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    METHOD OF PRODUCING IMPROVED VINYL CHLORIDE PLASTISOL COATING COMPOSITIONS
    96.
    发明专利
    METHOD OF PRODUCING IMPROVED VINYL CHLORIDE PLASTISOL COATING COMPOSITIONS 未知

    公开(公告)号：CA1141054A

    公开(公告)日：1983-02-08

    申请号：CA333566

    申请日：1979-09-04

    Applicant: DOW CORNING

    Inventor： PLUEDDEMANN EDWIN P

    IPC: C08L27/00 ,  C08K5/09 ,  C08K5/544 ,  C08L1/00 ,  C08L27/06 ,  C09D127/04 ,  C09D127/06 ,  C09D175/00 ,  C08K5/54 ,  C09D3/74

    Abstract: A method is disclosed for producing an improved polyvinyl chloride plastisol or organosol coating composition having improved adhesion to glass, metal or fabrics. The composition is obtained by adding to the plastisol or organosol from 0.1 to 2 weight percent of a devolatilized product of hydrolysis of an aminofunctional organotrialkoxysilane of the formula (RO)3SiCH2CH2CH2NH(CH2CH2NH)xH wherein R is a monovalent alkyl radical of from 1 to 3 carbon atoms and x is zero or 1. The silane is hydrolized with at least 0.5 moles of water per mole of silane. The compositions are stabilized in respect to viscosity by including 0.5 to 1.1 mole per mole or primary amino group in the hydrolized silane product of a compatible carboxylic acid boiling above 150.degree.C at atmospheric pressure.

    100.
    发明专利
    未知

    公开(公告)号：DE1268763B

    公开(公告)日：1968-05-22

    申请号：DE1268763

    申请日：1962-02-02

    Applicant: DOW CORNING

    Inventor： PLUEDDEMANN EDWIN P

    IPC: C03C25/40 ,  C07F7/02 ,  C08G8/00 ,  C08G59/14 ,  C08G59/30 ,  C08G59/32 ,  C08L67/06 ,  C09D167/00

    Abstract: The invention comprises silylated polyepoxides characterized in that there are at least 3 epoxy radicals per molecule and that the Si atoms are attached to the epoxide moiety through Si-C bonds. The organosilyl radicals can be in which R is any alkyl or alkenyl radical of less than 4 C atoms or any monocarboxy acyl radical of less than 4 C atoms, e.g. methyl, ethyl, propyl, allyl, formyl, acetyl or propionyl. The compounds can be made either (1) by reacting silanes of the formula (RO)3-n (n=0, 1 or 2) with polyepoxides containing C=C unsaturation, e.g. by heating at 50 DEG to 150 DEG C. in the presence of colloidal Pt or an organic peroxide, or (2) by reacting silanes of the above formula except that H is replaced by an alkenyl radical, with unsaturated polyepoxides, e.g. in the presence of an organic peroxide. The silane can graft to the epoxide as a monomer, or the alkenylsilane can first form a polymer (via alkenyl polymerization) which grafts to the epoxide. The polyepoxides used for the silylation have at least one C=C linkage and at least 3 epoxy radicals per molecule, and are best prepared by polymerizing conjugated olefins, such as butadiene or isoprene, and heating the resulting polymers with peracids, such as peracetic acid. In a typical example (1), trimethoxy silane and a dimethylphthalate solution of chloroplatinic acid were added to a toluene solution of an epoxidized polybutadiene, and the mixture was refluxed for 5 hours with subsequent removal of solvent and unreacted silane to yield a clear, viscous, oily product containing an average of 1 trimethoxy per 7 epoxy groups and per 5 unreacted C=C groups. Uses: for sizing (as by dipping, spraying or brushing) siliceous materials, such as glass asbestos, silica, aluminium silicate and magnesium aluminium silicate, in the form of solid sheets, fibres or woven fabrics or in particulated form, the sized material being subsequently dried and heated for 1-10 minutes at 65 DEG to 95 DEG C., prior to mixing with an organic moulding resin. Alternatively the silylated compounds can be mixed with the organic resins and thereafter add the siliceous material. Organic resins specific are styrene, vinyl chloride, methylacrylate, methylmethacrylate, copolymers of epichlorohydrin and bis-(parahydroxyphenyl)-dimethylmethane, copolymers of maleic anhydride with propylene glycol and mixtures of polyester resins with vinylic resins. They can also be used to modify conventional epoxy resins for use as protective coatings and electrical varnishes, and can be used per se as laminating resins.

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