Abstract:
The invention relates to an optoelectronic device for radiating mixed light in a first wavelength range and a second wavelength range different from the first wavelength range, comprising a first or second semiconductor light source (1, 2) having a first or second light-emitting diode (11, 21), which radiates light having a first or second characteristic wavelength in the first or second wavelength range and having a first or second intensity when a first or second current (41, 42) is applied, an optical sensor (3) for converting a part (110, 510) of the respective radiated light from the semiconductor light sources (1, 2) into a first or second sensor signal (341, 342), and a control device (4) for controlling the first and second currents (41, 42) according to the first and second sensor signals (341, 342), wherein the characteristic wavelengths and intensities of the respective light radiated by the first and second semiconductor light sources (1, 2) have a first temperature- and/or current- and/or aging-dependence or second temperature- and/or current- and/or aging dependence (931, 932, 941, 942) different from the first temperature- and/or current- and/or aging-dependence, the optical sensor (3) has a first or second wavelength-dependent sensitivity in the first or second wavelength range, wherein said first and second wavelength-dependent sensitivities are adapted to the first and second temperature dependences (931, 932, 941, 942), and the control device (4) controls the first and second currents (41, 42) in such a way that there is a predetermined ratio of the first to the second sensor signal (341, 342).
Abstract:
The invention relates to an optoelectronic component (1) comprising a connection support (2), on which at least two radiation-emitting semiconductor chips (3) are located and a conversion element (4) that is fixed to the connection support (2), said conversion element (4) spanning the semiconductor chips (3) in such a way that the chips (3) are surrounded by the conversion element (4) and the connection support (2). At least two of the radiation-emitting semiconductor chips (3) differ from one another with respect to the wavelengths of the electromagnetic radiation that they emit during operation.
Abstract:
The invention relates to a luminescence diode chip comprising a semiconductor body (1) producing radiation having a first wavelength, a luminescence conversion element (5) that produces radiation having a second wavelength from the radiation having the first wavelength, and an angle filter element (4) that reflects radiation that impacts said angle filter element at a particular angle relative to a primary emission direction back in the direction of the semiconductor body.
Abstract:
The invention relates to an LED semiconductor element comprising at least one first radiation-generating active layer and at least one second radiation-generating active layer which is stacked on top of the first active layer in a vertical direction and is serially connected to the first active layer. The first active layer and the second active layer are connected in an electrically conducting manner by means of a contact zone. The invention further relates to different uses of said LED semiconductor element.
Abstract:
The invention relates to an LED semiconductor body (1) comprising at least two radiation-generating active layers (2, 3) which each have a forward voltage (ULED). The number of active layers is adapted to an operating voltage (UB) in such a way that the maximum voltage (UW) falling on a series resistor (10) mounted in series in relation to the active layers (2, 3) is no higher than a voltage (UH) falling on the LED semiconductor body (1). The invention also relates to different uses of the LED semiconductor body.
Abstract:
The invention relates to a method for producing at least one area (8) having reduced electrical conductivity within an electrically conducting III-V semiconductor layer (3). The inventive method is characterized in that a ZnO layer (1) is applied to the area (8) of the semiconductor layer (3) and is then preferably annealed at a temperature ranging from 300 °C to 500 °C. The ZnO layer (1) is preferably deposited onto the III-V semiconductor layer (3) at a temperature of less than 150 °C, preferably between and including 25 °C and including 120 °C. The area (8) having reduced electrical conductivity is preferably disposed in a radiation-emitting optoelectronic component between the active zone (4) and a connecting contact (7), thereby reducing current injection into the areas of the active zone (4) opposite the connecting contact (7).
Abstract:
The invention relates to a method for roughening a surface of a body (1), comprising the following steps: coating the surface with a mask layer (2); applying pre-shaped mask bodies (3) to the mask layer (2); etching though the mask layer at locations that are not covered by mask bodies (3), and; etching the body (1) at locations of its surface that are not covered by the mask layer (2). The invention also relates to an optoelectronic component. By using the mask layer (2) as an additional auxiliary mask, methods having a low selectivity with regard to polystyrene balls can be used for etching.
Abstract:
According to the invention, a textured coupling-out layer (6) with flanks (16) is located on an upper surface. Said flanks are aligned at an angle of between 60° and 88° in relation to the layer plane and form the boundaries of the coupling-out regions that are offset in relation to one another and are provided for emitting the radiation. The portions of the coupling-out layer that are located in the coupling-out regions can take the form of flat truncated cones and their flanks can be fluted or serrated, in order to increase the probability that the generated radiation strikes the external limiting surface of the coupling-out layer at a steeper angle than the critical angle of the total internal reflection.