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    FIRING SIGNAL FORWARDING IN A FLUID EJECTION DEVICE
    93.
    发明授权
    FIRING SIGNAL FORWARDING IN A FLUID EJECTION DEVICE 有权
    CAMERA声音传输中的液体喷射装置

    公开(公告)号：EP2252465B1

    公开(公告)日：2015-05-06

    申请号：EP08743795.0

    申请日：2008-03-12

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： MARTIN, Eric ,  CUMBIE, Michael W. ,  MACKENZIE, Mark H. ,  SMEKTALA, Volker ,  SHEPHERD, Matthew A.

    IPC: B41J2/05 ,  B41J29/38 ,  B41J2/175

    CPC classification number: B41J2/1753 ,  B41J2/04528 ,  B41J2/04543 ,  B41J2/0458 ,  B41J2/04588 ,  B41J2/04591 ,  B41J2/04598

    Abstract: A fluid ejection device has a nozzle group with a plurality of nozzle circuits and a fire controller in electronic communication with the plurality of nozzle circuits. The fire controller includes a fire data input for receiving fire data, a warm data input for receiving warm data, and a firing signal input for receiving a firing signal having a firing pulse preceded by a warming pulse. The fire controller is operable to conditionally modify the firing signal according to a state of warm data received via the warm data input and a state of fire data received via the fire data input. The fire controller is operable to forward the conditionally modified firing signal to one of the plurality of nozzle circuits to pass a current representative of the conditionally modified firing signal through a firing element of the particular nozzle circuit. Conditionally modifying the firing signal comprises either not modifying the firing signal, blocking the firing pulse and not blocking the warming pulse or blocking the firing pulse and the warming pulse.

    THERMAL FLUID-EJECTION DEVICE DIE
    94.
    发明授权
    THERMAL FLUID-EJECTION DEVICE DIE 有权
    CHIP热流体喷射装置

    公开(公告)号：EP2342082B1

    公开(公告)日：2013-12-18

    申请号：EP08877892.3

    申请日：2008-10-31

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： VAN BROCKLIN, Andrew L. ,  BAKKER, Chris ,  HUNTER, Mark ,  MARTIN, Eric

    IPC: B41J2/05 ,  B41J2/01

    CPC classification number: B41J2/0458 ,  B41J2/04541 ,  B41J2/04548 ,  B41J2/0455

    Abstract: A die for a thermal drop-on-demand fluid-ejection device includes thermal firing resistors, low-side switches, and high-side switches. The thermal firing resistors are organized over resistor groups such that each thermal firing resistor is located within only one of the resistor groups. The resistor groups are lesser in number than the thermal firing resistors. Each thermal firing resistor has a first end and a second end. The low-side switches are equal in number to the thermal firing resistors. Each low-side switch connects the second end of a corresponding thermal firing resistor to a low voltage. The high-side switches are equal in number to the resistor groups. Each high-side switch connects the first ends of the thermal firing resistors of a corresponding resistor group to power providing a voltage greater than the low voltage.

    CONTROL CIRCUIT FOR OVERCOMING STICTION
    96.
    发明公开
    CONTROL CIRCUIT FOR OVERCOMING STICTION 审中-公开
    控制电路，克服了微机电系统中的粘附

    公开(公告)号：EP1949357A1

    公开(公告)日：2008-07-30

    申请号：EP06788734.9

    申请日：2006-07-29

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： MARTIN, Eric ,  PIEHL, Arthur

    IPC: G09G3/34

    CPC classification number: B81C1/00968 ,  G02B26/001 ,  G09G3/2011 ,  G09G3/3466 ,  G09G2310/0251 ,  G09G2310/06 ,  G09G2320/0693

    Abstract: A circuit (30) and method for controlling a micro-electromechanical system (10) is herein disclosed. In one embodiment of a micro-electromechanical system (10) having top (16) and bottom (14) capacitor plates with a pixel plate (18) movably positioned therebetween, a release voltage sufficient to overcome stiction forces adhering the pixel plate (18) to one of the capacitor plates (14, 16) is applied to the pixel plate (18) to cause the pixel plate (18) to be attracted to the capacitor plate (14, 16) opposite the capacitor plate (14, 16) to with which the pixel plate (18) is in contact. After the pixel plate (18) has moved a predetermined distance away from the capacitor plate (14, 16) to which it had been adhered by stiction forces, the release voltage is removed. Thereafter, a positional voltage is applied to the pixel plate (18) to move the pixel plate (18) to a desired location between the capacitor plates (14, 16). Release and positional voltages are coupled to and decoupled from the pixel plate (18) by one or more switching mechanisms (32, 34).

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