Abstract:
A composite magnetic material and a method for preparing the same are provided. The composite magnetic material comprises Nd-Fe-B alloy and Fe-base soft magnetic alloy having the general formula of Fe 100-x-y-z A x R a Si y B z , wherein A is at least one element selected from Cu and Au, R is at least one element selected from the group consisting of Ti, Zr, Hf, Mo, Nb, Ta, W and V, x ranges from 0 to 3, y ranges from 0 to 20, a ranges from 0 to 10, and z ranges from 2 to 25. The magnetic energy product and the residual magnetism of the composite magnetic material are both improved.
Abstract:
A Zr-based composite ceramic material, a preparation method thereof and a shell or a decoration are provided. The Zr-based composite ceramic material includes a zirconia matrix and a cubic SrxNbO3 stable phase dispersed within the zirconia matrix, where 0.7≤x≤0.95.
Abstract:
A Zr-based composite ceramic material, a preparation method thereof, and a shell or decoration are provided. The Zr-based composite ceramic material includes a zirconia matrix, a cubic Sr0.82NbO3 stable phase, a Ca10(PO4)6(OH)2 phase, and a SrAl12O19 phase, and the cubic Sr0.82NbO3 stable phase, the Ca10(PO4)6(OH)2 phase and the SrAl12O19 phase are dispersed within the zirconia matrix.
Abstract:
A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24°C higher than the glass transition temperature of the base resin.
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.
Abstract:
A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b).
Abstract:
A metal forming apparatus includes a smelting device, a molding device, an injection device and a vacuumizing device. The smelting device defines a smelting chamber, and includes a rotatable crucible and a heating unit both disposed within the smelting chamber. The molding device defines a molding chamber sealedly communicated with the smelting chamber. The injection device includes a charging barrel assembly sealedly disposed at a joint between the molding device and the smelting device and an injection unit sealedly connected with the smelting device. The vacuumizing device is sealedly connected with the smelting device and the molding device respectively so as to vacuumize the smelting chamber and the molding chamber.