Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition having good pattern formation and pattern collapse performance in normal exposure (dry exposure), liquid immersion exposure and double exposure, and to provide a pattern forming method using the positive resist composition, and a compound used for the positive resist composition. SOLUTION: The positive resist composition contains (A) a compound generating acid by irradiation with active light or radiation, (B) a resin increasing solubility to alkali developing solution by action of acid, and (C) a compound having a specific aromatic ring structure, decomposed by action of acid and generating acid. The pattern forming method using the positive resist composition and the compound used for the positive resist composition are provided. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition having good sensitivity and line edge roughness in normal exposure (dry exposure), liquid immersion exposure and double exposure, and to provide a pattern forming method using the positive resist composition. SOLUTION: The positive resist composition contains (A) diaryl iodonium salt having an electron donar group on an aryl ring, and (B) a resin increasing solubility to alkali developing solution by action of acid. The pattern forming method uses the positive resist composition. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for stably forming a high-accuracy fine pattern to be used in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, a resin composition to be used in the method and a developing solution to be used in the method. SOLUTION: The pattern forming method includes: (1) coating a resist composition that decreases the solubility in a negative developing solution upon irradiation with actinic rays or radiation; (2) exposing; and (3) developing with a negative developing solution. There are also provided the resist composition to be used in the method and the developing solution and a rinsing solution to be used in the method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treating agent for a freezing process by which when a first resist pattern is formed on a first resist film, a second resist film is formed on the first resist pattern and in order to form a second resist pattern, the first resist pattern is chemically treated to change properties so that it is not dissolved in a second resist liquid, wherein the surface treating agent is used for chemically treating the first resist pattern so as to satisfy the requirements that the first resist pattern does not dissolve in the second resist liquid, the dimensions of the first resist pattern undergo no change, and the first and second resist patterns have the same dry etching resistance, and a pattern forming method using the surface treating agent. SOLUTION: The surface treating agent for pattern formation contains a polyhydric alcohol compound. The pattern forming method using the surface treating agent is also provided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resist composition having improved line edge roughness not only in ordinary exposure (dry exposure) but also in immersion exposure, little in falling down of resist pattern due to PED between exposure and PEB and deterioration in profile, restrained in generation of scum, and good in the following ability of an immersion liquid at immersion exposure, and a pattern-forming method with the resist composition. SOLUTION: The resist composition is provided which comprises: (A) a resin with solubility in an alkali developer increased by action of an acid; (B) a compound generating an acid upon irradiation with actinic ray or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein the resin (C) has a degree of molecular weight dispersion of ≤1.3 and a weight average molecular weight of ≤1.0×10 4 . The pattern-forming method with the resist composition is provided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition simultaneously satisfying high sensitivity, high resolution, excellent pattern shape and line edge roughness. SOLUTION: The positive resist composition contains (Z) a compound having sulfonium cation having a structure expressed by general formula (Z-I), and (T) a low molecule compound increasing solubility to an alikali developer by action of acid. A pattern forming method using the positive resist composition is provided. In the general formula (Z-I), Y 1 -Y 13 each denote a hydrogen atom or a substitution group, and may be coupled by adjacent ones to form a ring. Z is single coupling or a bivalent coupling group. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive composition which is improved in line edge roughness, pattern profile, EUV light exposing sensitivity, and dissolution contrast, and is used in manufacturing processes of semiconductors such as ICs, circuit boards for such as liquid crystals and thermal heads, and in other photofabrication processes, and also provide a pattern forming method using this composition. SOLUTION: This photosensitive composition contains compounds of specific structures, and this pattern forming method uses this photosensitive composition. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive composition allowing good pattern shape and line edge roughness in normal exposure (dry exposure), liquid immersion exposure and double exposure; a pattern formation method using the photosensitive composition; and a compound used in the photosensitive composition.SOLUTION: A photosensitive composition is characterized by containing a repeating unit corresponding to a compound represented by the general formula (I) and containing a resin (A) generating an acid group by irradiation with active rays or radial rays.
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured relief pattern which has a lithography performance excellent in resolution and sensitivity and prevents the warpage of a wafer through low-temperature curing, and to provide a relief pattern forming material using the photosensitive resin composition, a photosensitive film, a polyimide film, a cured relief pattern, a method for manufacturing the cured relief pattern, and a semiconductor device including the cured relief pattern.SOLUTION: A photosensitive resin composition contains (a) a resin having a repeating unit represented by formula (1), and (b) a compound for generating an acid by irradiation of active rays or radiation. In the formula (1), Rrepresents a bivalent organic group. A plurality of Rmay be the same or different from one another. At least one Rout of the plurality of Ris a bivalent organic group having an alicyclic group. Reach independently represents a hydrogen atom or an organic group. At least one -CORout of the plurality of -CORis a group which is decomposed by the action of an acid to generate an alkaline soluble group.
Abstract translation:解决的问题:提供能够形成固化浮雕图案的感光性树脂组合物,其具有分辨率和灵敏度优异的光刻性能,并且通过低温固化来防止晶片的翘曲,并提供浮雕图案 使用感光性树脂组合物的成膜材料,感光性膜,聚酰亚胺膜,固化浮雕图案,固化浮雕图案的制造方法以及包括固化浮雕图案的半导体器件。 解决方案:感光性树脂组合物含有(a)具有由式(1)表示的重复单元的树脂和(b)通过活性射线或辐射的照射产生酸的化合物。 在式(1)中,R 2 SP>表示二价有机基团。 多个R 2 SP>可以彼此相同或不同。 多个R 2中的至少一个R 2 SP>是具有脂环族基团的二价有机基团。 R 3 SP>各自独立地表示氢原子或有机基团。 在多个-CO 2 SP>中的至少一个-CO 2 SB> R 3 < SB> R 3 SP>是通过酸的作用分解产生碱溶性基团的基团。 版权所有(C)2013,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a near-infrared ray cut filter that is thin and has excellent heat resistance and spectral properties.SOLUTION: A near-infrared ray cut filter includes a near-infrared reflectance layer comprising a polyimide resin film and a dielectric multilayer, in which the thickness of the polyimide resin film is equal to or less than 80 μm.