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公开(公告)号：US20160358849A1
公开(公告)日：2016-12-08
申请号：US15174677
申请日：2016-06-06
Applicant: North Carolina State University
Inventor： Jesse S. Jur , Murat Yokus , Rachel Foote , Amanda Caton Myers , Raj Pravinbhai Bhakta
IPC: H01L23/528 , H01L23/532
CPC classification number: H05K1/0283 , G01N33/367 , H01L23/4985 , H01L23/49883 , H01L33/62 , H05K1/038 , H05K1/189 , H05K3/361 , H05K2201/0129 , H05K2201/09263 , H05K2201/10106 , H05K2201/10219
Abstract: Provided herein are flexible interconnects, systems containing one or more flexible interconnects, and textiles including one or more flexible interconnects.
Abstract translation: 本文提供了柔性互连，包含一个或多个柔性互连的系统和包括一个或多个柔性互连的纺织品。
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公开(公告)号：US20160286686A1
公开(公告)日：2016-09-29
申请号：US14668017
申请日：2015-03-25
Applicant: International Business Machines Corporation
Inventor： Jeffrey P. Gambino , Richard S. Graf , Sudeep Mandal , David J. Russell
CPC classification number: H05K7/2039 , H01L23/13 , H01L23/15 , H01L23/38 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L35/34 , H01L2224/13099 , H01L2224/16225 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H05K1/0306 , H05K2201/10219 , H05K2201/10378 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.
Abstract translation: 本发明一般涉及集成电路（IC）芯片封装，更具体地，涉及一种形成具有一个或多个嵌入式珀耳帖器件的玻璃插入件以及导电通孔的结构和方法，以帮助从一个或多个IC散发热量 通过玻璃插入件将芯片封装在多维芯片封装中，并进入有机载体，在其中可将其分散到下面的基板中。
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公开(公告)号：US09322580B2
公开(公告)日：2016-04-26
申请号：US14176388
申请日：2014-02-10
Applicant: Laird Technologies, Inc.
IPC: H05K7/20 , F25B21/02 , H05K1/02 , H01L23/38 , H01L35/32 , H01L35/30 , H05K1/14 , H05K1/18 , H05K3/00
CPC classification number: F25B21/02 , H01L23/38 , H01L35/30 , H01L35/32 , H01L2224/48091 , H05K1/0203 , H05K1/141 , H05K1/182 , H05K3/0061 , H05K7/205 , H05K2201/10219 , Y10T29/4913 , H01L2924/00014
Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
Abstract translation: 电路组件通常包括电路板和被配置为将热电模块耦合到电路板的至少一个电路径。 当热电模块经由至少一个电路径耦合到电路板时，电路板和至少一个电路径形成热电模块的一部分。 包括构成热电模块的一部分的电路板的部分的热电模块限定了小于电路板的覆盖区的覆盖区。 因此，电路板能够在由热电模块限定的覆盖区以外的位置支撑电路板上的电气部件。
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94.发明申请公开(公告)号：US20150003017A1
公开(公告)日：2015-01-01
申请号：US14365084
申请日：2012-12-06
Applicant: THALES
Inventor： Christian Tantolin , Claude Sarno
IPC: H05K7/20
CPC classification number: H05K7/20009 , H01L23/38 , H01L2924/0002 , H05K1/0203 , H05K2201/062 , H05K2201/10219 , H01L2924/00
Abstract: A system for regulating the temperature of printed circuit boards comprises a first assembly of at least one Peltier element, for regulating the temperature of a second assembly of at least one electronic component or for harvesting thermal energy dissipated by the second assembly. At least one Peltier element of the first assembly is coupled to first heat-exchanging means that are coupled to at least one electronic component of the second assembly, and to second heat-exchanging means allowing thermal energy given off from at least one Peltier element of the first assembly to be dissipated.
Abstract translation: 用于调节印刷电路板的温度的系统包括至少一个珀耳帖元件的第一组件，用于调节至少一个电子部件的第二组件的温度或用于收集由第二组件耗散的热能。 第一组件的至少一个珀耳帖元件被耦合到耦合到第二组件的至少一个电子部件的第一热交换装置，以及允许从至少一个珀耳帖元件发出的热能的第二热交换装置 第一个要消散的组件。
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95.发明申请公开(公告)号：US20140185312A1
公开(公告)日：2014-07-03
申请号：US14135160
申请日：2013-12-19
Applicant: Duane Louderback
Inventor： Duane Louderback
CPC classification number: H05K1/0203 , F21V29/54 , H01L23/24 , H01L33/645 , H01L2924/0002 , H01S5/02248 , H01S5/02415 , H05K2201/10106 , H05K2201/10219 , Y10T29/4913 , H01L2924/00
Abstract: An optical module apparatus and method operates at high temperatures. The apparatus has a first printed circuit board with optoelectronics and electronics located on a thermoelectric cooler. The thermoelectric cooler is located on a second printed circuit board that also has electronics that control the thermoelectric cooler separately mounted thereon. The optical module operates at substantially higher temperatures by placing the optoelectronics and the electronics, not including the thermoelectric cooler controller, on the thermoelectric cooler. The electronics controlling the thermoelectric cooler only require relatively simple, low-speed electronics that are implemented in integrated circuit technologies. The integrated circuit electronics may operate at very high temperatures (200° C. or higher) thereby making control of the thermoelectric cooler with uncooled electronics possible.
Abstract translation: 光模块装置和方法在高温下运行。 该装置具有位于热电冷却器上的具有光电子和电子器件的第一印刷电路板。 热电冷却器位于第二印刷电路板上，该印刷电路板还具有控制分别安装在其上的热电冷却器的电子器件。 光学模块通过将光电子器件和电子设备（不包括热电冷却器控制器）放置在热电冷却器上而在更高的温度下工作。 控制热电冷却器的电子器件仅需要在集成电路技术中实现的相对简单的低速电子设备。 集成电路电路可以在非常高的温度（200℃或更高）下运行，从而使得具有非制冷电子部件的热电冷却器成为可能。
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Patent Agency Ranking
公开(公告)号：US20140150839A1
公开(公告)日：2014-06-05
申请号：US14176388
申请日：2014-02-10
Applicant: Laird Technologies, Inc.
CPC classification number: F25B21/02 , H01L23/38 , H01L35/30 , H01L35/32 , H01L2224/48091 , H05K1/0203 , H05K1/141 , H05K1/182 , H05K3/0061 , H05K7/205 , H05K2201/10219 , Y10T29/4913 , H01L2924/00014
Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
Abstract translation: 电路组件通常包括电路板和被配置为将热电模块耦合到电路板的至少一个电路径。 当热电模块经由至少一个电路径耦合到电路板时，电路板和至少一个电路径形成热电模块的一部分。 包括构成热电模块的一部分的电路板的部分的热电模块限定了小于电路板的覆盖区的覆盖区。 因此，电路板能够在由热电模块限定的覆盖区以外的位置支撑电路板上的电气部件。
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97.发明申请公开(公告)号：US20130107460A1
公开(公告)日：2013-05-02
申请号：US13663811
申请日：2012-10-30
Applicant: International Business Machines Corporation
Inventor： Cliff Chen , Ben Chiu , Michk Huang , Theron L. Lewis
CPC classification number: F25B21/02 , H01L35/32 , H05K1/181 , H05K3/22 , H05K3/3447 , H05K3/3468 , H05K2201/10136 , H05K2201/10219 , H05K2203/044 , H05K2203/1121 , H05K2203/304 , Y10T29/49826
Abstract: Provided is a method for protecting a thermal sensitive component mounted on a board during a thermal process. The method includes: providing the board, providing a protection apparatus which is removable and made of a thermoelectric material to protect the thermal sensitive component during the thermal process, wherein the protection apparatus cools the thermal sensitive component during the thermal process in response to applying a voltage to the protection apparatus. Further provided is the protection apparatus for the thermal sensitive component mounted on the board during the thermal process.
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公开(公告)号：US20130062717A1
公开(公告)日：2013-03-14
申请号：US13598269
申请日：2012-08-29
Applicant: Toshio Watanabe , Isao Ichimura , Tatsuo Maeda , Takuma Nagata
Inventor： Toshio Watanabe , Isao Ichimura , Tatsuo Maeda , Takuma Nagata
IPC: H01L27/146
CPC classification number: H05K1/0201 , H05K3/0061 , H05K3/303 , H05K2201/09054 , H05K2201/09063 , H05K2201/09072 , H05K2201/10121 , H05K2201/10219 , H05K2201/10409 , H05K2203/165
Abstract: A circuit board includes a board having a hole formed therein, and an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board.
Abstract translation: 电路板包括其中形成有孔的板，以及结合到包括板的前表面中的孔的至少一部分的第一区域的成像器。
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公开(公告)号：US20100207573A1
公开(公告)日：2010-08-19
申请号：US12658623
申请日：2010-02-11
Applicant: Anthony Mo , Michael Palazzi
Inventor： Anthony Mo , Michael Palazzi
CPC classification number: F21S9/04 , F21K9/00 , F21S9/02 , F21V13/14 , F21V29/54 , F21V29/763 , F21Y2115/10 , H01L33/645 , H01L35/30 , H01L2924/0002 , H05K1/0203 , H05K1/021 , H05K2201/10106 , H05K2201/10219 , H01L2924/00
Abstract: An article of manufacture, comprising: an LED or other light source in thermal communication with a thermoelectric module; and a feedback circuit that directs current generated by the thermoelectric module to at least one device. This invention improves on prior art by recycling heat produced by the LED or other light source into electricity produced via the thermoelectric module to be used by the light source, a cooling device, battery charger for battery backup system, control or monitoring system, etc.
Abstract translation: 一种制造品，包括：与热电模块热连通的LED或其他光源; 以及将由热电模块产生的电流引导到至少一个装置的反馈电路。 本发明通过将由LED或其他光源产生的热量再循环到由光源使用的热电模块产生的电力，冷却装置，用于电池备用系统的电池充电器，控制或监视系统等来改进现有技术。
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公开(公告)号：US07278199B2
公开(公告)日：2007-10-09
申请号：US11344118
申请日：2006-02-01
Applicant: Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
Inventor： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
IPC: H01S4/00
CPC classification number: H01L35/06 , H01L35/30 , H01L35/32 , H01L35/34 , H05K1/0204 , H05K2201/10219 , Y10T29/49002 , Y10T29/4913 , Y10T29/49144
Abstract: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.
Abstract translation: 为了提供高度可靠的热电装置，在热电装置中，按照各个热电元件的位置排列的多个散热侧电极排列成阵列方式在平面的 散热侧板。 多个p型热电元件和n型热电元件和散热侧电极的散热侧端面通过焊料接合在一起。 吸热侧电极与这些热电元件的吸热侧端面滑动接触。
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