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公开(公告)号：EP4529727A1
公开(公告)日：2025-04-02
申请号：EP22942984.0
申请日：2022-05-23
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , XU, Yongjun
IPC: H04N7/18
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公开(公告)号：EP4479831A1
公开(公告)日：2024-12-25
申请号：EP22925429.7
申请日：2022-02-14
Applicant: Qualcomm Incorporated
Inventor： ZHANG, Nan , XU, Yongjun
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公开(公告)号：EP4449402A1
公开(公告)日：2024-10-23
申请号：EP21967752.3
申请日：2021-12-17
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , DU, Bo , XU, Yongjun
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公开(公告)号：EP4424027A1
公开(公告)日：2024-09-04
申请号：EP21961781.8
申请日：2021-10-28
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , XU, Yongjun , FU, Weipeng
IPC: H04R1/10
CPC classification number: H04R1/1025 , H04R25/305 , H04R25/554
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公开(公告)号：EP4420071A1
公开(公告)日：2024-08-28
申请号：EP21802589.8
申请日：2021-10-19
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , STERNBERG, Mark , XU, Yongjun
CPC classification number: G06T9/00 , H04N19/40 , H04N21/440218 , H04N21/431 , H04N19/42
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Patent Agency Ranking
公开(公告)号：EP4393260A1
公开(公告)日：2024-07-03
申请号：EP21783388.8
申请日：2021-08-23
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , ZHAO, Junzhi , XU, Yongjun
CPC classification number: H04B15/00 , H04W88/06 , H04W72/541
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公开(公告)号：EP4237929A1
公开(公告)日：2023-09-06
申请号：EP20959035.5
申请日：2020-10-28
Applicant: QUALCOMM Incorporated
Inventor： ZHANG, Nan , XU, Yongjun , YAO, Wenkai
IPC: G06F1/32 , G06F1/3234
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公开(公告)号：EP4226359A1
公开(公告)日：2023-08-16
申请号：EP20956497.0
申请日：2020-10-09
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , XU, Yongjun , YAO, Wenkai
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公开(公告)号：EP4196977A1
公开(公告)日：2023-06-21
申请号：EP20949699.1
申请日：2020-08-17
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , ZHAO, Junzhi , XU, Yongjun
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公开(公告)号：EP4158949A1
公开(公告)日：2023-04-05
申请号：EP20937696.1
申请日：2020-05-25
Applicant: QUALCOMM INCORPORATED
Inventor： ZHANG, Nan , HUI, Chaofeng , XU, Yongjun
IPC: H04W40/02
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