公开(公告)号：JP2000200525A

公开(公告)日：2000-07-18

申请号：JP53499

申请日：1999-01-05

Applicant: SONY CORP ,  SMK KK

Inventor： KAYAMA TAKASHI ,  NISHIKAWA MASATOME ,  KAMISHIMA OSAMU

IPC: H01H13/14 ,  H01H3/12 ,  H01H61/01

Abstract: PROBLEM TO BE SOLVED: To intend a key switch to be thin when a current is not carried and to extend its life. SOLUTION: In this key switch, provided are a key top 2, a contact type switch 20 that first and second contacts 18a and 19a are connected to be closed by pressure operation of the key top 2; a compression coil spring 4 of a shape memory alloy which a middle part 4b is brought into contact with the inside of the key top 2 and is heated up to a shape recover temperature to show super elasticity for holding the key top 2 in an operation set up position capable of pressure operation and which is deformed by pressure operation of the key top 2 to contact the first and second contacts 18a and 19a, an energizing means 31b for energizing the key top 2 in the direction closing to the contact type switch 20, a spring support means 5 for supporting the compression coil spring 4, and a key top support means 3 for movably supporting the key top 2 in the direction separating from the contact type switch 20.

公开(公告)号：JP2000144456A

公开(公告)日：2000-05-26

申请号：JP31105998

申请日：1998-10-30

Applicant: SONY CORP ,  ELEMENT DENSHI KK

Inventor： KAYAMA TAKASHI ,  NARITA GORO

IPC: C23F1/22

Abstract: PROBLEM TO BE SOLVED: To smoothly remove burrs from a formed part without causing their scattering in the air nor requiring many asistances by applying secondary working to a formed part composed of magnesium alloy by chemical polishing treatment. SOLUTION: Plural formed parts 10 composed of magnesium alloy and having burrs 26 and 28 at the lateral sides are arranged and held in a net basket 30. The basket 30 is sufficiently immersed in a chemical solution 56 (ferric oxide, etc., about 40 deg.C±5 deg.C, about 30-70% concentration) in a chemical solution tank 51 by working an operating unit 36, where the basket 30 is moved up and down by the operating unit 36 and chemical solution treatment is performed for about 3 to 5 min to remove the burrs 26 and 28 from the formed parts 10. The burrs 26 and 28 dropped into the chemical solution 56 are fed to a filter 53 together with the chemical solution 56 via a piping 54 by the working of a pump 52, where the burrs 26 and 28 are removed and the chemical solution 56 alone is returned to the chemical solution tank 51 via a piping 55. The formed parts 10 from which the burrs 26 and 28 are removed are washed with water by a cleaning device, dried by a drier, and fed to the next stage.

公开(公告)号：JP2000113431A

公开(公告)日：2000-04-21

申请号：JP27866098

申请日：1998-09-30

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI ,  OGASAWARA JUNICHI

IPC: G11B5/52 ,  G11B5/53 ,  G11B15/61

Abstract: PROBLEM TO BE SOLVED: To embody a rotary head which eliminates the need for costly machining, such as lathing, and is inexpensive and easy to manufacture by constituting the parts of the rotary head, such as a rotary drum and a stationary drum, of molded goods formed by molding super-high-molecular-weight polyethylene. SOLUTION: The rotary head has the rotary drum 42 and the stationary drum 44 and is so constituted as to record and reproduce a tape-like magnetic recording medium. In such a case, the rotary drum is formed as a rotary columnar body. The tape-like magnetic recording medium is brought into contact with the outer peripheral surface of this rotary columnar body and the tape-like magnetic recording medium is made to travel by rotation of the rotary columnar body. The stationary drum 44 is arranged as a columnar body having the same diameter as the diameter of the rotary drum 42 on the lower side of the rotary drum 42 concentrically with the rotary drum 42. The tape-like magnetic recording medium traveling in compliance with the rotation of the rotary drum 42 is slid on the outer peripheral surface of the columnar body. The rotary drum 42 and stationary drum 44 of the rotary head are formed of the molded goods formed by injection molding of the super-high-molecular-weight polyethylene as a molding material.

公开(公告)号：JP2000083362A

公开(公告)日：2000-03-21

申请号：JP24959598

申请日：1998-09-03

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI

IPC: H02K29/00 ,  H02K21/24 ,  H02N2/00

Abstract: PROBLEM TO BE SOLVED: To permit low power consumption by controlling the separation and contact between an oscillator and a contact at a thrust mechanism, thereby performing different drives. SOLUTION: A thrust mechanism 13 having a control function is installed to an upper bearing portion 14, which supports a shaft 12 freely rotatably, and in the case of ultrasonic drive, if the flow of an electric current to a thrust spring 37 is interrupted and the state of being defeated by a suction force of rotor portion 11 is created, then the rotor portion 11 is sucked to the side of a stator substrate 10 by the suction force of the main magnet 19, and a contact 31 comes into contact with an oscillator 30. When electric current is applied in this state, the oscillator 30 vibrates and the rotor portion rotates at a low speed. In the case of electromagnetic drive, a current is applied to the thrust spring 37 and an elastic force is strengthened, a thrust pad 36 is seated at the lower side of a housing portion 35 so as to overcome the attractive force from the rotor portion 11, and then a state of separation between the oscillator 30 and contact 31 occurs and an electromagnetic motor mechanism is created. In this way, the state of a low power consumption can be created without taking a large space for motor.

公开(公告)号：JP2000058171A

公开(公告)日：2000-02-25

申请号：JP22476098

申请日：1998-08-07

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI ,  MUNEKATA KENJI

IPC: H01R12/79 ,  H01R12/28

Abstract: PROBLEM TO BE SOLVED: To provide a connector that can surely perform the grounding connection to each shielding wire and which will not break at insertion of a plug part into a socket part. SOLUTION: This connector is provided with a socket part 11, having multiple contact parts 11b arranged and exposed side by side at predetermined intervals in a recessed part as an internal space opened in its back face, a plug part 12 having an inserted part 12b to be inserted into the recessed part of the socket part 11 and plural number of contact parts 12c laterally arranged and exposed side by side on the surface of the inserted part 12b at predetermined intervals, and a grounding bar 13 which has two supporting members 13a, 13b which catch a cable comprising plural shielding wires to be connected and is used to connect the cores of the respective shielding wires to the corresponding contact parts of the plug part by mounting it to the plug part. The plug part 12 is provided with wall parts 15 for defining its lateral position at both side ends of the inserted part 12b, and at least one of sheet metal materials of the grounding bar is provided with a spring part 17, which projects toward the respective shielding wires on its inside surface facing the shielding wires.

公开(公告)号：JP2000004053A

公开(公告)日：2000-01-07

申请号：JP16875998

申请日：1998-06-16

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI

IPC: H01L43/02

Abstract: PROBLEM TO BE SOLVED: To provide a magnetoresistance element of stabilized quality which can be mounted on a circuit substrate, without using resin mold, mounting screws or nuts, etc. SOLUTION: This magnetoresistance element contains a chip-like magnetic resistance element body 11 and a plurality of soldering lead terminals 12 attached to the connection terminal of the magnetic resistance element body 11, and at least a soldering lead terminal, from among the soldering lead terminals, has a reinforcement soldering parts 13 and 14.

公开(公告)号：JPS5460430A

公开(公告)日：1979-05-15

申请号：JP12736277

申请日：1977-10-24

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI

IPC: H02J7/10 ,  H01M10/44 ,  H02J7/02

公开(公告)号：JPS53103544A

公开(公告)日：1978-09-08

申请号：JP1855677

申请日：1977-02-22

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI

IPC: H02J7/10

公开(公告)号：JP2013089683A

公开(公告)日：2013-05-13

申请号：JP2011227029

申请日：2011-10-14

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KAYAMA TAKASHI ,  SHIMIZU YUKIKO

IPC: H05K7/20

CPC classification number: H05K7/20145

Abstract: PROBLEM TO BE SOLVED: To suppress temperature rise in a second electronic component that does not generate heat when operating, without increase in manufacturing costs.SOLUTION: A heat dissipation structure includes: a circuit board that is disposed inside a casing including a chassis having air inflow holes formed therein and that has a first electronic component generating heat when operating and a second electronic component generating no heat when operating which are mounted on one surface of a base plate; and a heat sink that dissipates heat generated by the first electronic component. The heat sink includes: a heat dissipation part that is positioned so as to face the base plate of the circuit board; an eave part that is positioned outward from the outer periphery of the base plate, protruding from the heat dissipation part, and that guides cooling air taken into the casing from the air inflow holes to the second electronic component; and a pair of enclosure parts that protrude from both end parts in a direction orthogonal to a direction of protrusion of the eave part from the heat dissipation part and that are bent toward the circuit board with respect to the eave part. At least one of the air inflow holes of the chassis is formed at a position facing the eave part.

Abstract translation: 要解决的问题：为了抑制在操作时不产生热量的第二电子部件中的温度升高，而不增加制造成本。 解决方案：散热结构包括：电路板，其设置在壳体内部，该壳体包括其中形成有空气流入孔的底架，并且具有在操作时产生热量的第一电子部件和当操作时不产生热量的第二电子部件 其安装在基板的一个表面上; 以及消散由第一电子部件产生的热量的散热器。 散热器包括：散热部，其被定位成面对电路板的基板; 从所述基板的外周向外侧突出的檐部，其从所述散热部突出，并且将从所述空气流入孔吸入所述壳体的冷却空气引导到所述第二电子部件; 以及一对外壳部件，其从与所述檐部的突出方向正交的方向从所述两端部从所述散热部突出并且相对于所述檐部向所述电路基板弯曲。 底盘的至少一个空气流入孔形成在面对檐部的位置。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2013078929A

公开(公告)日：2013-05-02

申请号：JP2011273682

申请日：2011-12-14

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KAYAMA TAKASHI ,  SHIMIZU YUKIKO ,  HANYU ATSUHIDE ,  HOSHINO SUSUMU ,  KAWAMURA KEISUKE

IPC: B29C45/26

CPC classification number: B29C45/2628 ,  B29C45/5675 ,  Y10T428/24273

Abstract: PROBLEM TO BE SOLVED: To prevent generation of weld lines without increasing manufacturing cost.SOLUTION: This molding apparatus includes a cavity mold fixed to a predetermined position, a core mold forming a cavity to be filled with a molten resin via a gate by being butted against the cavity mold to be mold-clamped, a core pin supported by the core mold to be movable in contacting and separating directions of the cavity mold and the core mold and forming a molded hole in a molded product molded by curing a molten resin filled in a cavity, and a cavity pin supported by the cavity mold to be movable in the contacting and separating directions and forming a molded hole together with the core pin by making its central axis and the central axis of the core pin coincide each other. When the cavity is filled with the molten resin, at least one of the core pin or the cavity pin is moved and pushed against the molten resin before curing the molten resin to partially compress the molten resin and the molten resin compressed by movement of the core pin and the cavity pin is cut to form the molded hole.

Abstract translation: 要解决的问题：为了防止生产焊接线而不增加制造成本。 解决方案：该模制装置包括固定到预定位置的模腔，芯模，其通过与模具夹紧的模腔对接而形成待填充有熔融树脂的空腔，芯模芯 由芯模支撑，以在空腔模具和芯模的接触分离方向上移动，并且在通过固化填充在空腔中的熔融树脂成型的模制产品中形成模制孔，以及由模腔支撑的模腔 能够在接触分离方向上移动并且通过使其中心轴线和芯销的中心轴线彼此重合而与芯销一起形成模制孔。 当空腔充满熔融树脂时，在固化熔融树脂之前，将芯销或空心销中的至少一个移动并推靠在熔融树脂上，以部分地压缩熔融树脂，并且通过芯的移动而压缩的熔融树脂 销和腔销被切割以形成模制孔。 版权所有（C）2013，JPO＆INPIT