Abstract:
본 발명은 롤 투 롤 그라비아 인쇄 공정의 잉크전이 검사장치에 관한 것이다. 이러한 본 발명에 의하면, 기체; 상기 기체의 상부에 설치되어 그라비아 인쇄시 그라비아 롤제판에서 이송중인 필름으로의 잉크전이 상태를 검사하는 잉크전이 검사유닛; 및 상기 잉크전이 검사유닛에서 획득한 잉크전이에 대한 검사정보를 디스플레이하는 디스플레이부; 를 포함하여 구성됨으로써, 전자소자 및 미세 전극 패턴의 인쇄시 인쇄 공정 조건을 잉크전이 모양에 맞추어 정량적으로 제어하여 롤 투 롤 그라비아 인쇄 공정과 인쇄 부품의 품질을 향상시키는 인쇄 공정 제어기술을 확보할 수 있게 된다.
Abstract:
본 발명은 표면실장용 발광소자의 전도성 접착제에 관한 것으로서, 더욱 상세하게는 LED 납땜시 사용되는 솔더 페이스트를 대체할 수 있고, 저온 소성이 가능한 전도성 접착제로서 전기전도성, 접착력이 우수할 뿐만 아니라 플럭스 프리 조성물로 할로겐 화합물에 의해 기판에서 발생할 수 있는 마이그레이션(Migration)을 방지할 수 있는 표면실장용 발광소자의 전도성 접착제에 관한 것이다.
Abstract:
The present invention relates to an electrode printing ink using compound nanogel and multi-layer capacitor manufactured by electrode printing ink using compound nanogel. More particularly, an electrode printing ink composite is manufactured by using compound nanoparticles. High capacity and high integration required for a light, thin, and flexile information device manufactured by a roll to roll printing method using the electrode printing ink composite can be secured and be manufactured at low cost.
Abstract:
Disclosed are a method to manufacture a flexible CMOS type driving integrated circuit for low voltage by using printing processes and an RFID tag using the same. The method to manufacture an integrated circuit includes the steps of printing a P-type single-wall nanotube (SWNT) transistor (TR) by using a printing method; and converting the P-type SWNT TR into an N-type SWNT transistor by overlapping the TR on a transistor channel by using N-type doping ink in which a precursor and an oligomer are dissolved to the surface of the printed SWNT TR in order to convert the transistor into a complementary metal oxide semiconductor (CMOS) type transistor so that RFID and USN fields can be actually applied to living and industries by enabling mutual sensing with existing Si-based smart phones and mobile terminals.
Abstract:
The present invention relates to a packing sheet using a micro pattern and to a method for preparing the same. More specifically, the method for preparing the packing sheet can save cost by simplifying a packing process as the packing sheet has an adhesive portion having the micro pattern by a roll-to-roll printing or a screen printing.
Abstract:
The present invention relates to a conductive adhesive of a surface mounting light emitting device and, more specifically, to a conductive adhesive of a surface mounting light emitting device which can replace solder paste used during LED soldering, not only has excellent electrical conductivity and adhesive strength as the conductive adhesive which is possible to be plasticized at a low temperature, but also is a flux-free composition to prevent migration occurring on a substrate by a halogen compound.