IMAGE SENSOR SUBSTRATE AND IMAGE SENSOR EMPLOYING IT
    114.
    发明公开
    IMAGE SENSOR SUBSTRATE AND IMAGE SENSOR EMPLOYING IT 有权
    SUBSTREFÜREINEN BILDSENSOR UND DIESES GEBRAUCHENDER BILDSENSOR

    公开(公告)号:EP1017221A1

    公开(公告)日:2000-07-05

    申请号:EP98940659.0

    申请日:1998-08-31

    Applicant: Rohm Co., Ltd.

    Abstract: An image sensor according to the present invention includes a casing (4), a light source disposed in the casing (4) for emitting light toward an object (K) to be read, and an image sensor board (6) provided, on an obverse surface thereof, with a plurality of light receiving elements (52) for generating image signals upon receiving light reflected by the object (K). The image sensor board (6) is disposed so that the obverse surface thereof is directed inwardly of the casing (4). The substrate (6) is provided with a light shielding layer (61) for covering the reverse surface of the substrate at least entirely over a portion of the obverse surface where the plurality of light receiving elements (52) are mounted, so that disturbing external light is prevented from entering inside the casing (4).

    Abstract translation: 根据本发明的图像传感器包括壳体(4),设置在壳体(4)中以朝向要读取的物体(K)发射光的光源,以及设置在其上的图像传感器板(6) 具有多个光接收元件(52),用于在接收到由物体(K)反射的光时产生图像信号。 图像传感器板(6)被设置为使得其正面指向壳体(4)的内部。 衬底(6)设置有遮光层(61),用于至少整个地覆盖安装多个光接收元件(52)的正面的一部分上的基板的反面,使得外部干扰 防止光进入壳体(4)内部。

    반도체이미지센서
    117.
    发明授权
    반도체이미지센서 失效
    半导体图像传感器

    公开(公告)号:KR1019910000278B1

    公开(公告)日:1991-01-23

    申请号:KR1019870002958

    申请日:1987-03-30

    Abstract: A contact-type linear image sensor has two separate substrates (l2, l4) aligned adjacent to each other A linear array (D) of amorphous silicon photoelectric converting elements serving as photoelectric cells and a matrix wiring unit (28) are provided on a first substrate (l2) Driver IC chips (34, 36) are mounted on a second substrate (l4) Connection pad patterns (20a) for common cell electrodes (20) of cell groups (Dl, D2,..., Dm) and connection pad patterns (32a, 32b, 32c, 32d) for row signal lines (26) of the matrix wiring unit (28) are provided concentrically at a peripheral edge of the first substrate (l2) to be alinged along a junction edge line defined between the substrates (l2, l4). Connection pad patterns (38) for the IC chips (34, 36) are linearly aligned at a peripheral edge of the second substrate (l4) and along the substrate junction edge line to oppose the pad patterns (20a, 32a, 32b, 32c, 32d) of the first substrate (l2). A connector unit for electrically connecting the pad patterns of the first and second substrates (l2, l4) may be provided at only one position of the junction edge portion of the first and second substrates (l2, l4).

    Contact-type image sensor
    120.
    发明公开
    Contact-type image sensor 失效
    接触式图像传感器

    公开(公告)号:EP1659773A3

    公开(公告)日:2006-06-28

    申请号:EP06075424.9

    申请日:1996-12-26

    Abstract: A contact-type image sensor (20) comprises a case (21), a glass cover (22) provided on an upper surface of the case (21), a bottom substrate (23) mounted in a bottom surface of the case (21), light receiving elements (24) mounted on the bottom substrate, light emitting elements (25) for irradiating an object (D) on the glass cover (22) with light, and a rod lens array (27) for collecting the light reflected by the object (D) on the glass cover (22) onto the light receiving elements (24). The light emitting elements (25) are mounted on the bottom substrate (23). The contact-type image sensor further comprises a light guide (26) provided in the case (21) for efficiently directing the light from the light emitting elements (25) to a predetermined region (L) of the glass cover (22). The case (21) is formed with a holding groove (29) for receiving the rod lenses array (27) from above, and the light guide (26) has ends each formed with a tab (37) for pressing the rod lens array (26) from above.

    Abstract translation: 接触式图像传感器(20)包括:壳体(21);设置在壳体(21)的上表面上的玻璃盖(22);安装在壳体(21)的底表面中的底部基板(23) ),安装在底部基板上的光接收元件(24),用于用光照射玻璃盖(22)上的物体(D)的发光元件(25)以及用于收集反射光的棒状透镜阵列(27) 通过玻璃盖(22)上的物体(D)照射到光接收元件(24)上。 发光元件(25)安装在底部基板(23)上。 接触式图像传感器还包括设置在壳体(21)中的光导(26),用于有效地将来自发光元件(25)的光引导到玻璃盖(22)的预定区域(L)。 壳体21形成有用于从上方接收棒状透镜阵列27的保持槽29,并且光导26具有各自形成有用于按压棒状透镜阵列27的突片37的端部, 26)从上面。

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