are located along an inner surface of the cage. The second bezel fingers extend through the through holes such that outer finger portions extend along an outer surface of the cage and inner finger portions extend along the inner surface of the cage. Adjacent second bezel fingers have different lengths.
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公开(公告)号：WO2021113148A1
公开(公告)日：2021-06-10
申请号：PCT/US2020/062389
申请日：2020-11-25
Applicant: SAMTEC, INC.
Inventor： MUSSER, Randall E. , BUCK, Jonathan E.
IPC: H01R13/645 , H01R13/04
Abstract: To help maintain and improve signal integrity, an electrical connector includes a connector housing; and at least three parallel, spaced apart, immediately adjacent, linear arrays of electrical contacts.
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公开(公告)号：WO2021097062A1
公开(公告)日：2021-05-20
申请号：PCT/US2020/060186
申请日：2020-11-12
Applicant: SAMTEC, INC.
Inventor： KOZLOVSKY, Christina , SHAH, Jignesh H. , ZBINDEN, Eric J.
Abstract: An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.
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公开(公告)号：WO2021016547A1
公开(公告)日：2021-01-28
申请号：PCT/US2020/043465
申请日：2020-07-24
Applicant: SAMTEC, INC. , CHEN, Chihhao
Inventor： CHEN, Chihhao , LOY, Edwin , ZHAO, Yan, Yang
IPC: H01L23/00 , H01L23/485 , H01L23/48 , H01L23/50 , H01L23/538
Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.
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