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公开(公告)号：US20030043415A1
公开(公告)日：2003-03-06
申请号：US09320686
申请日：1999-05-27
Inventor： DOUGLAS E. PROCTOR
IPC: H04N001/00
CPC classification number: H01L27/14825 , H01L27/14868 , H04N1/03 , H04N1/1903 , H04N1/1933 , H04N1/1934 , H04N5/3692 , H04N2201/02487
Abstract: The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention relates to preferably providing a supplemental chip in each abutment region to enhance image quality.
Abstract translation: 本发明涉及用于从原始图像产生电信号的感光芯片，例如在数字扫描仪，复印机，传真机或其他文件生成或再现装置中可以找到。 更具体地，本发明涉及优选地在每个邻接区域中提供补充芯片以增强图像质量。
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公开(公告)号：US5621206A
公开(公告)日：1997-04-15
申请号：US468911
申请日：1995-06-06
Applicant: Masashi Kitani , Toyoki Matsushima , Tetsuya Shimada , Makoto Ogura , Masayoshi Murata , Katsumi Komiyama , Tomokazu Dainobu
Inventor： Masashi Kitani , Toyoki Matsushima , Tetsuya Shimada , Makoto Ogura , Masayoshi Murata , Katsumi Komiyama , Tomokazu Dainobu
CPC classification number: H04N1/0316 , B41J2/01 , H04N1/0313 , H04N1/1215 , H04N2201/02487 , Y10S425/808
Abstract: A method of producing an optical device, includes the steps of forming a space between an optical member and a first mold and a second mold by arranging the optical member between the first mold and the second mold, at least either the first or second mold is arranged to touch one surface of the optical member. A resin member is injected through an injection port provided with the first or second mold in the formed space.
Abstract translation: 一种光学装置的制造方法，其特征在于，包括以下步骤：在所述第一模具和所述第二模具之间配置所述光学构件，在所述光学构件与所述第一模具和第二模具之间形成空间，所述第一模具或所述第二模具中的至少一个为 布置成接触光学构件的一个表面。 通过设置有第一或第二模具的注入口在形成的空间中注入树脂构件。
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93.发明授权Photoelectric converting device having original conveyance guide and an image processing apparatus incorporating the device 失效具有原始输送引导件的光电转换装置和结合该装置的图像处理装置
公开(公告)号：US5196691A
公开(公告)日：1993-03-23
申请号：US616921
申请日：1990-11-21
Applicant: Masashi Kitani , Toyoki Matsushima , Tetsuya Shimada , Makoto Ogura , Masayoshi Murata , Katsumi Komiyama , Tomokazu Dainobu
Inventor： Masashi Kitani , Toyoki Matsushima , Tetsuya Shimada , Makoto Ogura , Masayoshi Murata , Katsumi Komiyama , Tomokazu Dainobu
CPC classification number: H04N1/0316 , B41J2/01 , H04N1/0313 , H04N1/1215 , H04N2201/02487 , Y10S425/808
Abstract: A photoelectric converting device having a guide member includes a plurality of photoelectric converting elements disposed to confront an original sheet the image information of which is to be read; a protection layer disposed on the photoelectric converting elements; a light transmissive substrate on which the photoelectric converting elements are disposed; and a flexible guide member disposed on the original-sheet supply side of the light transmissive substrate, the guide member being disposed in such a manner that at least a portion of the guide is positioned in contact with the edge surface of the light transmissive substrate.
Abstract translation: 具有引导构件的光电转换装置包括：多个光电转换元件，设置成面对要读取的图像信息的原稿; 设置在所述光电转换元件上的保护层; 设置光电转换元件的透光基板; 以及柔性引导构件，其设置在所述透光基板的原稿供给侧上，所述引导构件以使得所述引导件的至少一部分定位成与所述透光性基板的边缘面接触的方式配置。
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公开(公告)号：US4987477A
公开(公告)日：1991-01-22
申请号：US430419
申请日：1989-11-02
Applicant: Masahiko Ikeno
Inventor： Masahiko Ikeno
IPC: H01L23/538 , H01L25/065 , H01L27/14 , H01L27/146 , H01L27/148 , H04N1/028 , H04N1/03 , H04N5/335 , H04N5/369 , H04N5/372
CPC classification number: H04N1/1934 , H01L23/5385 , H01L25/0655 , H01L27/14825 , H04N1/03 , H01L2224/05554 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/12043 , H01L2924/16152 , H01L2924/19107 , H04N2201/02487
Abstract: A solid state imaging device has solid-state imaging-device chips each having a picture-element array and bonding pads, chip carriers each having long sides longer than the solid-state imaging-device chip and terminals electrically connected to corresponding bonding pads on the chip, a package board which carries the chip carriers, and external leads provided on the package board and electrically connected to the respective terminals of the chip carriers. In a method of assembling such a solid state imaging device, a plurality of solid-state imaging-device chips are mounted on respective chip carriers, and a plurality of imaging units are formed by electrically connecting the terminals of each chip carrier to the corresponding bonding pads. The imaging units are then arranged on the package board and the terminals of the imaging units are connected to the external leads, respectively. A test is conducted on the solid-state imaging-device chips of each imaging unit, and if a non-conforming chip is found, an imaging unit including the non-conforming chip is removed from the package board and a new imaging unit is secured to the package board in place of the removed chip.
Abstract translation: 固态成像装置具有各自具有像素阵列和接合焊盘的固态成像器件芯片，每个芯片载体的长边长于固态成像器件芯片，并且端子电连接到固态成像器件芯片上的相应的焊盘 芯片，承载芯片载体的封装板，以及设置在封装板上并电连接到芯片载体的各个端子的外部引线。 在组装这种固态成像装置的方法中，将多个固态成像装置芯片安装在各个芯片载体上，并且通过将每个芯片载体的端子电连接到相应的键合而形成多个成像单元 垫 然后将成像单元布置在封装板上，并且成像单元的端子分别连接到外部引线。 对每个成像单元的固态成像器件芯片进行测试，并且如果发现不合格的芯片，则从封装板去除包括不合格芯片的成像单元，并且固定新的成像单元 到包装板代替去除的芯片。
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公开(公告)号：US4959541A
公开(公告)日：1990-09-25
申请号：US389033
申请日：1989-08-03
Applicant: David W. Boyd
Inventor： David W. Boyd
CPC classification number: H04N1/00013 , G02B5/005 , H04N1/00031 , H04N1/00053 , H04N1/00082 , H04N1/03 , H04N2201/02487 , H04N2201/02493
Abstract: A mathematical method for selecting the shape for an occluding aperture which is to be positioned at a predetermined aperture location in a light path extending between an illuminated line object and a linear photosensor array. Through use of the aperture selected according to the method, a light intensity measurement is obtained across the linear photosensor array which is uniformly proportional to the light intensity across the illuminated line object.
Abstract translation: 一种数学方法，用于选择要被定位在在照明线对象和线性光电传感器阵列之间延伸的光路中的预定光圈位置的闭塞孔的形状。 通过使用根据该方法选择的孔径，在与光照线对象上的光强度成正比的线性光电传感器阵列上获得光强度测量。
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Patent Agency Ranking
公开(公告)号：US4901207A
公开(公告)日：1990-02-13
申请号：US204502
申请日：1988-06-09
Applicant: Naoki Sato , Teruo Tsutsumi , Masaaki Katoh
Inventor： Naoki Sato , Teruo Tsutsumi , Masaaki Katoh
IPC: B41J2/44 , B41J2/45 , B41J2/455 , F21S8/00 , F21V8/00 , G02B6/00 , G02B6/04 , G09F9/33 , H01L25/075 , H01L33/58 , H04N1/028
CPC classification number: H04N1/02815 , B41J2/45 , H04N1/02865 , H04N1/0289 , F21V2200/20 , F21W2111/00 , F21Y2101/00 , G02B6/0001 , H01L25/0753 , H01L2924/0002 , H01L33/58 , H04N2201/02487 , Y10S359/90 , Y10S362/80
Abstract: A light emission element array comprises a substrate, a plurality of light emission elements such as light emitting diodes aranged linearly in a row on the substrate and a rod like, i.e., columnar, light converging lens unit arranged above the light emission element row in parallel thereto and adapted to diffuse and simultaneously converge the transmitted light. The light emitting surface of the light converging lens unit is made rough by a chemical treatment, blast treatment or other means.
Abstract translation: 发光元件阵列包括基板，多个发光元件，例如在基板上排列成一行的发光二极管，以及平行布置在发光元件列上方的柱状的柱状聚光透镜单元 适于扩散并同时会聚透射光。 聚光透镜单元的发光面通过化学处理，喷砂处理或其他方式变得粗糙。
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公开(公告)号：KR1020150064174A
公开(公告)日：2015-06-10
申请号：KR1020157011453
申请日：2013-10-04
Applicant: 캐논 가부시끼가이샤
CPC classification number: G02B3/0062 , G02B3/0031 , G02B3/0056 , G03G15/04 , H04N1/0312 , H04N1/192 , H04N2201/0081 , H04N2201/0082 , H04N2201/02487
Abstract: 결상광학계는제1 방향으로배열된복수의렌즈광학계를각각포함하는복수의렌즈광학계열을포함한다. 상기복수의렌즈광학계열은상기제1 방향및 광축방향에수직인제2 방향으로배열된다. 상기복수의렌즈광학계열 각각의상기복수의렌즈광학계각각은, 제2 방향에수직인단면내에서는정립등배상을형성하도록구성되고, 상기제1 방향에수직인단면내에서는도립상을형성하도록구성된다. 광축방향에수직인단면내에서, 상기복수의렌즈광학계열 중인접하는렌즈광학계열 내의복수의렌즈광학계각각의광축은, 제1 방향으로서로이격하며, 동일한선 상에위치한다.
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公开(公告)号：KR1019920001407B1
公开(公告)日：1992-02-13
申请号：KR1019880006879
申请日：1988-06-09
Applicant: 가부시끼가이샤 도시바 , 샤프 가부시키가이샤
CPC classification number: H04N1/02815 , B41J2/45 , F21V2200/20 , F21W2111/00 , F21Y2115/10 , G02B6/0001 , H01L25/0753 , H01L33/58 , H01L2924/0002 , H04N1/02865 , H04N1/0289 , H04N2201/02487 , Y10S359/90 , Y10S362/80 , H01L2924/00
Abstract: 내용 없음.
Abstract translation: 发光元件阵列包括基板，多个发光元件，例如在基板上排列成一行的发光二极管，以及平行布置在发光元件列上方的柱状的柱状聚光透镜单元 适于扩散并同时会聚透射光。 聚光透镜单元的发光面通过化学处理，喷砂处理或其他方式变得粗糙。
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公开(公告)号：KR1020080037648A
公开(公告)日：2008-04-30
申请号：KR1020087000109
申请日：2006-06-06
Applicant: 니폰 이타가라스 가부시키가이샤
IPC: H04N1/028
CPC classification number: H04N1/0318 , H04N2201/0081 , H04N2201/0091 , H04N2201/02462 , H04N2201/02477 , H04N2201/02485 , H04N2201/02487 , H04N2201/03112 , H04N2201/0312 , H04N2201/03141 , H04N2201/03145 , H04N2201/03154
Abstract: An image sensor which does not produce stress in a line illuminating device or a frame and therefore is free from warping or the like even when thermal expansion difference or thermal contraction difference exists between the line illuminating device and the frame, and a production method of the image sensor. The image sensor comprises a line illuminating device for applying light to an original copy, an light reception element array for receiving light reflected from the original copy thus illuminated, an lens array for imaging the original copy and the light reception element array, a frame housing the line illuminating device, the lens array and the light reception element array, and a resilient holding unit mounted on the frame, for pressing the line illuminating device against the frame.
Abstract translation: 即使在线路照明装置和框架之间存在热膨胀差异或热收缩差异的图像传感器，其不会在线路照明装置或框架中产生应力，因此即使在线路照明装置和框架之间存在热膨胀差异或热收缩差异也不会发生翘曲等 图像传感器。 图像传感器包括用于将光照射到原稿上的线照明装置，用于接收从如此照射的原始副本反射的光的光接收元件阵列，用于对原稿复制和光接收元件阵列进行成像的透镜阵列， 线照明装置，透镜阵列和光接收元件阵列，以及安装在框架上的弹性保持单元，用于将线照明装置压靠在框架上。
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公开(公告)号：KR1019920005035B1
公开(公告)日：1992-06-25
申请号：KR1019880014388
申请日：1988-11-02
Applicant: 파나소닉 주식회사
CPC classification number: G02B3/005 , B24B13/00 , B29C43/021 , B29C43/361 , B29C2043/3618 , B29D11/00009 , B29D11/00932 , B29K2025/00 , B29K2055/00 , B29L2011/0016 , G02B3/0062 , H04N1/0311 , H04N1/0312 , H04N2201/02487
Abstract: 내용 없음.
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