METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF
    106.
    发明公开
    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF 审中-公开
    敷金属聚合物底物和产物的方法由其衍生的聚合物SUBJECT

    公开(公告)号:EP3108034A1

    公开(公告)日:2016-12-28

    申请号:EP15740539.0

    申请日:2015-01-27

    Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF
    107.
    发明公开
    METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF 审中-公开
    用于金属化聚合物基底的方法和由其制备的聚合物制品

    公开(公告)号:EP3108033A1

    公开(公告)日:2016-12-28

    申请号:EP15740739.6

    申请日:2015-01-27

    Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

    Abstract translation: 提供了用于金属化聚合物基底的方法和通过该方法制备的聚合物制品。 首先提供具有基础聚合物和分散在基础聚合物中的至少一种金属化合物的聚合物基材。 然后用能量束照射聚合物基材的表面,使得聚合物基材的表面的水接触角为至少120°。 并且聚合物基材的表面经受化学镀。

    METAL FORMING APPARATUS
    110.
    发明公开
    METAL FORMING APPARATUS 审中-公开
    金属成型设备

    公开(公告)号:EP3041621A1

    公开(公告)日:2016-07-13

    申请号:EP14856350.5

    申请日:2014-09-30

    Abstract: A metal forming apparatus includes a smelting device, a molding device, an injection device and a vacuumizing device. The smelting device defines a smelting chamber, and includes a rotatable crucible and a heating unit both disposed within the smelting chamber. The molding device defines a molding chamber sealedly communicated with the smelting chamber. The injection device includes a charging barrel assembly sealedly disposed at a joint between the molding device and the smelting device and an injection unit sealedly connected with the smelting device. The vacuumizing device is sealedly connected with the smelting device and the molding device respectively so as to vacuumize the smelting chamber and the molding chamber.

    Abstract translation: 金属成形装置(1000)包括熔炼装置(5),成形装置(10),注射装置(8)和抽真空装置(3)。 熔炼装置(5)限定熔炼室(501),并且包括设置在熔炼室(501)内的可旋转坩埚(502)和加热单元(003)。 模制装置(10)限定与熔炼室(501)密封连通的模制室。 注射装置(8)包括密封设置在成型装置(10)和熔炼装置(5)之间的接合处的注射筒组件(81)和与熔炼装置(5)密封连接的注射单元。 抽真空装置(3)分别与熔炼装置(5)和成型装置(10)密封连接,以对熔炼室(501)和成型室抽真空。 需要抽真空的空间体积大大减小,有利于保证真空空间的密封性和保压性能。

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