公开(公告)号：KR100858134B1

公开(公告)日：2008-09-10

申请号：KR1020060136553

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 백남중 ,  홍창민

IPC: C08L81/02 ,  C08L81/06 ,  C08K5/23

Abstract: 폴리페닐렌 설파이드계 수지 조성물 및 플라스틱 성형품이 제공된다.
폴리페닐렌 설파이드계 수지 조성물은, 폴리페닐렌 설파이드 수지의 0.1~100 중량부; 올레핀계 단량체의 중합체 또는 올레핀계 단량체와 비닐계 단량체의 공중합체에 대해, 비닐계 중합체가 그라프트되어 있는 올레핀계 그라프트 공중합체의 0.1~10 중량부; 및 벤조트리아졸계 화합물, 벤조페논계 화합물 및 트리아진계 화합물로 이루어진 그룹에서 선택된 하나 이상의 화합물을 포함하는 자외선 흡수제의 0.1~3 중량부를 포함한다.
폴리페닐렌 설파이드계 수지 조성물, 플라스틱 성형품, 광 안정성, 내충격성

Abstract translation: 聚苯硫醚系树脂组合物和塑料成型品。

公开(公告)号：KR100848539B1

公开(公告)日：2008-07-25

申请号：KR1020070067914

申请日：2007-07-06

Applicant: 제일모직주식회사

Inventor： 김경태 ,  홍창민

IPC: C08L31/00 ,  C08L51/04 ,  C08L25/00 ,  C08L29/02

Abstract: A polycarbonate-based thermoplastic resin composition is provided to realize excellent impact strength at a welding portion while showing a good balance in physical properties including impact resistance, heat resistance, flowability and workability. A polycarbonate-based thermoplastic resin composition comprises: (A) 30-80 parts by weight of a polycarbonate resin; (B) 5-50 parts by weight of a rubber-modified aromatic vinyl graft copolymer; (C) 5-60 parts by weight of an aromatic vinyl copolymer; (D) 0.1-3 parts by weight of a UV absorbing agent; and (E) 0.5-3 parts by weight of polyethylene glycol.

Abstract translation: 提供聚碳酸酯类热塑性树脂组合物，以在焊接部分实现优异的冲击强度，同时在包括耐冲击性，耐热性，流动性和可加工性的物理性能方面具有良好的平衡。 聚碳酸酯类热塑性树脂组合物包含：（A）30〜80重量份的聚碳酸酯树脂; （B）5-50重量份的橡胶改性的芳族乙烯基接枝共聚物; （C）5-60重量份芳族乙烯基共聚物; （D）0.1-3重量份的UV吸收剂; 和（E）0.5-3重量份的聚乙二醇。

公开(公告)号：KR1020080061646A

公开(公告)日：2008-07-03

申请号：KR1020060136606

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 백남중 ,  홍창민

IPC: C08L81/02 ,  C08L81/06 ,  C08K5/49

Abstract: A polyphenylene sulfide-based resin composition is provided to improve characteristics such as heat stability of polyphenylene sulfide-based thermoplastic resin, and to be used for various optical parts or electrical/electronic equipment parts. A polyphenylene sulfide-based resin composition includes 0.1-100 parts by weight of polyphenylene sulfide resin, 0.1-10 parts by weight, based on polymer of olefin-based monomer or copolymer of olefin-based monomer and vinyl-based monomer, of olefin-based graft copolymer grafted with a vinyl-based polymer, and 0.1-3 parts by weight of a pentaerythritol diphosphite-based heat stabilizer. The polyphenylene sulfide resin comprises at least 70mol% of a repeating unit represented by the following formula 1.

Abstract translation: 提供聚苯硫醚类树脂组合物以改善聚苯硫醚类热塑性树脂的热稳定性等特性，并且用于各种光学部件或电气/电子设备部件。 聚苯硫醚类树脂组合物包含0.1-100重量份聚苯硫醚树脂，0.1-10重量份，基于烯烃类单体的聚合物或烯烃类单体和乙烯基类单体的共聚物，烯烃 - 接枝有乙烯基类聚合物的基于乙烯的接枝共聚物和0.1-3重量份季戊四醇二亚磷酸酯类热稳定剂。 聚苯硫醚树脂包含至少70mol％的由下式1表示的重复单元。

公开(公告)号：KR1020080061623A

公开(公告)日：2008-07-03

申请号：KR1020060136553

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 백남중 ,  홍창민

IPC: C08L81/02 ,  C08L81/06 ,  C08K5/23

Abstract: A polyphenylene sulfide-based resin composition is provided to improve characteristics such as optical stability and shock resistance of polyphenylene sulfide-based thermoplastic resins. A polyphenylene sulfide-based resin composition includes 0.1-100 parts by weight of polyphenylene sulfide resin, 0.1-10 parts by weight, based on polymer of olefin-based monomer or copolymer of olefin-based monomer and vinyl-based monomer, of olefin-based graft copolymer grafted with a vinyl-based polymer, and 0.1-3 parts by weight of an ultraviolet absorber containing at least one compound selected from the group comprising benzotriazole-based compounds, benzophenone-based compounds, and triazine-based compounds.

Abstract translation: 提供聚苯硫醚类树脂组合物以改善聚苯硫醚类热塑性树脂的特性，如光学稳定性和抗冲击性。 聚苯硫醚类树脂组合物包含0.1-100重量份聚苯硫醚树脂，0.1-10重量份，基于烯烃类单体的聚合物或烯烃类单体和乙烯基类单体的共聚物，烯烃 - 接枝有乙烯基类聚合物的基于羧酸的接枝共聚物和0.1-3重量份含有至少一种选自苯并三唑类化合物，二苯甲酮类化合物和三嗪类化合物的化合物的紫外线吸收剂。

公开(公告)号：KR100769859B1

公开(公告)日：2007-10-24

申请号：KR1020050135545

申请日：2005-12-30

Applicant: 제일모직주식회사

Inventor： 김성준 ,  홍창민

IPC: C09D165/02

CPC classification number: C08L81/02 ,  C08K7/14 ,  C08L27/12

Abstract: 본 발명에 따른 용융 장력이 우수하며 고온 분체도장이 가능한 폴리페닐렌 설파이드계 수지 조성물은 (A) 프로파일 압출이나 화이바 스피닝 프로세스가 가능한 폴리페닐렌 설파이드계 수지 97∼99.5 중량부; (B) 불소화 폴리올레핀계 수지 0.5∼3 중량부; 및 (C) 상기 (A)+(B) 100 중량부에 대하여 유리섬유 20∼50 중량부를 포함하는 것을 그 특징으로 한다.
폴리페닐렌 설파이드, 불소화 폴리올레핀, 용융장력, 고온 분체도장, 압출 프로세스, 프로파일 압출 프로세스

公开(公告)号：KR1020070070388A

公开(公告)日：2007-07-04

申请号：KR1020050132882

申请日：2005-12-29

Applicant: 제일모직주식회사

Inventor： 김성준 ,  홍창민

IPC: C08L77/00 ,  C08L81/06 ,  C08L63/00

Abstract: Provided is a polyamide resin composition, which has an improved heat deflection temperature and excellent physical properties, and is useful for electronic/electric appliances requiring high heat resistance of plastic resins. The polyamide resin composition having an improved heat deflection temperature comprises: (A) 50-99 parts by weight of a polyamide resin; (B) 1-50 parts by weight of a polyether sulfone resin; and (C) 0.5-3 parts by weight of an epoxy compound based on 100 parts by weight of the combined weight of (A)+(B). The polyamide resin composition optionally further comprises 80 parts by weight or less of an inorganic reinforcing agent. The polyamide resin includes an aliphatic or aromatic-aliphatic polyamide resin.

Abstract translation: 本发明提供一种具有改善的热变形温度和优异的物理性能的聚酰胺树脂组合物，并且可用于需要塑料树脂高耐热性的电子/电气设备。 具有改进的热变形温度的聚酰胺树脂组合物包含：（A）50-99重量份的聚酰胺树脂; （B）1-50重量份聚醚砜树脂; 和（C）基于100重量份的（A）+（B）的组合重量的环氧化合物0.5-3重量份。 聚酰胺树脂组合物任选地还包含80重量份或更少的无机增强剂。 聚酰胺树脂包括脂族或芳族 - 脂族聚酰胺树脂。