中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4600 records (took 0.077 seconds)

    A PROCESS OF FORMING AN ELECTRODE INTERCONNECTION IN AN INTEGRATED MULTILAYER THIN-FILM ELECTRONIC DEVICE
    121.
    发明申请
    A PROCESS OF FORMING AN ELECTRODE INTERCONNECTION IN AN INTEGRATED MULTILAYER THIN-FILM ELECTRONIC DEVICE 审中-公开

    公开(公告)号：WO2022183239A1

    公开(公告)日：2022-09-09

    申请号：PCT/AU2022/050162

    申请日：2022-03-01

    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

    Inventor： VAK, Doojin ,  CHANTLER, Regine ,  WEERASINGHE, Hasitha

    IPC: H01L31/05 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/0256 ,  H01L31/042 ,  H01L51/00 ,  H02S40/36

    Abstract: A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first patterned coating that includes at least two spaced apart first electrode sections of adjacent unit devices; a first functional layer comprising a substantially continuous coating over the first electrode layer; and a second functional layer comprising a second patterned coating on the first functional layer comprising at least two spaced apart functional sections, each functional section positioned on the first functional layer to overlay a portion of one of the first electrode sections so to define a gap portion between adjacent functional sections that includes a portion of that first electrode section and the first functional layer; and applying a second electrode layer over the second functional layer as a third patterned coating that includes at least two spaced apart second electrode sections of adjacent unit devices, each second electrode section being positioned to overlay at least one functional section of the second functional layer and a portion of an adjoining gap portion that includes at least one portion of the first electrode section of an adjacent unit device, the third patterned coating being formed using a solution including a conductive species and at least a first solvent, wherein the first functional layer is soluble in the first solvent and the second functional layer has a low to zero solubility in the first solvent, such that application of the second electrode layer to the gap portion forms at least one electrically conductive path through the first functional layer between the first electrode and the second electrode of adjacent unit devices.

    SECURE DATA CONNECTIONS IN LOW DATA RATE NETWORKS
    123.
    发明申请
    SECURE DATA CONNECTIONS IN LOW DATA RATE NETWORKS 审中-公开

    公开(公告)号：WO2022115915A1

    公开(公告)日：2022-06-09

    申请号：PCT/AU2021/051443

    申请日：2021-12-03

    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION ,  THE BOEING COMPANY

    Inventor： PEI, Guangyu ,  LIU, Dongxi ,  NEPAL, Surya ,  LI, Nan

    IPC: H04L12/741 ,  H04L12/781 ,  H04L29/12 ,  H04W4/70

    Abstract: Methods and devices for communication between a local network and a global network. The method comprises storing mapping data for multiple hosts in the global network and for multiple hosts in the local network. The method further comprises receiving a first data packet from one of the multiple hosts in the local network. The first data packet comprises a first source address being the local network address of the host in the local network, a first destination address being the local network address of the host in the global network, and payload data. The method further comprises determining, based on the mapping data, the global network address of the host in the local network and a global network address of the host in the global network, and sending a second data packet over the global network. The second data packet comprises a second source address being the global network address of the host in the local network, a second destination address being the global network address of the host in the global network, and the payload data.

    PROCESS FOR REMOVING CYANIDE FROM A CYANIDE-BEARING AQUEOUS FLUID
    125.
    发明申请
    PROCESS FOR REMOVING CYANIDE FROM A CYANIDE-BEARING AQUEOUS FLUID 审中-公开

    公开(公告)号：WO2022087656A1

    公开(公告)日：2022-05-05

    申请号：PCT/AU2021/051239

    申请日：2021-10-25

    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

    Inventor： DAI, Xianwen ,  BREUER, Paul

    IPC: C02F1/68 ,  C02F1/42 ,  B01J41/00 ,  C22B3/42 ,  C22B11/08 ,  B01J49/07 ,  C01C3/12 ,  C22B3/20

    Abstract: The invention provides a process for removing cyanide from a cyanide-bearing aqueous fluid, the process comprising: (i) adding a solid composition comprising a first mixed-metal cyanide complex comprising copper and iron to a cyanide-bearing aqueous fluid comprising free cyanide and metal-complexed cyanide, wherein at least a portion of the first mixed-metal cyanide complex dissolves, with complexation of the copper by the free cyanide, to produce an aqueous solution comprising cyanometallates, the cyanometallates comprising copper cyanide and iron cyanide complexes derived from the first mixed-metal cyanide complex; (ii) contacting the aqueous solution with an anion-exchange absorbent to absorb the cyanometallates, thereby producing a cyanide-lean aqueous fluid; (iii) extracting the anion-exchange absorbent comprising the absorbed cyanometallates with at least one non-acidic aqueous extractant to produce an aqueous extract comprising the copper cyanide and iron cyanide complexes; and (iv) acidifying the aqueous extract to produce a precipitate comprising a second mixed-metal cyanide complex comprising copper and iron.

    APPARATUS AND METHOD FOR PREPARING METAL MATRIX COMPOSITES
    129.
    发明申请
    APPARATUS AND METHOD FOR PREPARING METAL MATRIX COMPOSITES 审中-公开

    公开(公告)号：WO2021146769A1

    公开(公告)日：2021-07-29

    申请号：PCT/AU2021/050030

    申请日：2021-01-19

    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

    Inventor： LIANG, Daniel Dong ,  YAN, Shiqin ,  KELLAM, Michael

    IPC: F27D27/00 ,  B01F7/16

    Abstract: An apparatus for mixing a metallic melt containing non-metallic particles, the apparatus comprising: a vessel for containing the metallic melt, the vessel including a sidewall and a bottom; and an impeller including: a rotor configured for submergence at or below the top surface of the metallic melt, the rotor rotatable about a substantially vertical axis, the rotor including at least two annularly spaced apart blades extending radially outwardly of the vertical axis and configured to be operated at a rate of at least 200 revolutions per minute in the metallic melt; and a surface plate which extends over and outward of the outer radius of the rotor and is positioned level with or submerged just below a top surface of the metallic melt.

    INTERFERENCE RESISTANT SOLID STATE REFERENCE ELECTRODE
    130.
    发明申请
    INTERFERENCE RESISTANT SOLID STATE REFERENCE ELECTRODE 审中-公开

    公开(公告)号：WO2021087572A1

    公开(公告)日：2021-05-14

    申请号：PCT/AU2020/051213

    申请日：2020-11-06

    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

    Inventor： MACEDO, David, Simon ,  VEPSÄLÄINEN, Mikko, Kalevi

    IPC: G01N27/30

    Abstract: The invention provides a solid state reference electrode comprising: a reference element in ionic communication with a composite, the composite comprising a water-permeable polymeric matrix loaded with a solid inorganic salt comprising a reference anion; an electrode surface for contacting an analyte; and a solid ion-exchange material located between the electrode surface and the reference element, the solid ion-exchange material comprising one or more non-interfering ions, wherein in use the solid ion-exchange material immobilises one or more interfering ions, when present in solution in the analyte, by exchange with the non-interfering ions.

Patent Agency Ranking