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91.发明申请公开(公告)号：US20180342472A1
公开(公告)日：2018-11-29
申请号：US15771982
申请日：2015-12-22
Applicant: Intel Corporation
Inventor： Georgios C. DOGIAMIS , Telesphor KAMGAING , Javier A. FALCON , Yoshihiro TOMITA , Vijay K. NAIR
Abstract: Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.
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公开(公告)号：US20180316375A1
公开(公告)日：2018-11-01
申请号：US15769723
申请日：2015-12-08
Applicant: Intel Corporation
Inventor： Telesphor KAMGAING , Richard J. DISCHLER
IPC: H04B1/18 , H01L23/498 , H01L25/16 , H01P5/08 , H01P3/16 , H01L23/66 , H01P1/24 , H01L23/367 , H01L25/065 , H05K1/18 , H05K1/14
CPC classification number: G06F1/16 , H05K1/0274 , H05K1/147 , H05K2201/045 , H05K2201/046
Abstract: Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.
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公开(公告)号：US20180315690A1
公开(公告)日：2018-11-01
申请号：US15773030
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Mathew J. MANUSHAROW , Krishna BHARATH , William J. LAMBERT , Robert L. SANKMAN , Aleksandar ALEKSOV , Brandon M. RAWLINGS , Feras EID , Javier SOTO GONZALEZ , Meizi JIAO , Suddhasattwa NAD , Telesphor KAMGAING
CPC classification number: H01F27/40 , H01F17/0006 , H01L28/00
Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.
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公开(公告)号：US20180286834A1
公开(公告)日：2018-10-04
申请号：US15476872
申请日：2017-03-31
Applicant: INTEL CORPORATION
Inventor： Fay HUA , Telesphor KAMGAING , Johanna M. SWAN
CPC classification number: H01L25/0657 , H01L21/022 , H01L23/293 , H01L23/3128 , H01L23/3192 , H01L23/481 , H01L23/64 , H01L23/66 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/50 , H01L2223/6677 , H01L2224/02311 , H01L2224/02313 , H01L2224/02315 , H01L2224/02372 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/05164 , H01L2224/06181 , H01L2224/16113 , H01L2224/16146 , H01L2224/16148 , H01L2224/16225 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01029 , H01L2924/1903 , H01L2924/19041 , H01L2924/19042 , H01L2924/00014
Abstract: Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.
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公开(公告)号：US20180212322A1
公开(公告)日：2018-07-26
申请号：US15745681
申请日：2015-09-24
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Telesphor KAMGAING , Sasha N. OSTER , Georgios C. DOGIAMIS
CPC classification number: H01Q1/521 , H01Q1/2266 , H01Q1/2283 , H01Q1/38 , H01Q1/525 , H01Q21/28
Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.
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Patent Agency Ranking
公开(公告)号：US20170288635A1
公开(公告)日：2017-10-05
申请号：US15088814
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Feras EID , Baris BICEN , Telesphor KAMGAING , Vijay K. NAIR , Johanna M. SWAN , Georgios C. DOGIAMIS , Valluri R. RAO
CPC classification number: H03H9/02259 , H03H9/17 , H03H9/2463 , H03H2009/02291 , H03H2009/155
Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.
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公开(公告)号：US20170286731A1
公开(公告)日：2017-10-05
申请号：US15586820
申请日：2017-05-04
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Telesphor KAMGAING , Feras EID , Vijay K. NAIR , Georgios C. DOGIAMIS , Johanna M. SWAN , Valluri R. RAO
CPC classification number: G06K7/10297 , G06K7/10316 , G06K19/0672 , G06K19/0675 , H03H9/30
Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.
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公开(公告)号：US20240006336A1
公开(公告)日：2024-01-04
申请号：US17852816
申请日：2022-06-29
Applicant: Intel Corporation
Inventor： Telesphor KAMGAING , Chu Aun LIM , Eng Huat GOH , Min Suet LIM , Kavitha NAGARAJAN , Jooi Wah WONG , Chee Kheong YOON
IPC: H01L23/552 , H01L23/538 , H01L21/48
CPC classification number: H01L23/552 , H01L23/5386 , H01L21/4846 , H01L24/16
Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes for stiffeners for a surface of a package substrate, where the stiffeners provide EMI/RFI shielding for signal traces or other electrical routings within the package, and in particular for traces at a surface of the package such as microstrip routings. Other embodiments may be described and/or claimed.
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公开(公告)号：US20230420345A1
公开(公告)日：2023-12-28
申请号：US17849352
申请日：2022-06-24
Applicant: Intel Corporation
Inventor： Kavitha NAGARAJAN , Min Suet LIM , Eng Huat GOH , Telesphor KAMGAING , Chee Kheong YOON , Jooi Wah WONG , Chu Aun LIM
IPC: H01L23/498 , H01L23/00 , H01L25/16 , H01L23/64 , H01L23/13
CPC classification number: H01L23/49816 , H01L24/16 , H01L25/16 , H01L23/49833 , H01L23/49838 , H01L23/642 , H01L23/13 , H01L2924/3511 , H01L2924/19041 , H01L2224/16227 , H01L2224/16237 , H01L23/49822
Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodiment, a ring is provided under the package substrate. In an embodiment, the ring comprises a conductive material. In an embodiment, the electronic package further comprises balls outside of the ring.
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公开(公告)号：US20230420342A1
公开(公告)日：2023-12-28
申请号：US17848607
申请日：2022-06-24
Applicant: Intel Corporation
Inventor： Min Suet LIM , Kavitha NAGARAJAN , Eng Huat GOH , Telesphor KAMGAING
IPC: H01L23/498 , H01L25/065 , H01L25/10 , H01L21/48
CPC classification number: H01L23/49805 , H01L25/0657 , H01L25/105 , H01L21/4853 , H01L2225/0652 , H01L2225/0651
Abstract: Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substrate. Providing power and/or ground in this manner enables fewer layers to be used in a substrate that are no longer needed to be routed in the power plane on the substrate, thus reducing a Z-height of the package. Other embodiments may be described and/or claimed.
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